X-On Electronics has gained recognition as a prominent supplier of ENW-89823A3KF Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ENW-89823A3KF Bluetooth Modules - 802.15.1 are a product manufactured by Panasonic. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

ENW-89823A3KF Panasonic

ENW-89823A3KF electronic component of Panasonic
ENW-89823A3KF Panasonic
ENW-89823A3KF Bluetooth Modules - 802.15.1
ENW-89823A3KF  Embedded Solutions

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See Product Specifications
Part No. ENW-89823A3KF
Manufacturer: Panasonic
Category: Bluetooth Modules - 802.15.1
Description: Bluetooth Modules (802.15.1) PAN1326B CC2564B+BLE HCI Module +85
Datasheet: ENW-89823A3KF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
500: USD 4.8463 ea
Line Total: USD 2423.15 
Availability - 39285
Ship by Tue. 29 Apr to Mon. 05 May
MOQ: 500  Multiples: 500
Pack Size: 500
Availability Price Quantity
1713
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 25
Multiples : 25
25 : USD 10.4165
50 : USD 10.2098
100 : USD 10.0547
250 : USD 9.9642
500 : USD 9.8608
1000 : USD 9.8091
2500 : USD 9.7574

324
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 5
Multiples : 1
5 : USD 14.2779
10 : USD 13.1469
25 : USD 12.9051
100 : USD 12.1763
250 : USD 11.9437

39285
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 500
Multiples : 500
500 : USD 4.8463

16490
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 11
Multiples : 1
11 : USD 11.622
25 : USD 10.8667
100 : USD 9.9775
500 : USD 9.6925

2910
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 500
Multiples : 500
500 : USD 10.166

711
Ship by Fri. 25 Apr to Tue. 29 Apr
MOQ : 1
Multiples : 1
1 : USD 13.836
10 : USD 11.649
25 : USD 10.241
100 : USD 9.746
250 : USD 9.515
500 : USD 9.13

1697
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 25
Multiples : 25
25 : USD 13.6214
50 : USD 12.8375
100 : USD 12.6425
250 : USD 12.5287
500 : USD 12.3987

324
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 5
Multiples : 1
5 : USD 13.6006
10 : USD 12.8154
25 : USD 12.5125
100 : USD 11.74
250 : USD 11.45

39285
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 500
Multiples : 500
500 : USD 4.8463

16490
Ship by Tue. 29 Apr to Mon. 05 May
MOQ : 11
Multiples : 1
11 : USD 11.3165

   
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We are delighted to provide the ENW-89823A3KF from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ENW-89823A3KF and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 1 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information Product Specification Manufacturer Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lneburg Germany By purchase of any of the products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. Panasonic Industrial Devices Europe GmbH 2017. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. APPROVED CHECKED DESIGNED Power Electronics R&D Center Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 2 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information TABLE OF CONTENTS 1 About this document....................................................................................................................... 4 1.1 Purpose .............................................................................................................................................. 4 1.2 Revision History ................................................................................................................................. 4 1.3 Related Documents ........................................................................................................................... 5 1.4 General Information ........................................................................................................................... 5 1.5 Contact Us ......................................................................................................................................... 6 2 New PAN13x5B, PAN13x6B .......................................................................................................... 7 3 Key Features .................................................................................................................................. 8 4 Applications for the Module ............................................................................................................ 8 5 Description for the Module ............................................................................................................. 9 6 Detailed Description .....................................................................................................................10 6.1 Terminal Layout ............................................................................................................................... 10 6.2 Pin Description ................................................................................................................................. 11 6.3 Device Power Supply ....................................................................................................................... 12 6.4 Clock Inputs ..................................................................................................................................... 14 7 Bluetooth Features .......................................................................................................................14 8 Block Diagram ..............................................................................................................................15 9 Test Conditions ............................................................................................................................16 10 General Device Requirements and Operation .............................................................................16 10.1 Absolute Maximum Ratings ............................................................................................................. 16 10.2 Recommended Operating Conditions .............................................................................................. 17 10.3 Current Consumption ....................................................................................................................... 17 10.4 General Electrical Characteristics .................................................................................................... 18 10.5 nSHUTD Requirements ................................................................................................................... 18 10.6 External Digital Slow Clock Requirements ....................................................................................... 18 11 Host Controller Interface ..............................................................................................................19 12 Audio/Voice Codec Interface ........................................................................................................20 12.1 PCM Hardware Interface .................................................................................................................. 20 12.2 Data Format ..................................................................................................................................... 20 12.3 Frame Idle Period ............................................................................................................................ 21 12.4 Clock-Edge Operation ...................................................................................................................... 21 12.5 Two-Channel PCM Bus Example ..................................................................................................... 22 12.6 Audio Encoding ................................................................................................................................ 22 12.7 Improved Algorithm For Lost Packets .............................................................................................. 22 12.8 Bluetooth/PCM Clock Mismatch Handling........................................................................................ 23 12.9 Bluetooth Inter-IC Sound (I2S) ......................................................................................................... 23 12.10 Current Consumption for Different Bluetooth Scenarios .................................................................. 23 13 Bluetooth RF Performance ...........................................................................................................24 14 Soldering Temperature-Time Profile (for reflow soldering) ..........................................................27 14.1 For leadfree solder ........................................................................................................................... 27 15 Module Dimension ........................................................................................................................28 15.1 Module Dimensions PAN131X without Antenna .............................................................................. 28 15.2 Module Dimensions PAN132X with Antenna ................................................................................... 29 16 Footprint of the Module ................................................................................................................30 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de

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8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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