PAN1760A Bluetooth Low Energy Module Product Specification Rev. 1.7 Wireless Modules PAN1760A Bluetooth Module Overview Bluetooth The PAN1760A is Panasonics next generation GAP central and peripheral support for LE Bluetooth module with the industrys lowest power GATT, SMP, and SDB support for LE Bluetooth Low Energy (LE) SoC. Over-the-Air firmware update Support for Scatternet network Features Bluetooth 4.2 secure connections support through Small 15.6 mm x 8.7 mm x 1.9 mm SMD module Elliptic-Curve-DH Cryptography Same form factor and pinout as PAN1026, AES128 hardware encryption (FIPS-approved) PAN1760, and PAN1761 Frequent changing of device address (improved Bluetooth LE 4.2 compliant privacy, reduced tracking ability) Embedded 256 kB flash memory and 192 kB Larger packet sizes (more efficient application and internal RAM network layer security) 83 kB RAM available for user application Characteristics AT Command mode, Host mode, Stand-Alone mode Receiver sensitivity -93 dBm typ. Standard SIG Bluetooth LE profiles as well as Output power 0 dBm maximum setting SPP over Bluetooth LE profile Power supply 1.8 V to 3.6 V single operation UART (2x), SPI & I2C interface, PWM output (4x), voltage ADC (5 ext, 1 int), 17 programmable I/O Transmit and receive 3.3 mA Tx/Rx peak power ARM Cortex -M0 processor with Single Wire consumption Debug (SWD) interface Low Power 50 nA Deep Sleep mode Operating temperature range -40 C to +85 C Block Diagram Vcc 3.3 V PAN1760A Slow Clock Bluetooth 4.2 Module 32 KHz UART Crystal 26 MHz GPIOs Chip Antenna SWD DC-DC Toshiba Conversion Host Wake up TC35678 Wake up Flash 256 kB LPF Reset Product Specification Rev. 1.7 Page 2