CMG07(TE12L,Q,M) Toshiba

CMG07 TOSHIBA Rectifier Silicon Diffused Type CMG07 General-Purpose Rectifiers Unit: mm Repetitive peak reverse voltage : V = 400 V RRM Average forward current : I = 1 A F (AV) Peak forward voltage : V =1.1 V (max) I = 1 A FM F Suitable for high-density board assembly due to the use of a small TM Toshiba Nickname: M FLAT Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage V 400 V RRM Average forward current I 1 (Note1) A F (AV) Non-repetitive peak forward surge current I 30 (50 Hz) A FSM Junction temperature T 150 C j Storage temperature T -40 to 150 C stg JEDEC Note1: Ta=78C Device mounted on a ceramic board JEITA Board size : 50 mm 50 mm Soldering land size : 2 mm 2 mm TOSHIBA 3-4E1S Board thickness : 0.64 mm Rectangular waveform : = 180 Weight: 0.023 g (typ.) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (pulse test) 0.80 FM (1) FM Peak forward voltage V I = 0.7 A (pulse test) 0.91 V FM (2) FM V I = 1 A (pulse test) 0.94 1.1 FM (3) FM Peak repetitive reverse current I V = 400 V (pulse test) 10 A RRM RRM Device mounted on a ceramic board board size 50 mm 50 mm 60 soldering land size 2 mm 2 mm board thickness 0.64 mm Device mounted on a glass-epoxy board Thermal resistance board size 50 mm 50 mm R 125 C/W th (j-a) soldering land size 6 mm 6 mm (junction to ambient) board thickness 1.6 mm Device mounted on a glass-epoxy board board size 50 mm 50 mm 200 soldering land size 2.1 mm 1.4 mm board thickness 1.6 mm Thermal resistance (junction to lead) R 16 C/W th (j-) Start of commercial production 2008-10 1 2018-07-06 CMG07 Marking Abbreviation Code Part No. G7 CMG07 Land pattern dimensions for reference only Unit: mm 1.4 3.0 1.4 Handling Precaution 1) The absolute maximum ratings are rated values that must not be exceeded during operation, even for aninstant. The following are the recommended general derating methods for designing a circuit board usingthis device. VRRM : We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit. V has a temperature coefficient of 0.1%/C. Take this temperature coefficient into RRM account designing a device at low temperature. I :We recommend that the worst case current be no greater than 80% of the absolute maximum rating of F (AV) IF (AV) and Tj be below 120C. When using this device, take the margin into consideration by using an allowable Ta max-IF (AV) curve. IFSM :This rating specifies peak non-repetitive forward surge current. This only applies to an abnormal operation, which seldom occurs during the lifespan of a device. Tj :Derate device parameters in proportion to this rating in order to ensure high reliability. We recommend that the junction temperature (Tj) of a device be kept below 120C. 2) Thermal resistance (junction-to-ambient) varies with the mounting conditions of a device on a circuit board. An appropriate thermal resistance value should be used, considering the circuit board design and land pattern dimensions (provided for reference only). 3) For other design considerations, see the Toshiba website. 2 2018-07-06 2.1