RClamp0516P
Low Capacitance RClamp
6-Line ESD protection
PROTECTION PRODUCTS PRELIMINARY
PROTECTION PRODUCTS - RailClamp
Features
Description
RClamp 0516P provides ESD protection for high-speed
ESD protection for high-speed data lines to
data interfaces. It features a maximum ESD withstand
IEC 61000-4-2 (ESD) 15kV (air), 15kV (contact)
voltage of 15kV contact and 15kV air discharge per
IEC 61000-4-5 (Lightning) 4A (8/20 s)
IEC 61000-4-2. RClamp0516P is designed to minimize
IEC 61000-4-4 (EFT) 40A (5/50ns)
both the ESD peak clamping and the TLP clamping.
Package design optimized for high speed lines
Package inductance is reduced at each pin resulting in
Flow-Through design
lower peak ESD clamping voltage. The dynamic resis-
Protects six high-speed lines
tance is extremely low at 0.20 Ohms (typical). Maxi-
Low capacitance: 0.65pF Maximum (I/O to Ground)
mum capacitance on each line to ground is 0.65pF
Low ESD clamping voltage
allowing the RClamp0516P to be used in applications
Low dynamic resistance: 0.20 Ohms (Typical)
operating in excess of 5GHz without appreciable signal
Solid-state silicon-avalanche technology
attenuation. Each device will protect up to six lines
(three high-speed pairs).
Mechanical Characteristics
RClamp0516P is in an 8-pin SLP3313P6 package mea-
SLP3313P6 8-pin package (3.3 x 1.3 x 0.575mm)
suring 3.3 x 1.3mm with a nominal height of 0.575mm.
Pb-Free, Halogen Free, RoHS/WEEE Compliant
The leads have a nominal pin-to-pin pitch of 0.50mm.
Flow- through package design simplifies PCB layout and
Lead Pitch: 0.5mm
maintains signal integrity on high-speed lines.
Lead finish: NiPdAu
The combination of low peak ESD clamping, low dynamic
Marking: Marking Code
resistance, and innovative package design enables this
Packaging: Tape and Reel
device to provide the highest level of ESD protection for
Applications
applications such as USB 3.0, HDMI 1.4, and MDDI /
mipi interfaces.
USB 3.0
HDMI 1.4
uSD Card Interfaces
MMC Card Interfaces
MDDI / mipi Interfaces
Circuit Diagram Pin Configuration
I/O 1
I/O
8
GND
I/O
Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6
I/O
7
GND
I/O
Pin 7, 8
I/O 6
6-Line Protection Top View
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Revision 7/16/2015 1RClamp0516P
PROTECTION PRODUCTS PRELIMINARY
Absolute Maximum Rating
Rlating Seymbo Vsalu Unit
1
Peak Pulse Current (tp = 8/20s) I 4A
PP
2
ESD per IEC 61000-4-2 (Air) V +/- 15 kV
ESD
2
ESD per IEC 61000-4-2 (Contact) +/- 15
EVSD Per ANSI/ESD/JEDEC JS-001-2011 (HBM) +V/- 24 k
ESD
OTperating Temperature -C55 to +125
J
STtorage Temperature -C55 to +150
STG
o
Electrical Characteristics (T=25 C)
Plarameter SsymboCmondition MlinimuTmypicaMsaximu Unit
RVeverse Stand-Off VoltageA5ny I/O to GND V
RWM
BVreakdown Voltage I=010mA 60. 80. 1V0.
BR BR
5
Holding Current I V = V 6002A0 m
H H
o
RIeverse Leakage Current V = 5V, T=25 C 05.01 0A.0
R RWM
Any I/O to GND
3,5
ESD Clamping Voltage V I = 4A, 4V
C PP
tlp = 0.2/100ns
3,5
ESD Clamping Voltage V I = 16A, 6V.5
C PP
tlp = 0.2/100ns
Dynamic Resistance Rt0lp = 0.2/100ns 0s.2 Ohm
D
3,4,5
(Positive)
JCunction Capacitance V = 0V, f = 1MHz, 05.62 0F.6 p
j R
Any I/O to GND
Notes
1)measured using 1.2/50us, 8/20us combination waveform, 8 Ohm source impedance.
2)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD
ground plane.
3)Transmission Line Pulse Test (TLP) Settings: t = 100ns, t = 0.2ns, I and V averaging window: t = 70ns to t = 90ns.
p r TLP TLP 1 2
4)Dynamic resistance calculated from I = 4A to I = 16A
TLP TLP
5)Guaranteed by design. Not production tested
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2015 Semtech Corporation 2