X-On Electronics has gained recognition as a prominent supplier of TLP2304(E High Speed Optocouplers across the USA, India, Europe, Australia, and various other global locations. TLP2304(E High Speed Optocouplers are a product manufactured by Toshiba. We provide cost-effective solutions for High Speed Optocouplers, ensuring timely deliveries around the world.

TLP2304(E Toshiba

TLP2304(E electronic component of Toshiba
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Part No.TLP2304(E
Manufacturer: Toshiba
Category: High Speed Optocouplers
Description: Optocoupler Logic-Out Open Collector DC-IN 1-CH 5-Pin SO6
Datasheet: TLP2304(E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
125: USD 0.6123 ea
Line Total: USD 76.54 
Availability - 0
MOQ: 125  Multiples: 125
Pack Size: 125
Availability Price Quantity
0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 125
Multiples : 125
125 : USD 0.6123

   
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We are delighted to provide the TLP2304(E from our High Speed Optocouplers category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TLP2304(E and other electronic components in the High Speed Optocouplers category and beyond.

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TLP2304 Photocouplers GaAAs Infrared LED & Photo IC TLP2304TLP2304TLP2304TLP2304 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Intelligent Power Module Signal Isolation Factory Automation (FA) Industrial Inverters 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP2304 consists of a GaAAs light-emitting diode optically coupled with an integrated highgain, highspeed photodetector and is housed in the SO6 package. It supports operating temperatures of up to 125 . The photodetector has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 20 kV/s. The TLP2304 guarantees minimum and maximum of propagation delay time, pulse width distortion. Therefore it is suitable for isolation interface between IPM and control IC circuits in motor control application. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (open collector output) (2) Package: SO6 (3) Data transfer rate: 1 MBd (typ.) (NRZ) (4) Threshold input current: 5 mA (max) (5) Supply voltage: -0.5 to 30 V (6) Operating temperature: -40 to 125 (7) Supply current: 1.3 mA (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 3750 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN62368-1 (Note 1)(Note 1)(Note 1) Option (V4) Note 1: When a VDE approved type is needed, please designate the Option (V4)Option (V4)Option (V4). 4. 4. 4. 4. Packaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin Assignment 1: Anode 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-4L1S Start of commercial production 2018-09 2018 2018-09-04 1 Toshiba Electronic Devices & Storage Corporation Rev.1.0TLP2304 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. Principle of OperationPrinciple of Operation 6. 6. Principle of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED Output H ON L L OFF H 6.2. 6.2. Mechanical ParametersMechanical Parameters 6.2. 6.2. Mechanical ParametersMechanical Parameters Characteristics Dimension(Min) Unit Creepage distances 5.0 mm Clearance distances 5.0 Internal isolation thickness 0.4 2018 2018-09-04 2 Toshiba Electronic Devices & Storage Corporation Rev.1.0

Tariff Desc

8541.50.00 - Other semiconductor devices (not IC) semiconductor devices
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
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