X-On Electronics has gained recognition as a prominent supplier of ENW89835C3KF Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ENW89835C3KF Bluetooth Modules - 802.15.1 are a product manufactured by Panasonic. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

ENW89835C3KF Panasonic

ENW89835C3KF electronic component of Panasonic
ENW89835C3KF Panasonic
ENW89835C3KF Bluetooth Modules - 802.15.1
ENW89835C3KF  Embedded Solutions

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Part No. ENW89835C3KF
Manufacturer: Panasonic
Category: Bluetooth Modules - 802.15.1
Description: Bluetooth Modules (802.15.1) BLE PAN1711 CC2541 I2C BR FW no Ant
Datasheet: ENW89835C3KF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
24: USD 2.7873 ea
Line Total: USD 66.9 
Availability - 485
Ship by Fri. 07 Mar to Thu. 13 Mar
MOQ: 24  Multiples: 1
Pack Size: 1
Availability Price Quantity
485
Ship by Fri. 07 Mar to Thu. 13 Mar
MOQ : 24
Multiples : 1
24 : USD 2.7873
25 : USD 2.745
25 : USD 2.7013
50 : USD 2.659
100 : USD 2.6153
250 : USD 2.474
500 : USD 2.4321

   
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RoHS - XON
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We are delighted to provide the ENW89835C3KF from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ENW89835C3KF and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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PAN1720/1721 Bluetooth Low Energy Module Product Specification Rev. 2.4 Wireless Modules PAN1720/1721 Bluetooth Module Overview Features The PAN1720/1721 is a Low Energy (LE) Surface mount type 15.6mm x 8.7mm x 1.8 mm module with Texas Instruments PAN1720: Up to 4.0 dBm Tx power (typical) with CC2540/CC2541 Single Chip Bluetooth LE transmit power control solution inside. PAN1721: CC2541 has typically 0 dBm Tx power Texas Instruments CC2540/CC2541 Single Chip Characteristics Bluetooth LE solution inside Bluetooth 4.0 High performance low power 8051 Microcontroller core Output power 4 dBm to -24 dBm No external components needed High sensitivity (-94 dBm typ.) Fast Connection Setup Link budget 96dB Internal crystal oscillator (32 MHz) Operating temperature range -40 C to +85 C Internal 32 kHz crystal oscillator for Sleep Timer Two powerful USARTs PAN1720 VS PAN1721 UART, USB or I2C interface The PAN171x are the non antenna version Powerful five channel DMA where the PAN172x are the versions with Latest Profiles included e.g. battery monitor and antenna. temperature sensor Integrated shielding to resist EMI Manufactured in conformance with RoHS Block Diagram Vcc 3.3 V PAN171x Crystal Bluetooth 4.0 Module 32.768 kHz Bluetooth LE UART/SPI USB or I2C Crystal 32 MHz GPIOs TI ADC/PWM/Timer CC254x Reset LPF RF-PAD Product Specification Rev. 2.4 Page 2

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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