DATASHEET Tempo Semiconductor, Inc. PORTABLE CONSUMER CODEC TSCS454xx LOW-POWER, HIGH-FIDELITY INTEGRATED CODEC DESCRIPTION FEATURES The TSCS454xx is a low-power, high-fidelity CODEC with On-chip Class-H True Cap-less Stereo Headphone integrated fixed audio DSPs targeted to portable Driver 40 mW output power (16), < 1% THD+N applications such as portable games, personal navigation Charge-pump allows true ground centered outputs devices, and personal audio appliances. Headphone/Headset detection logic Global Headset detection logic In addition to a high-fidelity low-power CODEC, the device SNR (A-weighted no active signal) -124dB integrates a fixed audio DSP, stereo speaker amplifier, DNR (A-weighted -60db active signal) -102dB mono earpiece amplifier, and a true cap-less stereo Separate Stereo Line Outputs headphone amplifier. High-Fidelity 32-bit ADCs / DACs Beyond high-fidelity for portable systems, the device offers 1 Stereo ADC: SNR (A-weighted) 95dB an enriched audio presence through built-in audio 1 Stereo DAC: SNR (A-weighted) 124dB 1 Mono DAC: SNR (A-weighted) 124dB processing capability. 24-bit Audio Output Processing DSP Engine The device has been designed with rapid customization in Independent processing for up to five audio channels mind. Tempo is able to rapidly provide varying levels of 3D Stereo Enhancement integration, additional audio processing, according to the 12-Band Stereo Parametric Equalizers Wideband DRC needs of large markets or customers. Pro-Style, Multiband Compressor / Limiter / Expander Psychoacoustic Bass Enhancement TARGET APPLICATIONS High-frequency restoration for compressed audio UltraBook, Laptops, Slates, Tablets content Portable Audio Devices Three 32-bit I2S/LJ/RJ input ports & output ports 8kHz ~ 96kHz Fs support Portable Gaming Devices All ports can support I2S / LJ / RJ modes Personal Media Players Stereo Asynchronous Sample Rate Converters (In/Out) Multimedia handsets 1 port can support Intel TDM formatted data TM 2 ports can support Bluetooth PCM formatted data Digital Cameras/Camcorders Stereo Class-D Speaker Driver Up to 3W/channel 4 (10% THD+N) DDX Class-D Technology achieves low EMI while delivering high efficiency Constant output power mode 0 ,QWHUQDO 8 7 0 287 , 6 /- 5- ,QWHO Anti-Pop circuitry XGLR / 0&/. ,1 7 &ORFNV 3// *3,2 ,17 , & 0 287 / 7 Filterless architecture reduces BOM cost 8 287 , 6 /- 5- 0&/. /,1 0 0 , /,1 8 Mono Earpiece Amplifier Speaker Driver / 287 , 6 /- 5- 8 & 1 /,1 3 65& 75,0 %7/ 6 8 2 63. 2XW / Subwoofer Line Output 7 8 63 &ODVV %7/ 5 3:0 5,1 3 63 0 & 63. 2XW 5 40mW output power (16), < 1% THD+N 5,1 5 8 & ( 5,1 2 & 6 %7/ Also capable of driving up to 1Vrms (10K) ( 0RQR (HDUSKRQH ( 63 & 95() 6 6XEZRRIHU /LQH 2XW / R 0,& 7 6 0,&%, 6 (7(&7 ( 2 & 0,& 5 Microphone/line-in interface 7 & /LQH 2XW / 0,& 0 6 &DSOHVV / +3 Analog / Digital microphone or Line-in inputs 0,&&/. 63 &/. 8 65& 75,0 : 0,&&/. 63 , 7 Up to 2 analog mics & 2 digital mics or 4 digital mics 7 0 ,1 , 6 /- 5- ,QWHO & & /LQH 2XW 5 + Automatic Level Control ,1 , 6 /- 5- %OXHWRRWK 3&0 5 &DSOHVV +3 Dual mic bias generators ,1 , 6 /- 5- %OXHWRRWK 3&0 0,& +3 &KDUJH HWHFW HWHFW 3XPS Low-power with built in power management 1.6 V CODEC supports 1Vrms output 5,1* +3 (7 6/((9( Ultra low standby and no-signal power consumption 1.6V digital / 1.7V analog supply for low power Package 68-pin, 8x8mm, QFN, 0.4mm pitch 1 V 1.4 4/12/2018 2018 Tempo Semiconductor, Inc. TSCS454xxTSCS454xx Portable Consumer CODEC 1. OVERVIEW ..............................................................................................................................10 1.1. Block Diagram .................................................................................................................................10 1.2. Audio Outputs ..................................................................................................................................11 1.3. Audio Inputs .....................................................................................................................................11 1.4. Digital Audio Interface ......................................................................................................................11 1.5. On-Chip PLLs ..................................................................................................................................11 2. POWER MANAGEMENT .........................................................................................................12 2.1. Registers .........................................................................................................................................12 2.1.1. Power Management Register 0 .........................................................................................12 2.1.2. Power Management Register 1 ........................................................................................13 2.1.3. Power Management Register 2 ........................................................................................14 2.1.4. Power Management Register 3 ........................................................................................14 2.1.5. Power Management Register 4 .........................................................................................15 3. OUTPUT AUDIO PROCESSING .............................................................................................16 3.1. DC Removal ....................................................................................................................................18 3.2. Volume Control Functions ...............................................................................................................19 3.3. Master Volume Control ....................................................................................................................20 3.4. Effects Processing ...........................................................................................................................21 3.4.1. Effects Control (xFXCTL) Register ....................................................................................21 3.4.2. Stereo Depth (3D) Enhancement .......................................................................................21 3.4.3. Psychoacoustic Bass Enhancement ..................................................................................22 3.4.4. Psychoacoustic Treble Enhancement ................................................................................22 3.5. Multi-band Compressor ...................................................................................................................23 3.5.1. Multi-band Compressor Registers ....................................................................................23 3.6. Parametric Equalizer .......................................................................................................................31 3.6.1. Prescaler & Equalizer Filter ...............................................................................................31 3.6.2. EQ Filter Register ..............................................................................................................32 3.6.3. Equalizer, Bass, Treble Coefficient & Equalizer Prescaler RAM .......................................35 3.7. Gain, Limiting, and Dynamic Range Control ....................................................................................39 3.7.1. Limiter Compressor and Expander ....................................................................................39 3.7.2. Configuration .....................................................................................................................42 3.7.3. Controlling Parameters ......................................................................................................43 3.7.4. Compressor/Limiter/Expander Control Registers ..............................................................44 3.8. Mute and De-Emphasis and Phase Inversion .................................................................................50 3.9. Output Post Processing ...................................................................................................................51 3.9.1. Interpolation and Filtering ..................................................................................................51 3.10 Analog Audio Outputs .....................................................................................................................51 3.10.1. Headphone Output ...........................................................................................................52 3.10.2 Speaker Outputs ...............................................................................................................54 3.10.3. Earpiece Output ...............................................................................................................55 3.10.4. Class D Audio Processing ...............................................................................................56 3.11. Thermal Shutdown .........................................................................................................................64 3.11.1. Algorithm description: .....................................................................................................64 3.11.2. Thermal Trip Points.......................................................................................................64 3.11.3. Instant Cut Mode ..............................................................................................................65 3.11.4. Thermal Shutdown Registers ...........................................................................................65 3.12. Short Circuit Protection .................................................................................................................67 3.13. Analog Input to DAC/Headphone Bypass Path ............................................................................67 .................67 3.14. Headphone Switch ....................................................................................................... 3.14.1. Headphone Switch Control Register ...............................................................................68 4. ANALOG INPUT AUDIO PROCESSING .................................................................................69 4.1. Overview ..........................................................................................................................................70 4.2. Analog Audio Inputs .........................................................................................................................70 4.3. Input Processor Analog Input Control ..............................................................................................70 4.3.1. Channel 0 Input Audio Control Register ...........................................................................70 4.3.2. Channel 1 Audio Input Control Register ...........................................................................71 4.3.3. Channel 2 Audio Input Control Register ...........................................................................71 4.3.4. Channel 3 Audio Input Control Register ...........................................................................71 4.4. Input Processor Digital Processing ..................................................................................................72 2 V 1.4 4/12/2018 2018 Tempo Semiconductor, Inc. TSCS454xx