TLP2168(F) Toshiba

TLP2168 Photocouplers Infrared LED & Photo IC TLP2168TLP2168TLP2168TLP2168 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Programmable Logic Controllers (PLCs) Factory Automation (FA) Measuring Instruments 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP2168 consists of high-intensity infrared LED optically coupled to a high-gain, high-speed photoreceptor chip. The TLP2168 guarantees operation at up to 125 and on supplies from 2.7 V to 5.5 V. It is offered in the SO8 package. With two LED-photoreceptor pairs, the TLP2168 helps save board space. An internal noise shield provides superior common-mode transient immunity for improved noise immunity. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (open collector output) (2) Package: SO8 (3) Operating temperature: -40 to 125 (4) Supply voltage: 2.7 to 5.5 V (5) Data transfer rate: 20 MBd (typ.)(NRZ) (6) Threshold input current: 5.0 mA (max) (7) Supply current: 8 mA (max) (8) Common-mode transient immunity: 15 kV/s (min) (9) Isolation voltage: 2500 Vrms (min) (10) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN 60747-5-5 (Note 1)(Note 1)(Note 1) Option (V4) Note 1: When a VDE approved type is needed, please designate the Option (V4)Option (V4)Option (V4). Start of commercial production 2010-09 2015-2019 2019-11-26 1 Toshiba Electronic Devices & Storage Corporation Rev.9.0TLP2168 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 1 2: Cathode 1 3: Cathode 2 4: Anode 2 5: GND 6: V (Output 2) O2 7: V (Output 1) O1 8: V CC 11-5K1S 5. 5. 5. 5. Internal CircuitInternal CircuitInternal CircuitInternal Circuit 6. Principle of Operation 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED 1 (2) Output 1 (2) H ON L L OFF H 6.2. Mechanical Parameters 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical Parameters Characteristics Min Unit Creepage distances 4.2 mm Clearance distances 4.2 Internal isolation thickness 2015-2019 2019-11-26 2 Toshiba Electronic Devices & Storage Corporation Rev.9.0