X-On Electronics has gained recognition as a prominent supplier of W29N08GVSIAA NAND Flash across the USA, India, Europe, Australia, and various other global locations. W29N08GVSIAA NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

W29N08GVSIAA Winbond

Name: W29N08GVSIAA
Brand: Winbond
SKU: W29N08GVSIAA_Winbond
Availability: OutOfStock
Rating: 5 (11 reviews)

W29N08GVSIAA electronic component of Winbond

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See Product Specifications

Part No.	W29N08GVSIAA
Manufacturer:	Winbond
Category:	NAND Flash
Description:	NAND Flash 4G-bit NAND flash, 3V x 8bit
Datasheet:	W29N08GVSIAA Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

W29N08GVSIAA More Buying Options & Price Grid(s)

Availability	Price	Quantity
0 MOQ : 96 Multiples : 96	96 : USD 15.5662 480 : USD 15.4101 2400 : USD 15.2565 4800 : USD 15.1043 12000 : USD 14.9533 24000 : USD 14.8037 48000 : USD 14.6554 60000 : USD 14.5084 300000 : USD 14.364	N/A Obsolete

0 MOQ : 1 Multiples : 1	1 : USD 16.7397 10 : USD 16.0825 30 : USD 14.9404 100 : USD 13.9448	N/A Obsolete

0 MOQ : 1 Multiples : 1	1 : USD 10.8797 10 : USD 9.8444 25 : USD 9.6127 50 : USD 9.5707 100 : USD 8.6546 250 : USD 8.223 500 : USD 8.1387 1000 : USD 7.8755 5000 : USD 7.8755	N/A Obsolete

We are delighted to provide the W29N08GVSIAA from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W29N08GVSIAA and other electronic components in the NAND Flash category and beyond.

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Additional Infomation About Product

W29N08GV 2 CHIP STACKED 8G-BIT W29N08GV 8G-BIT 3.3V NAND FLASH MEMORY th Release Date: May 17 , 2018 1 Revision C W29N08GV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................ 7 2. FEATURES .................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 8 3.1 Pin Assignment W29N08GVSIAA 1CE Type 48-pin TSOP1 ............................................... 8 3.2 Pin Assignment W29N08GVSIAD 2CE Type 48-pin TSOP1 ............................................... 9 3.3 Pin Assignment W29N08GVBIAA 1CE Type 63-ball VFBGA ............................................ 10 3.4 Pin Assignment W29N08GVBIAD 2CE Type 63-ball VFBGA ............................................ 11 3.5 Pin Descriptions .................................................................................................................. 12 4. PIN DESCRITPIONS ................................................................................................................... 13 4.1 Chip Enable ( CE) .............................................................................................................. 13 4.2 Write Enable ( WE) ............................................................................................................ 13 4.3 Read Enable ( RE) ............................................................................................................. 13 4.4 Address Latch Enable (ALE) .............................................................................................. 13 4.5 Command Latch Enable (CLE) ........................................................................................... 13 4.6 Write Protect ( WP) ............................................................................................................ 13 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 13 4.8 Input and Output (I/Ox) ....................................................................................................... 13 5. SINGLE DIE BLOCK DIAGRAM .................................................................................................. 14 6. MEMORY ARRAY ORGANIZATION ........................................................................................... 15 6.1 Array Organization ............................................................................................................ 15 7. MODE SELECTION TABLE ........................................................................................................ 16 8. COMMAND TABLE ...................................................................................................................... 17 9. DEVICE OPERATIONS ............................................................................................................... 19 9.1 READ operation .................................................................................................................. 19 9.1.1 PAGE READ (00h-30h) ........................................................................................................ 19 9.1.2 CACHE READ OPERATIONS .............................................................................................. 19 9.1.3 TWO PLANE READ (00h-00h-30h) ...................................................................................... 23 9.1.4 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 25 9.1.5 READ ID (90h) ...................................................................................................................... 27 9.1.6 READ PARAMETER PAGE (ECh) ....................................................................................... 28 9.1.7 READ STATUS (70h) ........................................................................................................... 30 9.1.8 READ STATUS ENHANCED (78h) ...................................................................................... 32 9.1.9 READ UNIQUE ID (EDh) ...................................................................................................... 33 9.2 PROGRAM operation ......................................................................................................... 34 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 34 9.2.2 SERIAL DATA INPUT (80h) ................................................................................................. 34 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 35 9.2.4 CACHE PROGRAM (80h-15h) ............................................................................................. 35 9.2.5 TWO PLANE PAGE PROGRAM .......................................................................................... 37 9.3 COPY BACK operation ....................................................................................................... 40 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 40 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 40 9.3.3 TWO PLANE READ for COPY BACK ................................................................................... 41 th Release Date: May 17 , 2018 2 Revision C

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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Manufacturer Winbond Winbond
Product Category NAND Flash NAND Flash
RoHS - XON Y Y
Mounting Style Smd/Smt Smd/Smt
Package / Case TSOP - 48 TSOP - 48
Series W29n08gv W29n08gv
Memory Size 8 gb it 8 gb it
Interface Type Parallel Parallel
Organisation 1 G X 8 1 G X 8
Data Bus Width 8 bit 8 bit
Supply Voltage - Min 2.7 V 2.7 V
Supply Voltage - Max 3.6 V 3.6 V
Supply Current - Max 35 mA 35 mA
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Packaging Tube Tube
Brand Winbond Winbond
Product Type Nand Flash Nand Flash
Factory Pack Quantity : 96 96
Subcategory Memory & Data Storage Memory & Data Storage