X-On Electronics has gained recognition as a prominent supplier of ENW-89820A3KF Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ENW-89820A3KF Bluetooth Modules - 802.15.1 are a product manufactured by Panasonic. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

ENW-89820A3KF Panasonic

ENW-89820A3KF electronic component of Panasonic
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Part No.ENW-89820A3KF
Manufacturer: Panasonic
Category: Bluetooth Modules - 802.15.1
Description: Bluetooth Modules (802.15.1) PAN1720 CC2540 BLE 8051 Ctrlr BR FW
Datasheet: ENW-89820A3KF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
25: USD 13.05 ea
Line Total: USD 326.25 
Availability - 485
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ: 25  Multiples: 25
Pack Size: 25
Availability Price Quantity
485
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 25
Multiples : 25
25 : USD 13.05
50 : USD 11.9375
100 : USD 11.575
250 : USD 11.2125
500 : USD 11.1125
1000 : USD 11.05
2500 : USD 11

485
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 25
Multiples : 25
25 : USD 17.6436
50 : USD 16.1395
100 : USD 15.6494
250 : USD 15.1593
500 : USD 15.0241

   
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We are delighted to provide the ENW-89820A3KF from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ENW-89820A3KF and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-17xx-2400-102 2.13 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 1 of 37 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 08.07.2015 PAN172x / PAN171x ENW89820AxKF / ENW89835AxKF Product Specification Applicant / Manufacturer Panasonic Industrial Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 Lneburg Germany Applicant / Manufacturer Please refer to chapter 24 / 24.1 Information regarding Software Versions Software Software Version Please refer to chapter 24 / 24.1 Information regarding Software Versions By purchase of any of products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification. APPROVED CHECKED DESIGNED Power Electronics R&D Center genehmigt geprft erstellt Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-17xx-2400-102 2.13 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 2 of 37 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 08.07.2015 PAN172x / PAN171x ENW89820AxKF / ENW89835AxKF TABLE OF CONTENTS 1. Scope of this Document ................................................................................................ 4 2. Difference PAN1720 / PAN1721 .................................................................................... 4 3. Difference PAN172x / PAN171x .................................................................................... 4 4. Key Features ................................................................................................................. 4 Bluetooth Low Energy ............................................................................................................ 5 5. Applications for the Module ........................................................................................... 5 6. Description for the Module ............................................................................................. 5 7. Detailed Description ...................................................................................................... 6 7.1. PAN172x Terminal Layout ................................................................................... 6 7.2. Crossreference GPIO PAN-Module to BlueRadios-Module .................................. 8 8. Bluetooth Features ........................................................................................................ 9 9. PAN172x Block Diagram ............................................................................................... 9 10. Test Conditions ........................................................................................................... 10 11. General Device Requirements and Operation ............................................................. 10 11.1. Absolute Maximum Ratings ................................................................................ 10 11.2. Recommended Operating Conditions ................................................................. 10 11.3. PAN1720 Current Consumption ......................................................................... 11 12. Bluetooth RF Performance .......................................................................................... 12 12.1. PAN1720 Bluetooth Characteristics ................................................................... 12 12.2. PAN1721 Bluetooth Characteristics ................................................................... 12 12.3. PAN17XX Spurious Emission ............................................................................. 12 13. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 13 13.1. For lead solder ................................................................................................... 13 13.2. For leadfree solder ............................................................................................. 13 14. PAN172x Module Dimension ....................................................................................... 14 15. PAN171x Module Dimension ....................................................................................... 15 16. PAN172x FootPrint of the Module ............................................................................... 16 17. PAN171x FootPrint of the Module ............................................................................... 17 18. Case Marking .............................................................................................................. 18 18.1. Example for Marking .......................................................................................... 18 18.2. Marking Definition .............................................................................................. 18 19. Mechanical Requirements ........................................................................................... 18 20. Development of Applications ....................................................................................... 19 21. Reliability Tests ........................................................................................................... 19 22. Cautions ...................................................................................................................... 19 22.1. Design Notes ..................................................................................................... 19 22.2. Installation Notes ................................................................................................ 20 22.3. Usage Conditions Notes ..................................................................................... 20 22.4. Storage Notes .................................................................................................... 21 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de

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8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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