TLP358 Toshiba

TLP358 Photocouplers GaAAs Infrared LED & Photo IC TLP358TLP358TLP358TLP358 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Industrial Inverters MOSFET Gate Drivers IGBT Gate Drivers Induction Cooktop and Home Appliances 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP358 is a photocoupler in a DIP8 package that consists of a GaAAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It has an internal Faraday shield that provides a guaranteed Common-mode transient immunity of 20 kV/s. The TLP358 is ideal for IGBT and power MOSFET gate drive. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Output peak current: 6.0 A (max) (3) Operating temperature: -40 to 100 (4) Supply current: 2 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 5 mA (max) (7) Propagation delay time: 500 ns (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 3750 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)(Note 1)(Note 1) Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2009-06 2016 Toshiba Corporation 2016-01-19 1 Rev.4.0TLP358 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: GND 6: N.C. 7: V (Output) O 8: V CC 11-10C4S 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 1.0-F bypass capacitor must be connected between pin 8 and pin 5. 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62 mm Pitch 10.16 mm Pitch Characteristics Unit TLP358 TLP358F Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) 2016 Toshiba Corporation 2016-01-19 2 Rev.4.0