Product Information

SPBT3.0DP1

SPBT3.0DP1 electronic component of STMicroelectronics

Datasheet
Bluetooth Modules - 802.15.1 Bluetooth Technology Class1 - iAP2
Manufacturer: STMicroelectronics
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

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Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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SPBT3.0DP1
STMicroelectronics

1 : USD 27.1449
10 : USD 25.538
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1

Stock Image

SPBT3.0DP1
STMicroelectronics

1 : USD 19.0436
10 : USD 17.5121
25 : USD 16.7845
100 : USD 16.6079
250 : USD 16.6079
500 : USD 16.174
1000 : USD 14.8362
2500 : USD 13.3899
N/A

Obsolete

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Protocol
Class
Interface Type
Output Power
Data Rate
Frequency
Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Dimensions
Sensitivity
Brand
Mounting Style
Antenna Connector Type
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Version
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Additional Infomation About Product

SPBT3.0DP1 Bluetooth Classic module Datasheet - production data Embedded support for MFi iAP2 profile 128-bit encryption security Integrated antenna ST Cortex-M4 microprocessor Up to 100 MHz 512 KB Flash 128 KB RAM Supports transmission speed with SPP up to 1500 Kbit/s 14 general-purpose I/Os User interface AT command Data Package (DP) Firmware upgrade over UART EU, FCC, IC and Bluetooth qualified Features Single voltage supply: 3.3 V typical Bluetooth radio Small form factor: 15.24 x 26.9 x 2.9 mm Fully embedded Bluetooth v3.0 with Operating temperature range: -40 C to SPP and HID profiles 85 C Class 1 module Enhanced Data Rate (EDR) support Complete RF-ready module September 2017 DocID029412 Rev 2 1/35 www.st.com This is information on a product in full production. Contents SPBT3.0DP1 Contents 1 Description....................................................................................... 6 2 RoHS compliance ............................................................................ 7 3 Applications ..................................................................................... 8 4 Software architecture ...................................................................... 9 4.1 BT stack layers .................................................................................. 9 4.2 Supported profile ............................................................................. 10 4.3 AT command set: Data Package ..................................................... 10 5 Module block diagram ................................................................... 11 6 Hardware specifications ............................................................... 12 6.1 Recommended operating conditions ............................................... 12 6.2 Radio features ................................................................................. 12 6.3 Absolute maximum ratings .............................................................. 12 6.4 Current consumption ....................................................................... 12 6.5 I/O operating characteristics............................................................ 13 6.6 Pin assignment ................................................................................ 14 7 Package information ..................................................................... 16 7.1 RF module package information ..................................................... 17 8 Hardware design ........................................................................... 19 8.1 Reflow soldering .............................................................................. 19 8.2 UART interface ................................................................................ 20 8.3 GPIO interface ................................................................................ 21 8.4 Reset circuit .................................................................................... 22 8.4.1 Simple external reset circuit ............................................................. 22 8.4.2 Host controlled reset circuit .............................................................. 22 8.5 MFi co-processor interface .............................................................. 23 8.6 PCB layout guidelines ..................................................................... 24 9 Firmware upgrade ......................................................................... 26 9.1 Enter bootloader mode .................................................................... 26 9.2 Transfer the new firmware .............................................................. 26 9.3 Exit bootloader mode ...................................................................... 26 10 Regulatory compliance ................................................................. 27 10.1 FCC certification .............................................................................. 27 2/35 DocID029412 Rev 2

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

Stmicroelectronics may also be referenced as

C-Max
C-Max (VA)
SG3
ST
ST MICROELECTRONICS
ST2
ST7
STM
STMICRELECTRONICS
STN

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