TLP2309 Toshiba

TLP2309 Photocouplers GaAAs Infrared LED & Photo IC TLP2309TLP2309TLP2309TLP2309 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Transistor Inverters Switching Power Supplies High-Speed Digital Interfacing 2. 2. 2. 2. GeneralGeneralGeneralGeneral The Toshiba TLP2309 consists of a high-output GaAAs light-emitting diode coupled with a high-speed photo- diode-transistor chip. It is housed in the SO6 package.The TLP2309 guarantees operation at up to 110 and on supplies both 3.3 V and 5 V. Also, since the TLP2309 guarantees a creepage / clearance distance 5.0 mm and internal isolation thickness 0.4 mm, this product is in the reinforced insulation class according to international safety standards. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (open collector output) (2) Package: SO6 (3) Operating temperature: -40 to 110 (4) Supply voltage: 3.3 V / 5 V (5) Data transfer rate: 1 Mbit/s (typ.) (NRZ) (6) Common-mode transient immunity: 15 kV/ s (min) (7) Isolation voltage: 3750 Vrms (min) (8) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Thailand Factory Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (V4)Option (V4)Option (V4)Option (V4). Start of commercial production 2011-04 2015 Toshiba Corporation 2015-11-27 1 Rev.7.0TLP2309 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-4L1S 5. 5. 5. 5. Internal CircuitInternal CircuitInternal CircuitInternal Circuit 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. Truth Table 6.1. 6.1. 6.1. Truth TableTruth TableTruth Table Input LED Output H ON L L OFF H 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters Characteristics Min Unit Creepage distances 5.0 mm Clearance distances 5.0 Internal isolation thickness 0.4 2015 Toshiba Corporation 2015-11-27 2 Rev.7.0