ICM-20948 Worlds Lowest Power 9-Axis MEMS MotionTracking Device GENERAL DESCRIPTION APPLICATIONS The ICM-20948 is the worlds lowest power 9-axis Smartphones and Tablets MotionTracking device that is ideally suited for Smartphones, Wearable Sensors Tablets, Wearable Sensors, and IoT applications. IoT Applications 3-axis gyroscope, 3-axis accelerometer, 3-axis FEATURES TM compass, and a Digital Motion Processor (DMP ) Lowest Power 9-Axis Device at 2.5 mW in a 3 mm x 3 mm x 1 mm (24-pin QFN) package 3-Axis Gyroscope with Programmable FSR of DMP offloads computation of motion processing 250 dps, 500 dps, 1000 dps, and 2000 dps algorithms from the host processor, improving 3-Axis Accelerometer with Programmable FSR of system power performance 2g, 4g, 8g, and 16g Software drivers are fully compliant with Googles 3-Axis Compass with a wide range to 4900 T latest Android release Onboard Digital Motion Processor (DMP) EIS FSYNC support Android support 2 ICM-20948 supports an auxiliary I C interface to external 2 Auxiliary I C interface for external sensors sensors, on-chip 16-bit ADCs, programmable digital filters, an On-Chip 16-bit ADCs and Programmable Filters embedded temperature sensor, and programmable 7 MHz SPI or 400 kHz Fast Mode IC interrupts. The device features an operating voltage range Digital-output temperature sensor 2 down to 1.71V. Communication ports include I C and high VDD operating range of 1.71V to 3.6V speed SPI at 7 MHz. MEMS structure hermetically sealed and bonded at Note: ICM-20948 VDDIO range is 1.71V to 1.95V, different wafer level than the MPU-9250 9-axis device. RoHS and Green compliant ORDERING INFORMATION TYPICAL OPERATING CIRCUIT PART TEMP RANGE PACKAGE nCS ICM-20948 40C to +85C 24-Pin QFN SCLK Denotes RoHS and Green-Compliant Package SDI BLOCK DIAGRAM GND NC 1 18 NC 2 17 NC NC 3 16 NC ICM-20948 NC 4 15 NC 5 14 NC NC 6 VDD 13 NC 1.71 3.6VDC C2, 0.1 F 1.71 1.95VDC C1, 0.1 F C3, 0.1 F SDO TDK Corporation InvenSense reserves the right to change the detail Document Number: DS-000189 1745 Technology Drive, San Jose, CA 95110 U.S.A specifications as may be required to permit Revision: 1.3 +1(408) 9887339 improvements in the design of its products. Release Date: 06/02/2017 www.invensense.com AUX CL SDA / SDI 24 7 SCL / SCLK VDDIO 23 8 nCS SDO / AD0 22 9 AUX DA REGOUT 21 10 RESV FSYNC 20 11 INT1 12 19 RESVICM-20948 TABLE OF CONTENTS GENERAL DESCRIPTION ......................................................................................................................................................... 1 ORDERING INFORMATION ..................................................................................................................................................... 1 BLOCK DIAGRAM ................................................................................................................................................................. 1 APPLICATIONS ..................................................................................................................................................................... 1 FEATURES .......................................................................................................................................................................... 1 TYPICAL OPERATING CIRCUIT ................................................................................................................................................. 1 1 GENERAL DESCRIPTION ........................................................................................................................................ 9 1.1 PURPOSE AND SCOPE ............................................................................................................................................... 9 1.2 PRODUCT OVERVIEW ............................................................................................................................................... 9 1.3 APPLICATIONS ......................................................................................................................................................... 9 2 FEATURES .......................................................................................................................................................... 10 2.1 GYROSCOPE FEATURES ........................................................................................................................................... 10 2.2 ACCELEROMETER FEATURES ..................................................................................................................................... 10 2.3 MAGNETOMETER FEATURES .................................................................................................................................... 10 2.4 DMP FEATURES .................................................................................................................................................... 10 2.5 ADDITIONAL FEATURES ........................................................................................................................................... 10 3 ELECTRICAL CHARACTERISTICS ........................................................................................................................... 11 3.1 GYROSCOPE SPECIFICATIONS .................................................................................................................................... 11 3.2 ACCELEROMETER SPECIFICATIONS ............................................................................................................................. 12 3.3 MAGNETOMETER SPECIFICATIONS ............................................................................................................................ 13 3.4 ELECTRICAL SPECIFICATIONS..................................................................................................................................... 13 D.C. Electrical Characteristics ................................................................................................................................... 13 A.C. Electrical Characteristics ................................................................................................................................... 14 Other Electrical Specifications .................................................................................................................................. 15 2 3.5 I C TIMING CHARACTERIZATION ............................................................................................................................... 16 3.6 SPI TIMING CHARACTERIZATION ............................................................................................................................... 17 3.7 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................... 18 4 APPLICATIONS INFORMATION ........................................................................................................................... 19 4.1 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION ............................................................................................................ 19 4.2 TYPICAL OPERATING CIRCUIT ................................................................................................................................... 20 4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................................................... 20 4.4 EXPOSED DIE PAD PRECAUTIONS .............................................................................................................................. 20 4.5 BLOCK DIAGRAM ................................................................................................................................................... 21 4.6 OVERVIEW ........................................................................................................................................................... 21 4.7 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ............................................................ 22 4.8 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ...................................................... 22 4.9 THREE-AXIS MEMS MAGNETOMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ..................................................... 22 4.10 DIGITAL MOTION PROCESSOR .................................................................................................................................. 22 2 4.11 PRIMARY I C AND SPI SERIAL COMMUNICATIONS INTERFACES ....................................................................................... 22 2 ICM-20948 Solution Using I C Interface.................................................................................................................... 22 ICM-20948 Solution Using SPI Interface ................................................................................................................... 23 2 4.12 AUXILIARY I C SERIAL INTERFACE .............................................................................................................................. 24 4.13 SELF-TEST ............................................................................................................................................................ 24 4.14 CLOCKING ............................................................................................................................................................ 25 4.15 SENSOR DATA REGISTERS ........................................................................................................................................ 25 Document Number: DS-000189 Page 2 of 89 Revision: 1.3