3.33.3 mmmm SiSS60DN www.vishay.com Vishay Siliconix N-Channel 30 V (D-S) MOSFET with Schottky Diode FEATURES PowerPAK 1212-8S D TrenchFET Gen IV power MOSFET D 8 D 7 D 6 SKYFET with monolithic Schottky diode 5 Optimized R x Q and R x Q FOM enable DS g DS gd higher efficiency for high frequency switching 100 % R and UIS tested g 1 Material categorization: for definitions of compliance 2 S 3 S please see www.vishay.com/doc 99912 4 11 S G Top View Bottom View APPLICATIONS D PRODUCT SUMMARY Synchronous rectification V (V) 30 DS Synchronous buck converter Schottky R max. ( ) at V = 10 V 0.00131 DS(on) GS DC/DC conversions G Diode R max. ( ) at V = 4.5 V 0.00201 DS(on) GS Q typ. (nC) 25.9 g I (A) 181.8 D S N-Channel MOSFET Configuration Single ORDERING INFORMATION Package PowerPAK 1212-8S Lead (Pb)-free and halogen-free SiSS60DN-T1-GE3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V 30 DS V Gate-source voltage V +16 / -12 GS T = 25 C 181.8 C T = 70 C 145.4 C Continuous drain current (T = 150 C) I J D b, c T = 25 C 50.1 A b, c T = 70 C 40.1 A A Pulsed drain current (t = 100 s) I 200 DM T = 25 C 97.5 C Continuous source-drain diode current I S b, c T = 25 C 8.5 A Single pulse avalanche current I 20 AS L = 0.1 mH Single pulse avalanche energy E 20 mJ AS T = 25 C 65.8 C T = 70 C 42.1 C Maximum power dissipation P W D b, c T = 25 C 5.1 A b, c T = 70 C 3.2 A Operating junction and storage temperature range T , T -55 to +150 J stg C c Soldering recommendations (peak temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICAL MAXIMUM UNIT b Maximum junction-to-ambient t 10 s R 20 25 thJA C/W Maximum junction-to-case (drain) Steady state R 1.5 1.9 thJC Notes a. T = 25 C C b. Surface mounted on 1 x 1 FR4 board c. t = 10 s d. See solder profile (www.vishay.com/doc 73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components f. Maximum under steady state conditions is 63 C/W S19-0106-Rev. A, 04-Feb-2019 Document Number: 77036 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 3.3 mm3.3 mmSiSS60DN www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = 250 A 30 - - V DS GS D Gate-source threshold voltage V V = V , I = 250 A 1 - 2.5 V GS(th) DS GS D Gate-source leakage I V = 0 V, V = +16 V / -12 V - - 100 nA GSS DS GS V = 30 V, V = 0 V - - 300 A DS GS Zero gate voltage drain current I DSS V = 30 V, V = 0 V, T = 70 C - - 5 mA DS GS J a On-state drain current I V 10 V, V = 10 V 20 - - A D(on) DS GS V = 10 V, I = 20 A - 0.00109 0.00131 GS D a Drain-source on-state resistance R DS(on) V = 4.5 V, I = 15 A - 0.00155 0.00201 GS D a Forward transconductance g V = 15 V, I = 20 A - 84 - S fs DS D b Dynamic Input capacitance C - 3960 - iss Output capacitance C V = 15 V, V = 0 V, f = 1 MHz - 1785 - pF oss DS GS Reverse transfer capacitance C - 142 - rss V = 15 V, V = 10 V, I = 50.1 A - 57 85.5 DS GS D Total gate charge Q g - 25.9 38.9 Gate-source charge Q V = 15 V, V = 4.5 V, I = 50.1 A - 12.6 - nC gs DS GS D Gate-drain charge Q -5.6 - gd Output charge Q V = 15 V, V = 0 V - 46 69 oss DS GS Gate resistance R f = 1 MHz 0.12 0.6 1.2 g Turn-on delay time t -18 36 d(on) Rise time t -7 14 r V = 15 V, R = 0.374 , I 40.1 A, DD L D V = 10 V, R = 1 Turn-off delay time t GEN g -30 60 d(off) Fall time t -6 12 f ns Turn-on delay time t -30 60 d(on) Rise time t - 265 530 r V = 15 V, R = 0.374 , I 40.1 A, DD L D V = 4.5 V, R = 1 Turn-off delay time t GEN g -40 80 d(off) Fall time t -18 36 f Drain-Source Body Diode Characteristics Continuous source-drain diode current I T = 25 C - - 97.5 S C A Pulse diode forward current I - - 200 SM Body diode voltage V I = 10 A, V = 0 V - 0.45 0.68 V SD S GS Body diode reverse recovery time t -45 90 ns rr Body diode reverse recovery charge Q -43 86 nC rr I = 10 A, di/dt = 100 A/s, F T = 25 C Reverse recovery fall time t J -22 - a ns Reverse recovery rise time t -23 - b Notes a. Pulse test pulse width 300 s, duty cycle 2 % b. Guaranteed by design, not subject to production testing Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S19-0106-Rev. A, 04-Feb-2019 Document Number: 77036 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000