HDMIULC6-2x6 Ultra large bandwidth ESD protection Features 2-line ESD protection (at 15 kV air and contact discharge, exceeds IEC 61000-4-2) Ultra low capacitance: 0.6 pF 825 MHz QFN (pin view) SOT-666 Ultra high bandwidth - no influence on signal HDMIULC6-2M6 HDMIULC6-2P6 rise and fall times - maximised number of signal harmonics Very low leakage current: 0.5 A max. Complies with these standards Fast response time compared with varistors Protects V when applicable IEC 61000-4-2 level 4 BUS 15 kV air discharge RoHS compliant 8 kV contact discharge Benefits MIL STD883G-Method 3015-7 ESD standards compliance guaranteed at device level, thus greater immunity at system Applications level HDMI ports at 1.65 Gb/s and up to 3.2 Gb/s ESD protection of V when applicable. BUS IEEE 1394a, b, or c up to 3.2 Gb/s High efficiency due to low residual voltage when confronted by an ESD surge USB 2.0 ports up to 480 Mb/s (Hi-Speed) Large bandwidth to minimize impact on data Ethernet port: 10/100/1000 Mb/s signal quality Video line protection Consistent D+ / D- signal balance: Ultra low impact on intra- and inter-pair Description skew The HDMIULC6-2x6 is a monolithic, application Matching high bit rate HDMI requirements specific discrete device dedicated to ESD and ready for future evolution protection of the HDMI connection. It also offers 2 Low PCB space occupation - 1.45 mm the same high level of protection for IEEE 1394a for QFN and IEEE 1394b/c, USB 2.0, Ethernet links, and Low leakage current for longer operation of video lines. battery powered devices Its ultra high cutoff frequency (5.9 GHz) secures a Higher reliability offered by monolithic high level of signal integrity. The device topology integration provides this integrity without compromising the complete protection of ICs against the most 500 m pitch for QFN 6 leads stringent ESD strikes. May 2008 Rev 1 1/17 www.st.comCharacteristics HDMIULC6-2x6 1 Characteristics Figure 1. Functional diagram 116 I/O1 1 6 I/O1 I/O1 I/O1 GND 2 5 VBUS GND 2 5 V BUS I/O2 3 4 I/O2 I/O2 3 4 I/O2 QFN 6 leads SOT666 When used with a HDMI application, Pin 5 should not be connected to protect against backdrive current flow on data lines. Table 1. Absolute ratings Symbol Parameter Value Unit IEC 61000-4-2 air discharge 15 V Peak pulse voltage IEC 61000-4-2 contact discharge 15 kV PP MIL STD883G-Method 3015-7 25 T Storage temperature range -55 to +150 C stg T Maximum junction temperature 125 C j T Lead solder temperature (10 seconds duration) 260 C L Table 2. Electrical characteristics (T = 25 C) amb Value Symbol Parameter Test Conditions Unit Min. Typ. Max I Leakage current V = 5 V 0.5 A RM RM Breakdown voltage between V BUS V I = 1 mA 6 V BR R and GND I = 1 A, t = 8/20 s PP p 12 V Any I/O pin to GND V Clamping voltage CL I = 5 A, t = 8/20 s PP p 17 V Any I/O pin to GND C Capacitance between I/O and GND V = 0 V, F = 825 MHz 0.85 pF i/o-GND R Capacitance variation between I/O C V = 0 V, F = 1 MHz 0.02 pF i/o-GND R and GND C Capacitance between I/O V = 0 V, F = 825 MHz 0.5 pF i/o-i/o R 2/17