X-On Electronics has gained recognition as a prominent supplier of SPBT3.0DP1 Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. SPBT3.0DP1 Bluetooth Modules - 802.15.1 are a product manufactured by STMicroelectronics. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

SPBT3.0DP1 STMicroelectronics

Name: SPBT3.0DP1
Brand: STMicroelectronics
SKU: SPBT30DP1_STMicroelectronics
Availability: OutOfStock
Rating: 5 (11 reviews)

SPBT3.0DP1 electronic component of STMicroelectronics

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Part No.	SPBT3.0DP1
Manufacturer:	STMicroelectronics
Category:	Bluetooth Modules - 802.15.1
Description:	Bluetooth Modules - 802.15.1 Bluetooth Technology Class1 - iAP2
Datasheet:	SPBT3.0DP1 Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

SPBT3.0DP1 More Buying Options & Price Grid(s)

Availability	Price	Quantity
0 MOQ : 1 Multiples : 1	1 : USD 26.2832 10 : USD 24.7273	N/A Obsolete

0 MOQ : 1 Multiples : 1	1 : USD 18.4391 10 : USD 16.9562 25 : USD 16.2516 100 : USD 16.0806 250 : USD 16.0806 500 : USD 15.6605 1000 : USD 14.3652 2500 : USD 12.9649	N/A Obsolete

We are delighted to provide the SPBT3.0DP1 from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the SPBT3.0DP1 and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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Additional Infomation About Product

SPBT3.0DP1 Bluetooth Classic module Datasheet - production data Embedded support for MFi iAP2 profile 128-bit encryption security Integrated antenna ST Cortex-M4 microprocessor Up to 100 MHz 512 KB Flash 128 KB RAM Supports transmission speed with SPP up to 1500 Kbit/s 14 general-purpose I/Os User interface AT command Data Package (DP) Firmware upgrade over UART EU, FCC, IC and Bluetooth qualified Features Single voltage supply: 3.3 V typical Bluetooth radio Small form factor: 15.24 x 26.9 x 2.9 mm Fully embedded Bluetooth v3.0 with Operating temperature range: -40 C to SPP and HID profiles 85 C Class 1 module Enhanced Data Rate (EDR) support Complete RF-ready module September 2017 DocID029412 Rev 2 1/35 www.st.com This is information on a product in full production. Contents SPBT3.0DP1 Contents 1 Description....................................................................................... 6 2 RoHS compliance ............................................................................ 7 3 Applications ..................................................................................... 8 4 Software architecture ...................................................................... 9 4.1 BT stack layers .................................................................................. 9 4.2 Supported profile ............................................................................. 10 4.3 AT command set: Data Package ..................................................... 10 5 Module block diagram ................................................................... 11 6 Hardware specifications ............................................................... 12 6.1 Recommended operating conditions ............................................... 12 6.2 Radio features ................................................................................. 12 6.3 Absolute maximum ratings .............................................................. 12 6.4 Current consumption ....................................................................... 12 6.5 I/O operating characteristics............................................................ 13 6.6 Pin assignment ................................................................................ 14 7 Package information ..................................................................... 16 7.1 RF module package information ..................................................... 17 8 Hardware design ........................................................................... 19 8.1 Reflow soldering .............................................................................. 19 8.2 UART interface ................................................................................ 20 8.3 GPIO interface ................................................................................ 21 8.4 Reset circuit .................................................................................... 22 8.4.1 Simple external reset circuit ............................................................. 22 8.4.2 Host controlled reset circuit .............................................................. 22 8.5 MFi co-processor interface .............................................................. 23 8.6 PCB layout guidelines ..................................................................... 24 9 Firmware upgrade ......................................................................... 26 9.1 Enter bootloader mode .................................................................... 26 9.2 Transfer the new firmware .............................................................. 26 9.3 Exit bootloader mode ...................................................................... 26 10 Regulatory compliance ................................................................. 27 10.1 FCC certification .............................................................................. 27 2/35 DocID029412 Rev 2

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

C-Max may also be referenced as

C-Max (VA)
SG3
ST
ST MICROELECTRONICS
ST2
ST7
STM
STMICRELECTRONICS
STN

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Manufacturer STMicroelectronics STMicroelectronics
Product Category Bluetooth Modules - 802.15.1 Bluetooth Modules - 802.15.1
RoHS - XON Y Y
Series Spbt3.0Dp1 Spbt3.0Dp1
Protocol Bluetooth 3.0 Bluetooth 3.0
Class Class 1 Class 1
Interface Type Uart Uart
Output Power 10.77 dBm 10.77 dBm
Data Rate 800 Kb/S 800 Kb/S
Frequency 2.402 GHz to 2.48 GHz 2.402 GHz to 2.48 GHz
Operating Supply Voltage 3.3 V 3.3 V
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Dimensions 15.24 Mm X 26.9 Mm X 2.9 Mm 15.24 Mm X 26.9 Mm X 2.9 Mm
Sensitivity - 88 Dbm - 88 Dbm
Brand Stmicroelectronics Stmicroelectronics
Mounting Style Smd/Smt Smd/Smt
Antenna Connector Type Internal Internal
Factory Pack Quantity : 1020 1020
Version Version 3.0 Version 3.0
Frequency Range 2.402 GHz to 2.48 GHz 2.402 GHz to 2.48 GHz
Height 2.9 mm 2.9 mm
Length 26.9 mm 26.9 mm
Product Bluetooth Modules Bluetooth Modules
Width 15.24 mm 15.24 mm
Cnhts 8543709991 8543709991
Hts Code 8517700000 8517700000
Product Type Bluetooth Modules Bluetooth Modules
Subcategory Wireless & Rf Modules Wireless & Rf Modules
Taric 8517700000 8517700000