6.156.15 mmmm SQJB40EP www.vishay.com Vishay Siliconix Automotive Dual N-Channel 40 V (D-S) 175 C MOSFET FEATURES PowerPAK SO-8L Dual TrenchFET power MOSFET AEC-Q101 qualified D 1 100 % R and UIS tested g Material categorization: D 2 for definitions of compliance please se e 1 S www.vishay.com/doc 99912 1 2 G 1 3 S 2 4 11 G 2 D 1 D 2 Top View Bottom View PRODUCT SUMMARY G 1 V (V) 40 G DS 2 R ( ) at V = 10 V 0.008 DS(on) GS R ( ) at V = 4.5 V 0.011 DS(on) GS S I (A) per leg 30 1 D S 2 N-Channel MOSFET N-Channel MOSFET Configuration Dual Package PowerPAK SO-8L ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V 40 DS V Gate-source voltage V 20 GS a T = 25 C 30 C Continuous drain current I D T = 125 C 29 C a Continuous source current (diode conduction) I 30 A S b Pulsed drain current I 80 DM Single pulse avalanche current I 22 AS L = 0.1 mH Single pulse avalanche energy E 24 mJ AS T = 25 C 34 C b Maximum power dissipation P W D T = 125 C 11 C Operating junction and storage temperature range T , T -55 to +175 J stg C d Soldering recommendations (peak temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT c Junction-to-ambient PCB mount R 85 thJA C/W Junction-to-case (drain) R 4.3 thJC Notes a. Package limited b. Pulse test pulse width 300 s, duty cycle 2 % c. When mounted on 1 square PCB (FR4 material) d. See solder profile (www.vishay.com/doc 73257). The end of the lead terminal is exposed copper (not plated) as a result of the singulatio n process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection S20-0617-Rev. B, 24-Aug-2020 Document Number: 68550 1 For technical questions, contact: automostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 5.13 m5.13 mmm SQJB40EP www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = 250 A 40 - - DS GS D V Gate-source threshold voltage V V = V , I = 250 A 1.2 1.8 2.5 GS(th) DS GS D Gate-source leakage I V = 0 V, V = 20 V - - 100 nA GSS DS GS V = 0 V V = 40 V - - 1 GS DS Zero gate voltage drain current I V = 0 V V = 40 V, T = 125 C - - 50 A DSS GS DS J V = 0 V V = 40 V, T = 175 C - - 250 GS DS J a On-state drain current I V = 10 V V 5 V 20 - - A D(on) GS DS V = 10 V I = 8 A - 0.0063 0.0080 GS D V = 10 V I = 8 A, T = 125 C - - 0.0117 GS D J a Drain-source on-state resistance R DS(on) V = 10 V I = 8 A, T = 175 C - - 0.0138 GS D J V = 4.5 V I = 5 A - 0.0083 0.0110 GS D b Forward transconductance g V = 15 V, I = 8 A - 48 - S fs DS D b Dynamic Input capacitance C - 1415 1900 iss Output capacitance C -V = 0 V V = 25 V, f = 1 MHz9351300 pF oss GS DS Reverse transfer capacitance C -4565 rss c Total gate charge Q -20 35 g c Gate-source charge Q -4V = 10 V V = 20 V, I = 5 A.3- nC gs GS DS D c Gate-drain charge Q -2.5- gd Gate resistance R f = 1 MHz 0.30 0.74 1.20 g c Turn-on delay time t -7 15 d(on) c Rise time t -20 35 r V = 20 V, R = 4 DD L ns c I 5 A, V = 10 V, R = 1 Turn-off delay time t -1D GEN g835 d(off) c Fall time t -1525 f b Source-Drain Diode Ratings and Characteristics a Pulsed current I -- 80 A SM Forward voltage V I = 8 A, V = 0 V - 0.803 1.200 V SD F GS Body diode reverse recovery time t - 50 100 ns rr Body diode reverse recovery charge Q -60 120 nC rr I = 8 A, di/dt = 100 A/s F Reverse recovery fall time t -27 - a ns Reverse recovery rise time t -23 - b Body diode peak reverse recoverycurrent I --2.3 - A RM(REC) Notes a. Pulse test pulse width 300 s, duty cycle 2 % b. Guaranteed by design, not subject to production testing c. Independent of operating temperature Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S20-0617-Rev. B, 24-Aug-2020 Document Number: 68550 2 For technical questions, contact: automostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000