OP215, OP216 Features: Hermetically sealed package OP2 16 Mechanically and spectrally matched to other OPTEK devices Designed for direct mount to PCBoard Enhanced temperature range OP2 15 Description: Each OP215 and OP216 device is an 890 nm gallium aluminum arsenide infrared emitting diode (GaAIAs), mounted in a hermetically sealed pig tale package with an enhanced temperature range and a narrow irradiance pattern that provides high on-axis intensity for excellent coupling efficiency. These devices offer significantly higher power output than GaAs at equivalent drive currents and have a wavelength that is matched to silicons peak response. Their small package size permits high device density mounting. The OP216A device provide an additional mounting tab connected to the Cathode/Case. these LEDs are mechanically and spectrally matched to the OP300 series, OP516, OP600 series and OP640 series devices. Please refer to Application Bulletins 208 and 210 for additional design information and reliability (degradation) data, and t o Application Bulletin 202 for pill -type soldering to PCBoard. Ordering Information Part LED Peak Optical Power mW/ Total Beam Applications: 2 Number Wavelength cm (Min) Angle Non-contact reflective object sensor OP215A OP216A 890 mm 1.20 24 Assembly line automation Machine automation Machine safety End of travel sensor 1 Pin LED 1 An od e C a th od e 2 2 RoHS General Note OPTEK Technology, Inc. TT Electronics reserves the right to make changes in product specificaoti n without 1645 Wallace Drive, Carrollton, TX 75006 Ph: +1 972 323 2200 nocti e or liability. All informaoti n is subject to TT Electronics own data and is www.optekinc.com www.ttelectronics.com considered accurate at time of going to print. Issue C 04/2018 Page 1 TT electronics plc Electrical Specifications Absolute Maximum Ratings (T = 25 C unless otherwise noted) A o o Storage Temperature Range -65 C to +150 C o o Operating Temperature Range -65 C to +125 C Reverse Voltage 2.0 V Continuous Forward Current 100 mA Peak Forward Current (2s pulse with 0.1% duty cycle) 1.0 A (1)(2) Lead Soldering Temperature 1/16 inch (1.6 mm) from case for 5 seconds with soldering iron 260 C (3) Power Dissipation 150 mW Electrical Characteriscti s (T = 25 C unless otherwise noted) A SYMBOL PARAMETER MIN TYP MAX UNITS TEST CONDITIONS Input Diode Apertured Radiant Incidence (3) 2 (4) E - - mW/cm I = 50 mA E (APT) F OP216A 1.20 V Forward Voltage - - 1.80 V I = 50 mA F F I Reverse Current - - 100 A V = 2.0 V R R Wavelength at Peak Emission - 890 - nm I = 10 mA P F Spectral Bandwidth between B - 80 - nm I = 10 mA F Half Power Points /T Spectral Shift with Temperature - +0.18 - nm/C I = Constant F Emission Angle at Half Power Points 24 Degree I = 50 mA HP F - - t Output Rise Time - 500 - ns r I =100 mA, PW=10 s, and F(PK) D.C.=10.0% t Output Fall Time - 250 - ns f Notes: 1. Refer to Application Bullen ti 202 which reviews proper soldering techniques for pill -type devices. 2. No clean or low solids. RMA flux is recommended. Duration can be extended to 10 seconds maximum when ofl w soldering. 3. Derate linearly 1.50 mW/ C above 25 C. 4. For OP216, E is a measurement using a 0.180 (4.57 mm) diameter apertured sensor placed 0.653 (16.59 mm) from the lens tip. E is not E(APT) E(APT) necessarily uniform within the measured area. General Note OPTEK Technology, Inc. TT Electronics reserves the right to make changes in product specificaoti n without 1645 Wallace Drive, Carrollton, TX 75006 Ph: +1 972 323 2200 nocti e or liability. All informaoti n is subject to TT Electronics own data and is www.optekinc.com www.ttelectronics.com considered accurate at time of going to print. Issue C 04/2018 Page 2 TT electronics plc