VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH FEATURES VSMB2000X01 VSMB2020X01 Package type: surface mount Package form: GW, RGW Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 AEC-Q101 qualified Peak wavelength: = 940 nm p 2121725-4725-4 High reliability High radiant power DESCRIPTION High radiant intensity VSMB2000X01 series are infrared, 940 nm emitting diodes Angle of half intensity: = 12 in GaAlAs (DH) technology with high radiant power and high Low forward voltage speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). Suitable for high pulse current operation Terminal configurations: gullwing or reserve gullwing APPLICATIONS Package matches with detector VEMD2000X01 series IrDA compatible data transmission Floor life: 4 weeks, MSL 2a, acc. J-STD-020 Miniature light barrier Compliant to RoHS Directive 2002/95/EC and in Photointerrupters accordance to WEEE 2002/96/EC Optical switch Note ** Please see document Vishay Material Category Policy: Control and drive circuits www.vishay.com/doc 99902 Shaft encoders PRODUCT SUMMARY COMPONENT I (mW/sr) (deg) (nm) t (ns) e P r VSMB2000X01 40 12 940 15 VSMB2020X01 40 12 940 15 Note Test conditions see table Basic Characteristics ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMB2000X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMB2020X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V 5V R Forward current I 100 mA F Peak forward current t /T = 0.5, t 100 s I 200 mA p p FM Surge forward current t = 100 s I 1A p FSM Power dissipation P 160 mW V Junction temperature T 100 C j Operating temperature range T - 40 to + 85 C amb Storage temperature range T - 40 to + 100 C stg Soldering temperature t 5 s T 260 C sd J-STD-051, leads 7 mm, Thermal resistance junction/ambient R 250 K/W thJA soldered on PCB Rev. 1.5, 23-Aug-11 Document Number: 81930 1 For technical questions, contact: emittertechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors 120 180 160 100 140 80 120 100 60 80 R = 250 K/W R = 250 K/W thJA thJA 40 60 40 20 20 0 0 0 10 203040 50607080 90 100 0 1020 3040506070 8090100 21344 T - Ambient Temperature (C) T - Ambient Temperature (C) 21343 amb amb Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT I = 100 mA, t = 20 ms V 1.15 1.35 1.6 V F p F Forward voltage I = 1 A, t = 100 s V 2.2 V F p F I = 1 mA TK - 1.8 mV/K F VF Temperature coefficient of V F I = 100 mA TK - 1.1 mV/K F VF Reverse current V = 5 V I 10 A R R 2 Junction capacitance V = 0 V, f = 1 MHz, E = 0 mW/cm C 70 pF R J I = 100 mA, t = 20 ms I 20 40 60 mW/sr F p e Radiant intensity I = 1 A, t = 100 s I 330 mW/sr F p e Radiant power I = 100 mA, t = 20 ms 40 mW F p e I = 1 mA TK - 1.1 %/K F e Temperature coefficient of radiant power I = 100 mA TK - 0.51 %/K F e Angle of half intensity 12 deg Peak wavelength I = 30 mA 920 940 960 nm F p Spectral bandwidth I = 30 mA 25 nm F Temperature coefficient of I = 30 mA TK 0.25 nm/K p F p Rise time I = 100 mA, 20 % to 80 % t 15 ns F r Fall time I = 100 mA, 20 % to 80 % t 15 ns F f Cut-off frequency I = 70 mA, I = 30 mA pp f 23 MHz DC AC c Virtual source diameter d 1.5 mm Rev. 1.5, 23-Aug-11 Document Number: 81930 2 For technical questions, contact: emittertechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 P - Power Dissipation (mW) V I - Forward Current (mA) F