CUS03(TE85L,Q,M) Toshiba

CUS03 TOSHIBA Schottky Barrier Diode CUS03 Unit: mm Switching Mode Power Supply Applications + 0.2 1.25 0.1 Portable Equipment Battery Applications + 0.05 0.13 0.88 0.1 0.03 Repetitive peak reverse voltage : V = 40 V RRM Average forward current : I = 0.7 A F (AV) Peak forward voltage : V = 0.52 V I = 0.7 A FM F Suitable for high-density board assembly due to the use of a small TM Toshiba Nickname: USFLAT Absolute Maximum Ratings (Ta = 25C) 0.6 0.1 0.88 0.1 Characteristics Symbol Rating Unit Repetitive peak reverse voltage V 40 V 0.6 0.1 RRM Average forward current I A F (AV) 0.7 (Note 1) Non-repetitive peak forward surge current I 20 (50 Hz) A FSM Junction temperature T 40 to 150 C 0.78 0.1 j ANODE CATHODE Storage temperature range T 40 to 150 C stg 0.6 0.1 Note 1: Ta = 53C: Device mounted on a glass-epoxy board Board size : 50 mm 50 mm, JEDEC Soldering land size : 6 mm 6 mm = 20 V JEITA Rectangular waveform ( = 180), VR Note 2: Using continuously under heavy loads (e.g. the application of TOSHIBA 3-2B1S high temperature/current/voltage and the significant change in Weight: 0.004 g (typ.) temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (pulse test) 0.37 FM (1) FM Peak forward voltage V V I = 0.7 A (pulse test) 0.48 0.52 FM (2) FM I V = 5 V (pulse test) 0.4 RRM (1) RRM Repetitive peak reverse current A I V = 40 V (pulse test) 3.0 100 RRM (2) RRM Junction capacitance C V = 10 V, f = 1.0 MHz 45 pF j R Device mounted on a ceramic board board size 50 mm 50 mm 75 soldering land size 2 mm 2 mm board thickness 0.64 mm Thermal resistance R C/W th (j-a) (junction to ambient) Device mounted on a glass-epoxy board board size 50 mm 50 mm 150 soldering land size 6 mm 6 mm board thickness 1.6 mm Thermal resistance (junction to lead) R Junction to lead of cathode side 30 C/W th (j-) Start of commercial production 2003-11 1 2018-07-02 2.5 0.2 0.6 0.1 1.9 0.1 0 ~ 0.05 0.5 0.1 1.4 0.2CUS03 Marking Abbreviation Code Part No. 3 CUS03 Land pattern dimensions for reference only Unit: mm 2.0 0.5 0.8 1.1 0.8 Handling Precaution 1) Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. Please take forward and reverse loss into consideration during design. 2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for designing a circuit using this device. V : Use this rating with reference to (1) above. V has a temperature coefficient of 0.1%/C. Take RRM RRM this temperature coefficient into account when designing a device at low temperature. I : We recommend that the worst-case current be no greater than 80% of the absolute maximum F (AV) rating of I and T be below 120C. When using this device, please take the margin into consideration F (AV) j by using an allowable Ta max-I curve. F (AV) I : This rating specifies the non-repetitive peak current. This is only applied for an abnormal FSM operation, which seldom occurs during the lifespan of the device. T : Derate this rating when using a device to ensure high reliability. j We recommend that the device be used at T below 120C. j 3) Thermal resistance between junction and ambient fluctuates depending on the devices mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 4) For other design considerations, see the Toshiba website. 2 2018-07-02