uClamp3324P Low Voltage TVS for ESD Protection TM PROTECTION PRODUCTS - MicroClampPROTECTION PRODUCTS Features Description TM The Clamp series of TVS arrays are designed to Transient protection for data lines to protect sensitive electronics from damage or latch-up IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) due to ESD, lightning, and other voltage-induced IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) transient events. Each device will protect up to four Small package for use in portable electronics lines operating at 3.3 volts. Protects four I/O Working voltage: 3.3V TM The Clamp 3324P is a solid-state device designed Flow thru design for easy layout specifically for transient suppression. It is constructed Low leakage current using Semtechs proprietary EPD process technology. Low operating and clamping voltages The EPD process provides low standoff voltages with Solid-state silicon-avalanche technology significant reductions in leakage currents and capaci- tance over traditional pn junction processes. They offer Mechanical Characteristics desirable characteristics for board level protection including fast response time, low clamping voltage and SLP2116P8 package no device degradation. RoHs Compliant Nominal Dimensions: 2.1 x 1.6 x 0.58 mm The Clamp3324P may be used to meet the immunity Lead Pitch: 0.5mm requirements of IEC 61000-4-2, level 4 (15kV air, Lead Finish: NiPd 8kV contact discharge). The flow-thru design of the Marking : Orientation Mark and Marking Code device results in enhanced ESD performance due to Packaging : Tape and Reel per EIA 481 reduced board trace inductance. The result is lower clamping voltage and a higher level of protection when Applications compared to conventional TVS devices. Cellular Handsets & Accessories Personal Digital Assistants (PDAs) The Clamp3324P is in an 8-pin, RoHs compliant, SLP2116P8 package. It measures 2.1 x 1.6 x Notebooks & Handhelds 0.58mm. The leads are spaced at a pitch of 0.5mm Portable Instrumentation and are finished with lead-free NiPd. The small pack- Digital Cameras age makes it ideal for use in portable electronics such Peripherals as cell phones, digital still cameras, and notebook MP3 Players computers. Circuit Diagram Package 2.10 1238 7645 1 2 1.60 0.50 BSC 0.58 GND Device Schematic 8 Pin SLP package (Bottom Side View) 2.1 x 1.6 x 0.58mm (Nominal) www.semtech.com Revision 01/05/2005 1uClamp3324P PROTECTION PRODUCTS Absolute Maximum Rating Rlating Seymbo Vsalu Unit PPeak Pulse Power (tp = 8/20s) 4s0 Watt pk M)aximum Peak Pulse Current (tIp = 8/20s 5sAmp pp ESD per IEC 61000-4-2 (Air) V +/- 20 kV PP ESD per IEC 61000-4-2 (Contact) +/- 15 OTperating Temperature -C55 to +125 J STtorage Temperature -C55 to +150 STG o Electrical Characteristics (T=25 C) Plarameter SsymboCmondition MlinimuTmypicaMsaximu Unit RVeverse Stand-Off Voltage 3V.3 RWM PVunch-Through Voltage I=52A3V. PT PT SVnap-Back Voltage I=850mA2V. SB SB RIeverse Leakage Current V=53.3V 05.0 0A. R RWM CVlamping Voltage I = 1A, tp = 8/20s 5V.5 C PP Any I/O to Gnd CVlamping Voltage I = 5A, tp = 8/20s 8V.0 C PP Any I/O to Gnd RVeverse Clamping Voltage I = 1A, tp = 8/20s 2V.4 CR PP Any I/O to Gnd I/O pin to Gnd 205 3Fp JCunction Capacitance V = 0V, f = 1MHz j R I/O pin to Gnd 1F4 p V = 3.3V, f = 1MHz R www.semtech.com 2005 Semtech Corp. 2