INMP510 RF-Hardened, Ultra-Low Noise Microphone with Bottom Port and Analog Output GENERAL DESCRIPTION APPLICATIONS Smartphones and Feature Phones * The INMP510 is an RF-hardened, analog output, bottom-ported, Tablet Computers omnidirectional MEMS microphone with high performance, Teleconferencing Systems Digital Still and Video Cameras ultra-low noise, and low power. The INMP510 consists of a Bluetooth Headsets MEMS microphone element, an impedance converter, and an Notebook PCs output amplifier. The INMP510 sensitivity specification makes Security and Surveillance it an excellent choice for both near-field and far-field applications. The INMP510 is pin compatible with the INMP504 microphone. The INMP510 has a very high signal-to-noise FEATURES ratio (SNR) and extended wideband frequency response, Tiny, 3.35 2.5 0.98 mm Surface-Mount Package resulting in natural sound with high intelligibility. Low current High SNR of 65 dBA consumption enables long battery life for portable Acoustic Overload Point of 124 dB SPL applications. Extended Frequency Response from 60 Hz to 20 kHz Omnidirectional Response The INMP510 is available in a miniature 3.35 2.5 0.98 mm Sensitivity of 38 dBV surface-mount package. It is reflow solder compatible with no Sensitivity Tolerance of 2 dB sensitivity degradation. Enhanced Radio Frequency (RF) Performance *Protected by U.S. Patents 7,449,356 7,825,484 7,885,423 and 7,961,897. Low Current Consumption of 180 A Other patents are pending. Single-Ended Analog Output High PSR of 78 dBV Compatible with Sn/Pb and Pb-Free Solder Processes RoHS/WEEE Compliant FUNCTIONAL BLOCK DIAGRAM ORDERING INFORMATION PART TEMP RANGE INMP510ACEZ-R0* 40C to +85C INMP510ACEZ-R7 40C to +85C OUTPUT OUTPUT AMPLIFIER EV INMP510-FX * 13 Tape and Reel 7 Tape and reel is to be discontinued. Contact POWER sales invensense.com for availability. INMP510 VDD GND InvenSense Inc. InvenSense reserves the right to change the detail Document Number: DS-INMP510-00 1745 Technology Drive, San Jose, CA 95110 U.S.A specifications as may be required to permit Revision: 1.1 +1(408) 9887339 improvements in the design of its products. Rev Date: 05/21/2014 www.invensense.com INMP510 TABLE OF CONTENTS General Description ................................................................................................................................................. 1 Applications ............................................................................................................................................................. 1 Features ................................................................................................................................................................... 1 Functional Block Diagram ........................................................................................................................................ 1 Ordering Information ............................................................................................................................................... 1 Table of Contents ............................................................................................................................................................ 2 Specifications .................................................................................................................................................................. 3 Table 1. Electrical Characteristics ............................................................................................................................ 3 Absolute Maximum Ratings ............................................................................................................................................ 4 Table 2. Absolute Maximum Ratings ....................................................................................................................... 4 ESD Caution ............................................................................................................................................................. 4 Soldering Profile....................................................................................................................................................... 5 Table 3. Recommended Soldering Profile* .............................................................................................................. 5 Pin Configurations And Function Descriptions ............................................................................................................... 6 Table 4. Pin Function Descriptions ........................................................................................................................... 6 Typical Performance Characteristics ............................................................................................................................... 7 Applications Information ................................................................................................................................................ 8 Connecting to Audio Codecs .................................................................................................................................... 8 SUPPORTING Documents ................................................................................................................................................ 9 Evaluation Board User Guide ................................................................................................................................... 9 Application Notes (General) .................................................................................................................................... 9 Application Notes (Product Specific) ....................................................................................................................... 9 PCB Design And Land Pattern Layout ........................................................................................................................... 10 Handling Instructions .................................................................................................................................................... 11 Pick And Place Equipment ..................................................................................................................................... 11 Reflow Solder ......................................................................................................................................................... 11 Board Wash............................................................................................................................................................ 11 Outline Dimensions ....................................................................................................................................................... 12 Ordering Guide ...................................................................................................................................................... 13 Revision History ..................................................................................................................................................... 13 Compliance Declaration Disclaimer ....................................................................................................................... 14 Page 2 of 14 Document Number: DS-INMP510-00 Revision: 1.1