X-On Electronics has gained recognition as a prominent supplier of W25Q80EWZPIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q80EWZPIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q80EWZPIG Winbond

W25Q80EWZPIG electronic component of Winbond
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Part No.W25Q80EWZPIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 1.8V 8M-bit, 4Kb Uniform Sector
Datasheet: W25Q80EWZPIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1000
Multiples : 1000
1000 : USD 0.6464
5000 : USD 0.6428
10000 : USD 0.6206
25000 : USD 0.5971
N/A

Obsolete
0
MOQ : 18
Multiples : 1
18 : USD 0.5818
N/A

Obsolete
0
MOQ : 19
Multiples : 1
19 : USD 0.7624
N/A

Obsolete
   
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We are delighted to provide the W25Q80EWZPIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q80EWZPIG and other electronic components in the NOR Flash category and beyond.

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W25Q80EW 1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: August 18, 2018 - 1 - inary -Revision J W25Q80EW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES: ........................................................................................................................... 6 3.1 Pin Configuration SOIC 150/208-mil AND VSOP 150-mil .................................................... 6 3.2 PAD Configuration WSON 6x5-MM AND USON 2x3-mm ................................................... 6 3.3 Pin Description SOIC150/208-mil, VSOP 150-mil, WSON 6x5-MM,USON 2x3 .................. 6 3.4 Ball Configuration WLCSP ................................................................................................... 7 3.5 Ball Description WLCSP ....................................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8 4.3 Write Protect (/WP) .............................................................................................................. 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 10 6.1 SPI / QPI Operations .......................................................................................................... 10 6.2 SPI OPERATIONS ............................................................................................................. 10 6.2.1 Standard SPI Instructions ..................................................................................................... 10 6.2.2 Dual SPI Instructions ............................................................................................................ 10 6.2.3 Quad SPI Instructions ........................................................................................................... 11 6.3 QPI Instructions .................................................................................................................. 11 6.3.1 Hold Function ....................................................................................................................... 11 6.4 WRITE PROTECTION ....................................................................................................... 12 6.4.1 Write Protect Features ......................................................................................................... 12 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 13 7.1 STATUS REGISTERs ........................................................................................................ 13 7.1.1 BUSY Status (BUSY) Status Only .................................................................................. 13 7.1.2 Write Enable Latch Status (WEL) Status Only ............................................................... 13 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 13 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 13 7.1.5 Sector/Block Protect (SEC) Volatile/Non-Volatile Writable ............................................ 13 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 14 7.1.7 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 14 7.1.8 Erase/Program Suspend Status (SUS) Status Only ........................................................ 15 7.1.9 Security Register Lock Bits (LB 3:0 ) Volatile/Non-Volatile OTP Writable ...................... 15 - 2 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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