X-On Electronics has gained recognition as a prominent supplier of W25R64JVSSIQ NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25R64JVSSIQ NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25R64JVSSIQ Winbond

W25R64JVSSIQ electronic component of Winbond
W25R64JVSSIQ Winbond
W25R64JVSSIQ NOR Flash
W25R64JVSSIQ  Semiconductors

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Part No. W25R64JVSSIQ
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash RPMC spiFlash 3V 64M-bit
Datasheet: W25R64JVSSIQ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 5.4649
10 : USD 1.9554
100 : USD 1.8651
N/A

Obsolete
   
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We are delighted to provide the W25R64JVSSIQ from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25R64JVSSIQ and other electronic components in the NOR Flash category and beyond.

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W25R64JV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & RPMC Publication Release Date: October 16, 2018 - Revision B W25R64JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 5 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 5 3.2 Pin Description SOIC 208-mil ............................................................................................... 5 4. PIN DESCRIPTIONS ........................................................................................................................ 6 4.1 Chip Select (/CS) .................................................................................................................. 6 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 6 4.3 Serial Clock (CLK) ................................................................................................................ 6 4.4 Reset (/RESET) .................................................................................................................... 6 5. BLOCK DIAGRAM ............................................................................................................................ 7 6. FUNCTIONAL DESCRIPTIONS ....................................................................................................... 8 6.1 SPI Operations ..................................................................................................................... 8 6.1.1 Standard SPI Instructions ....................................................................................................... 8 6.1.2 Dual SPI Instructions .............................................................................................................. 8 6.1.3 Quad SPI Instructions ............................................................................................................. 8 6.1.4 Software Reset & Hardware /RESET pin ................................................................................ 8 6.2 RPMC Operations................................................................................................................. 9 6.3 Write Protection .................................................................................................................. 10 6.3.1 Write Protect Features ......................................................................................................... 10 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 12 7.1 Status Registers ................................................................................................................. 12 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 12 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 12 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 12 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 13 7.1.5 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ....................................... 13 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 13 7.1.7 Status Register Protect (SRL) .............................................................................................. 14 7.1.8 Erase/Program Suspend Status (SUS) Status Only....................................................... 14 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 15 7.1.10 Quad Enable (QE) Volatile/Non-Volatile Writable ........................................................ 15 7.1.11 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ..................................... 15 7.1.12 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ......................... 16 7.1.13 Reserved Bits Non Functional ...................................................................................... 16 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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