X-On Electronics has gained recognition as a prominent supplier of ENW89818C2JF Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ENW89818C2JF Bluetooth Modules - 802.15.1 are a product manufactured by Panasonic. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

ENW89818C2JF Panasonic

Name: ENW89818C2JF
Brand: Panasonic
SKU: ENW89818C2JF_Panasonic
Availability: OutOfStock
Rating: 5 (11 reviews)

ENW89818C2JF electronic component of Panasonic

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See Product Specifications

Part No.	ENW89818C2JF
Manufacturer:	Panasonic
Category:	Bluetooth Modules - 802.15.1
Description:	Bluetooth Class II 3.3V 0.217Mbps Automotive 24-Pin SMD T/R
Datasheet:	ENW89818C2JF Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 12.025 ea
Line Total: USD 12.02

Availability - 0

MOQ: 1 Multiples: 1
Pack Size: 1

ENW89818C2JF More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Thu. 28 Nov to Wed. 04 Dec MOQ : 1 Multiples : 1	1 : USD 21.087 10 : USD 19.1375 25 : USD 17.7445 100 : USD 16.2578 250 : USD 14.8642

0 Ship by Thu. 28 Nov to Wed. 04 Dec MOQ : 1 Multiples : 1	1 : USD 12.025

0 Ship by Thu. 28 Nov to Wed. 04 Dec MOQ : 1 Multiples : 1	1 : USD 12.025

Specifications

Manufacturer Panasonic Panasonic
Product Category Bluetooth Modules - 802.15.1 Bluetooth Modules - 802.15.1
RoHS - XON 1 1
Operating Supply Voltage 3.3 V 3.3 V
Maximum Operating Temperature 70 C 70 C
Packaging Tape And Reel Tape And Reel
Brand Panasonic Panasonic
Deleted Compliant Compliant
Mounting Surface Mount Surface Mount
Package Type SMD SMD
Pin Count 24 24
Operating Temperature Min - 20 C - 20 C
Power Class cl A ss ii cl A ss ii
Rad Hardened No No
Operating Supply Voltage Min 1.7 V 1.7 V

We are delighted to provide the ENW89818C2JF from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ENW89818C2JF and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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Additional Infomation About Product

No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 1 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information Product Specification Manufacturer Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lneburg Germany By purchase of any of the products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. Panasonic Industrial Devices Europe GmbH 2017. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. APPROVED CHECKED DESIGNED Power Electronics R&D Center Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 2 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information TABLE OF CONTENTS 1 About this document....................................................................................................................... 4 1.1 Purpose .............................................................................................................................................. 4 1.2 Revision History ................................................................................................................................. 4 1.3 Related Documents ........................................................................................................................... 5 1.4 General Information ........................................................................................................................... 5 1.5 Contact Us ......................................................................................................................................... 6 2 New PAN13x5B, PAN13x6B .......................................................................................................... 7 3 Key Features .................................................................................................................................. 8 4 Applications for the Module ............................................................................................................ 8 5 Description for the Module ............................................................................................................. 9 6 Detailed Description .....................................................................................................................10 6.1 Terminal Layout ............................................................................................................................... 10 6.2 Pin Description ................................................................................................................................. 11 6.3 Device Power Supply ....................................................................................................................... 12 6.4 Clock Inputs ..................................................................................................................................... 14 7 Bluetooth Features .......................................................................................................................14 8 Block Diagram ..............................................................................................................................15 9 Test Conditions ............................................................................................................................16 10 General Device Requirements and Operation .............................................................................16 10.1 Absolute Maximum Ratings ............................................................................................................. 16 10.2 Recommended Operating Conditions .............................................................................................. 17 10.3 Current Consumption ....................................................................................................................... 17 10.4 General Electrical Characteristics .................................................................................................... 18 10.5 nSHUTD Requirements ................................................................................................................... 18 10.6 External Digital Slow Clock Requirements ....................................................................................... 18 11 Host Controller Interface ..............................................................................................................19 12 Audio/Voice Codec Interface ........................................................................................................20 12.1 PCM Hardware Interface .................................................................................................................. 20 12.2 Data Format ..................................................................................................................................... 20 12.3 Frame Idle Period ............................................................................................................................ 21 12.4 Clock-Edge Operation ...................................................................................................................... 21 12.5 Two-Channel PCM Bus Example ..................................................................................................... 22 12.6 Audio Encoding ................................................................................................................................ 22 12.7 Improved Algorithm For Lost Packets .............................................................................................. 22 12.8 Bluetooth/PCM Clock Mismatch Handling........................................................................................ 23 12.9 Bluetooth Inter-IC Sound (I2S) ......................................................................................................... 23 12.10 Current Consumption for Different Bluetooth Scenarios .................................................................. 23 13 Bluetooth RF Performance ...........................................................................................................24 14 Soldering Temperature-Time Profile (for reflow soldering) ..........................................................27 14.1 For leadfree solder ........................................................................................................................... 27 15 Module Dimension ........................................................................................................................28 15.1 Module Dimensions PAN131X without Antenna .............................................................................. 28 15.2 Module Dimensions PAN132X with Antenna ................................................................................... 29 16 Footprint of the Module ................................................................................................................30 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

Aromat may also be referenced as

PA4
PAB
PAN
Panasonic - BSG
Panasonic - ECG
Panasonic - SSG
PANASONIC / SUNX
PANASONIC ACCESSORIES
PANASONIC BATTERIES
PANASONIC BATTERY
Panasonic Electric W
Panasonic Electric Works
Panasonic Electronic Components
Panasonic Electronic Components - Semiconductor Products
PANASONIC EW / AROMAT
PANASONIC EW/AROMAT
PANASONIC IMD
PANASONIC IND DEVICES (PIDSA)
Panasonic Industrial Automation Sales
Panasonic Industrial Devices
PANASONIC PIDSMY
Panasonic Semiconductors
PB4

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