DATA SHEET Silicon Beamless Schottky Diodes: Pairs and Quads Applications Microwave MIC assembly and automated high volume manufacturing lines Mixers Die Attach Methods Features All leadless chips are compatible with both eutectic and conductive epoxy die attach methods. Eutectic processes use Mechanically rugged design Sn/Au or Sn/Pb solder. Nonconductive die attach is Three barrier heights for optimized mixer performance recommended. Wide product range: series pair, ring, bridge, and eight-diode rings Packing Methods Use in ring or crossover designs in double balanced mixers 1. Gel pak Virtually any LO requirement can be met with choice of barrier 2. Wafer on film frame (rejects are marked with ink): height Diced, ready for pick and place 100% DC tested on water Unsawn, whole wafer, 7-mil thick, maximum Available on film frame or waffle pack Wire Bonding Two methods can be used to connect wire, ribbon, or wire mesh Skyworks Green products are compliant with to the chips: all applicable legislation and are halogen-free. For additional information, refer to Skyworks Thermocompression Denition of Green, document number Ballbonding SQ04-0074. Skyworks recommends use of pure gold wire. Description Skyworks beamless diode family is designed for a high degree of Electrical and Physical Specifications device reliability in both commercial and industrial uses. The Absolute maximum ratings for the beamless Schottky diodes are diodes are designed to offer the utmost in performance as well as provided in Table 1. Electrical specifications are noted in Table 2. achieving price sensitive cost targets for commercial systems. SPICE model parameters are defined in Table 3. A typical bonding configuration is illustrated in Figure 1. Assembly and Handling Procedure The process flow for assembly is: Die attach using nonconductive epoxy Wire bond Encapsulation (nonconductive epoxy) Skyworks Solutions, Inc. Phone 781 376-3000 Fax 781 376-3100 sales skyworksinc.com www.skyworksinc.com 200793D Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice August 15, 2014 1 DATA SHEET SILICON BEAMLESS SCHOTTKY DIODES Table 1. Absolute Maximum Ratings (Note 1) Parameter Symbol Minimum Maximum Units Peak inverse voltage PIV VB Supply current IMAX 50 mA/V Power dissipation (CW) PDISS 75 mW/junction Storage temperature TSTG 65 +175 C Operating temperature TOP 65 +150 C Electrostatic discharge: ESD Human Body Model (HBM), Class 0 < 250 V Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 2. Electrical Specifications (Per Junction) (1 of 2) (Note 1) CJ (Note 2) VF VF RS VB VR = 0 V, Outline IF = 1.0 mA IF = 1.0 mA IF = 5 mA 10 A f = 1 MHz Part Number Band Barrier Drawing (mV) (mV) () (V) (pF) Number Min Max Max Min Max Max Min Ring Quad (Note 3) DMF3926-000 S Low 200 260 10 0.30 0.50 5 551-002 DME3927-000 S Medium 300 400 10 0.30 0.50 5 551-002 DMJ3928-000 S High 500 600 10 0.30 0.50 5 551-002 DMF3942-000 X Low 250 310 10 0.15 0.30 8 551-002 DME3943-000 X Medium 325 425 10 0.15 0.30 8 551-002 DMJ3944-000 X High 550 650 10 0.15 0.30 8 551-002 Bridge Quad (Note 3) DMF3929-000 S Low 200 260 10 0.30 0.50 5 2 551-004 DME3930-000 S Medium 300 400 10 0.30 0.50 5 3 551-004 DMJ3931-000 S High 500 600 10 0.30 0.50 5 4 551-004 DMF4102-000 X Low 250 310 10 0.15 0.3 14 2 551-004 DME4101-000 X Medium 325 425 10 0.15 0.3 14 3 551-004 DMJ4103-000 X High 550 650 10 0.15 0.3 14 4 551-004 Series Pair (Note 3) DMF3932-000 S Low 200 260 10 0.30 0.50 5 2 551-012 DME3933-000 S Medium 300 400 10 0.30 0.50 5 3 551-012 DMJ3934-000 S High 500 600 10 0.30 0.50 5 4 551-012 Back-to-Back Ring Series Pair (Note 3) DMF3935-000 S Low 200 260 10 0.30 0.50 5 551-056 DME3936-000 S Medium 300 400 10 0.30 0.50 5 551-056 DMJ3937-000 S High 500 600 10 0.30 0.50 5 551-056 Skyworks Solutions, Inc. Phone 781 376-3000 Fax 781 376-3100 sales skyworksinc.com www.skyworksinc.com 2 August 15, 2014 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 200793D