X-On Electronics has gained recognition as a prominent supplier of ENW-89823A3KF Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ENW-89823A3KF Bluetooth Modules - 802.15.1 are a product manufactured by Panasonic. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

ENW-89823A3KF Panasonic

ENW-89823A3KF electronic component of Panasonic
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Part No.ENW-89823A3KF
Manufacturer: Panasonic
Category: Bluetooth Modules - 802.15.1
Description: Bluetooth Modules (802.15.1) PAN1326B CC2564B+BLE HCI Module +85
Datasheet: ENW-89823A3KF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 13.057 ea
Line Total: USD 13.06 
Availability - 731
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1

 ENW-89823A3KF More Buying Options & Price Grid(s)

Availability Price Quantity
1746
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 25
Multiples : 25
25 : USD 10.6
50 : USD 10.375
100 : USD 10.225
250 : USD 10.075
500 : USD 9.9125
1000 : USD 9.775
2500 : USD 9.625

324
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 1
Multiples : 1
1 : USD 15.6
10 : USD 15.4115
25 : USD 15.223
100 : USD 15.0345
250 : USD 14.846

39285
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 500
Multiples : 500
500 : USD 12.4356
1000 : USD 12.0138

16490
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 9
Multiples : 1
9 : USD 14.6991
10 : USD 13.9061
25 : USD 12.0653
100 : USD 11.7572
250 : USD 11.3815
500 : USD 10.5222
1000 : USD 10.166

4365
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 500
Multiples : 500
500 : USD 9.607

731
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 13.057
10 : USD 12.353
25 : USD 10.494
100 : USD 10.131
250 : USD 9.735
500 : USD 9.339
5000 : USD 9.262

1746
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 25
Multiples : 25
25 : USD 13.5251
50 : USD 13.0075
100 : USD 12.6
250 : USD 12.3098
500 : USD 11.8106

324
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 1
Multiples : 1
1 : USD 15.5761
10 : USD 15.3934
25 : USD 15.2107
100 : USD 15.0293
250 : USD 14.8466

39285
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 500
Multiples : 500
500 : USD 9.983

16490
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 1
Multiples : 1
1 : USD 14.6992

Specifications

   
Manufacturer
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RoHS - XON
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We are delighted to provide the ENW-89823A3KF from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ENW-89823A3KF and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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Additional Infomation About Product

No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 1 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information Product Specification Manufacturer Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lneburg Germany By purchase of any of the products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. Panasonic Industrial Devices Europe GmbH 2017. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. APPROVED CHECKED DESIGNED Power Electronics R&D Center Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 2 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information TABLE OF CONTENTS 1 About this document....................................................................................................................... 4 1.1 Purpose .............................................................................................................................................. 4 1.2 Revision History ................................................................................................................................. 4 1.3 Related Documents ........................................................................................................................... 5 1.4 General Information ........................................................................................................................... 5 1.5 Contact Us ......................................................................................................................................... 6 2 New PAN13x5B, PAN13x6B .......................................................................................................... 7 3 Key Features .................................................................................................................................. 8 4 Applications for the Module ............................................................................................................ 8 5 Description for the Module ............................................................................................................. 9 6 Detailed Description .....................................................................................................................10 6.1 Terminal Layout ............................................................................................................................... 10 6.2 Pin Description ................................................................................................................................. 11 6.3 Device Power Supply ....................................................................................................................... 12 6.4 Clock Inputs ..................................................................................................................................... 14 7 Bluetooth Features .......................................................................................................................14 8 Block Diagram ..............................................................................................................................15 9 Test Conditions ............................................................................................................................16 10 General Device Requirements and Operation .............................................................................16 10.1 Absolute Maximum Ratings ............................................................................................................. 16 10.2 Recommended Operating Conditions .............................................................................................. 17 10.3 Current Consumption ....................................................................................................................... 17 10.4 General Electrical Characteristics .................................................................................................... 18 10.5 nSHUTD Requirements ................................................................................................................... 18 10.6 External Digital Slow Clock Requirements ....................................................................................... 18 11 Host Controller Interface ..............................................................................................................19 12 Audio/Voice Codec Interface ........................................................................................................20 12.1 PCM Hardware Interface .................................................................................................................. 20 12.2 Data Format ..................................................................................................................................... 20 12.3 Frame Idle Period ............................................................................................................................ 21 12.4 Clock-Edge Operation ...................................................................................................................... 21 12.5 Two-Channel PCM Bus Example ..................................................................................................... 22 12.6 Audio Encoding ................................................................................................................................ 22 12.7 Improved Algorithm For Lost Packets .............................................................................................. 22 12.8 Bluetooth/PCM Clock Mismatch Handling........................................................................................ 23 12.9 Bluetooth Inter-IC Sound (I2S) ......................................................................................................... 23 12.10 Current Consumption for Different Bluetooth Scenarios .................................................................. 23 13 Bluetooth RF Performance ...........................................................................................................24 14 Soldering Temperature-Time Profile (for reflow soldering) ..........................................................27 14.1 For leadfree solder ........................................................................................................................... 27 15 Module Dimension ........................................................................................................................28 15.1 Module Dimensions PAN131X without Antenna .............................................................................. 28 15.2 Module Dimensions PAN132X with Antenna ................................................................................... 29 16 Footprint of the Module ................................................................................................................30 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

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PANASONIC IMD
PANASONIC IND DEVICES (PIDSA)
Panasonic Industrial Automation Sales
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PB4

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