TLP2345(E(T Toshiba

TLP2345 Photocouplers GaAAs Infrared LED & Photo IC TLP2345TLP2345TLP2345TLP2345 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Intelligent Power Module Signal Isolation Programmable Logic Controllers (PLCs) High-Speed Digital Interfacing for Instrumentation and Control Devices 2. 2. 2. 2. GeneralGeneralGeneralGeneral The Toshiba TLP2345 consists of high-output GaAAs light-emitting diode coupled with a high-gain, high-speed photo detector. It is housed in the SO6 package. This product can operate in power supply voltage 4.5 V to 30 V with the maximum operative temperature of 110 . Since TLP2345 has guaranteed 3 mA low supply current (I /I ), and 1.6 mA low threshold input current CCL CCH (I ), it contributes to energy saving of devices. It can drive directly from a microcomputer for a low input FLH current. The detector has a totem-pole output stage with current sourcing and sinking capabilities. The TLP2345 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 30 kV/ s. The TLP2345 has a buffer output. An inverter output version, the TLP2348, is also available. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (Totem pole output) (2) Package: SO6 (3) Operating temperature: -40 to 110 (4) Supply voltage: 4.5 to 30 V (5) Threshold input current: 1.6 mA (max) (6) Supply current: 3 mA (max) (7) Propagation delay time: 120 ns (max) (8) Pulse width distortion: 40 ns (max) (9) Common-mode transient immunity: 30 kV/s (min) (10) Isolation voltage: 3750 Vrms (min) (11) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)(Note 1)(Note 1) Option (V4) Note 1: When a VDE approved type is needed, please designate the Option (V4)Option (V4)Option (V4). Start of commercial production 2013-11 2016 Toshiba Corporation 2016-01-22 1 Rev.3.0TLP2345 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-4L1S 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. Principle of OperationPrinciple of Operation 6. 6. Principle of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED Output H ON H L OFF L 6.2. 6.2. Mechanical ParametersMechanical Parameters 6.2. 6.2. Mechanical ParametersMechanical Parameters Characteristics Min Unit Creepage distances 5.0 mm Clearance distances 5.0 Internal isolation thickness 0.4 2016 Toshiba Corporation 2016-01-22 2 Rev.3.0