TK3P50D Toshiba

TK3P50D MOSFETs Silicon N-Channel MOS (-MOS) TK3P50DTK3P50DTK3P50DTK3P50D 1. 1. 1. 1. ApplicationsApplicationsApplicationsApplications Switching Voltage Regulators 2. 2. FeaturesFeatures 2. 2. FeaturesFeatures (1) Low drain-source on-resistance: R = 2.3 (typ.) DS(ON) (2) High forward transfer admittance: Y = 1.0 S (typ.) fs (3) Low leakage current: I = 10 A (max) (V = 500 V) DSS DS (4) Enhancement mode: V = 2.4 to 4.4 V (V = 10 V, I = 1 mA) th DS D 3. 3. 3. 3. Packaging and Internal CircuitPackaging and Internal CircuitPackaging and Internal CircuitPackaging and Internal Circuit 1: Gate (G) 2: Drain (D)(HEAT SINK) 3: Source (S) DPAK 4. 4. 4. 4. Absolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (T = 25 = 25 = 25 = 25 unless otherwise specified) unless otherwise specified) unless otherwise specified) unless otherwise specified) aaaa Characteristics Symbol Rating Unit Drain-source voltage V 500 V DSS Gate-source voltage V 30 GSS Drain current (DC) (Note 1) I 3 A D Drain current (pulsed) (Note 1) I 6 DP Power dissipation (T = 25) P 60 W c D Single-pulse avalanche energy (Note 2) E 81 mJ AS Avalanche current I 3 A AR Repetitive avalanche energy (Note 3) E 6 mJ AR Channel temperature T 150 ch Storage temperature T -55 to 150 stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 2011-04-30 1 Rev.1.0TK3P50D 5. 5. 5. 5. Thermal CharacteristicsThermal CharacteristicsThermal CharacteristicsThermal Characteristics Characteristics Symbol Max Unit Channel-to-case thermal resistance R 2.08 /W th(ch-c) Channel-to-ambient thermal resistance R 125 th(ch-a) Note 1: Ensure that the channel temperature does not exceed 150 . Note 2: V = 90 V, T = 25 (initial), L = 15.3 mH, R = 25 , I = 3 A DD ch G AR Note 3: Repetitive rating pulse width limited by maximum channel temperature Note: This transistor is sensitive to electrostatic discharge and should be handled with care. 2011-04-30 2 Rev.1.0