6N138, 6N139 www.vishay.com Vishay Semiconductors High Speed Optocoupler, 100 kBd, Low Input Current, Photodiode Darlington Output FEATURES High current transfer ratio, 300 % Low input current, 0.5 mA 1 8 NC V High output current, 60 mA CC Isolation test voltage, 5300 V RMS 2 7 A V B TTL compatible output, V = 0.1 V OL C 3 6 V O High common mode rejection, 500 V/s NC 4 5 GND Adjustable bandwidth-access to base Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 APPLICATIONS DESCRIPTION Microprocessor system interface High common mode transient immunity and very high current ratio together with 5300 V insulation are RMS PLC, ATE input / output isolation achieved by coupling and LED with an integrated high gain EIA RS232 line receiver photo detector in an eight pin dual-in-line package. TTL, CMOS voltage level translation Separate pins for the photo diode and output stage enable TTL compatible saturation voltages with high speed Multiplexed data transmission operation. Digital control power supply Access to the base terminal allows adjustment to the gain Ground loop and electrical noise elimination bandwidth. The 6N138 is ideal for TTL applications since the 300 % AGENCY APPROVALS minimum current transfer ratio with an LED current of 1.6 mA enables operation with one unit load-in and one unit UL1577, file no. E52744, double protection load-out with a 2.2 k pull-up resistor. DIN EN 60747-5-5 available with option 1 The 6N139 is best suited for low power logic applications involving CMOS and low power TTL. A 400 % current transfer ratio with only 0.5 mA of LED current is guaranteed from 0 C to 70 C. Caution: Due to the small geometries of this device, it should be handled with Electrostatic Discharge (ESD) precautions. Proper grounding would prevent damage further and/or degradation which may be induced by ESD. ORDERING INFORMATION DIP 6 N 13 - X 0 T 7.62 mm PART NUMBER PACKAGE OPTION TAPE Option 7 Option 9 AND REEL > 0.1 mm > 0.7 mm CTR (%) AGENCY CERTIFIED/PACKAGE 1.6 mA UL > 300 > 500 DIP-8 6N138 6N139, 6N139-X001 SMD-8, option 7 6N138-X007T 6N139-X007, 6N139-X007T SMD-8, option 9 6N138-X009T 6N139-X009, 6N139-X009T VDE > 300 > 500 SMD-8, option 7 - 6N139-X017T SMD-8, option 9 - 6N139-X019T Note For additional information on the available options refer to option information. Rev. 1.6, 23-Jan-15 Document Number: 83605 1 For technical questions, contact: optocoupleranswers vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 6N138, 6N139 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION PART SYMBOL VALUE UNIT INPUT Reverse voltage V 5V R Forward current I 25 mA F (1) Average input current I 20 mA f(avg) (2) Input power dissipation P 35 mW diss OUTPUT Pin 8 to 5, pin 6 to 5 6N138 V , V -0.5 to 7 V CC O Supply and output voltage Pin 8 to 5, pin 6 to 5 6N139 V , V -0.5 to 18 V CC O Emitter base reverse voltage Pin 5 to 7 0.5 V 50 % duty cycle - 1 ms Peak input current 40 mA pulse width Peak transient input current t 1 s, 300 pps 1 A p Output current Pin 6 I 60 mA O (3)(4) Output power dissipation P 100 mW diss COUPLER Isolation test voltage t = 1 min V 5300 V ISO RMS 12 V = 500 V, T = 25 C R 10 IO amb IO Isolation resistance 11 V = 500 V, T = 100 C R 10 IO amb IO Storage temperature T -55 to +150 C stg Operating temperature T -55 to +100 C amb (5) Lead soldering temperature t = 10 s T 260 C sld Notes Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. (1) Derate linearly above 50 C free-air temperature at a rate of 0.333 mA/C. (2) Derate linearly above 50 C free-air temperature at a rate of 0.467 mW/C. (3) Derate linearly above 25 C free-air temperature at a rate of 0.6 mA/C. (4) Derate linearly above 25 C free-air temperature at a rate of 1 mW/C. (5) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through hole devices (DIP). ELECTRICAL CHARACTERISTICS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT INPUT Input forward voltage I = 1.6 mA V 1.4 1.7 V F F Input reverse breakdown voltage I = 10 A B5V R VR Temperature coefficient of I = 1.6 mA -1.8 mV/C F forward voltage OUTPUT I = 1.6 mA, I = 4.8 mA, V = 4.5 V 6N138 V 0.1 0.4 V F O CC OL I = 1.6 mA, I = 8 mA, V = 4.5 V 6N139 V 0.1 0.4 V F O CC OL (1) Logic low, output voltage I = 5 mA, I = 15 mA, V = 4.5 V 6N139 V 0.15 0.4 V F O CC OL I = 12 mA, I = 24 mA, V = 4.5 V 6N139 V 0.25 0.4 V F O CC OL I = 0 mA, V = 7 V 6N138 I 0.1 250 A F CC OH (1) Logic high, output current I = 0 mA, V = 18 V 6N139 I 0.05 100 A F CC OH (1) Logic low supply current I = 1.6 mA, V = OPEN, V = 18 V I 0.2 1.5 mA F O CC CCL (1) Logic high supply current I = 0 mA, V = OPEN, V = 18 V I 0.001 10 A F O CC CCH Rev. 1.6, 23-Jan-15 Document Number: 83605 2 For technical questions, contact: optocoupleranswers vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000