X-On Electronics has gained recognition as a prominent supplier of W66BL6NBUAFI DRAM across the USA, India, Europe, Australia, and various other global locations. W66BL6NBUAFI DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W66BL6NBUAFI Winbond

W66BL6NBUAFI electronic component of Winbond
W66BL6NBUAFI Winbond
W66BL6NBUAFI DRAM
W66BL6NBUAFI  Semiconductors

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Part No. W66BL6NBUAFI
Manufacturer: Winbond
Category: DRAM
Description: DRAM 2Gb LPDDR4, x16, 1600MHz, Industrial Temp
Datasheet: W66BL6NBUAFI Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
144: USD 5.742 ea
Line Total: USD 826.85 
Availability - 0
MOQ: 144  Multiples: 144
Pack Size: 144
Availability Price Quantity
0
Ship by Wed. 05 Feb to Fri. 07 Feb
MOQ : 144
Multiples : 144
144 : USD 5.742
288 : USD 5.643
576 : USD 5.368
1008 : USD 5.192
2592 : USD 5.192
5040 : USD 5.126

   
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We are delighted to provide the W66BL6NBUAFI from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W66BL6NBUAFI and other electronic components in the DRAM category and beyond.

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W66BL6NB / W66CL2NQ 2Gb / 4Gb LPDDR4 Table of Contents- 1. GENERAL DESCRIPTION ............................................................................................................................................ 5 2. FEATURES .................................................................................................................................................................... 5 3. ORDER INFORMATION ................................................................................................................................................ 5 4. BALL ASSIGNMENT ..................................................................................................................................................... 6 4.1 Single-Die-Package (SDP) WFBGA 200 Ball Assignment ............................................................................................. 6 4.2 Dual-Die-Package (DDP) WFBGA 200 Ball Assignment ............................................................................................... 7 5. BALL CONFIGURATION ............................................................................................................................................... 8 5.1 Ball Description .............................................................................................................................................................. 8 5.2 Addressing Table ........................................................................................................................................................... 9 6. BLOCK DIAGRAM ....................................................................................................................................................... 10 6.1 Block diagram of single chip ........................................................................................................................................ 10 6.2 Block diagram of Dual-Die-Package (DDP) ................................................................................................................. 11 7. FUNCTIONAL DESCRIPTION ..................................................................................................................................... 12 7.1 Simplified LPDDR4 State Diagram .............................................................................................................................. 12 7.1.1 Simplified Bus Interface State Diagram ....................................................................................................................... 13 7.2 Power-up, Initialization, and Power-Off Procedure ...................................................................................................... 15 7.2.1 Voltage Ramp and Device Initialization ........................................................................................................................ 15 7.2.2 Reset Initialization with Stable Power .......................................................................................................................... 17 7.2.3 Power-off Sequence .................................................................................................................................................... 17 7.2.4 Uncontrolled Power-Off Sequence .............................................................................................................................. 18 7.3 Mode Register Definition .............................................................................................................................................. 19 7.3.1 MR0 Register Information (MA 5:0 = 00 ) .................................................................................................................. 20 H 7.3.2 MR1 Register Information (MA 5:0 = 01 ) .................................................................................................................. 21 H 7.3.3 MR2 Register Information (MA 5:0 = 02 ) .................................................................................................................. 23 H 7.3.4 MR3 Register Information (MA 5:0 = 03 ) .................................................................................................................. 24 H 7.3.5 MR4 Register Information (MA 5:0 = 04 ) .................................................................................................................. 25 H 7.3.6 MR5 Register Information (MA 5:0 = 05 ) .................................................................................................................. 26 H 7.3.7 MR6 Register Information (MA 5:0 = 06 ) .................................................................................................................. 26 H 7.3.8 MR7 Register Information (MA 5:0 = 07 ) .................................................................................................................. 26 H 7.3.9 MR8 Register Information (MA 5:0 = 08 ) .................................................................................................................. 26 H 7.3.10 MR9 Register Information (MA 5:0 = 09 ) .................................................................................................................. 26 H 7.3.11 MR10 Register Information (MA 5:0 = 0A ) ............................................................................................................... 26 H 7.3.12 MR11 Register Information (MA 5:0 = 0B ) ............................................................................................................... 27 H 7.3.13 MR12 Register Information (MA 5:0 = 0C ) ............................................................................................................... 27 H 7.3.14 MR13 Register Information (MA 5:0 = 0D ) ............................................................................................................... 29 H 7.3.15 MR14 Register Information (MA 5:0 = 0E ) ............................................................................................................... 30 H 7.3.16 MR15 Register Information (MA 5:0 = 0F ) ................................................................................................................ 32 H 7.3.17 MR16 Register Information (MA 5:0 = 10 ) ................................................................................................................ 33 H 7.3.18 MR17 Register Information (MA 5:0 = 11 ) ................................................................................................................ 33 H 7.3.19 MR18 Register Information (MA 5:0 = 12 ) ................................................................................................................ 34 H 7.3.20 MR19 Register Information (MA 5:0 = 13 ) ................................................................................................................ 34 H 7.3.21 MR20 Register Information (MA 5:0 = 14 ) ............................................................................................................... 34 H 7.3.22 MR21 Register (Reserved) (MA 5:0 = 15 ) ................................................................................................................ 34 H 7.3.23 MR22 Register Information (MA 5:0 = 16 ) ................................................................................................................ 35 H 7.3.24 MR23 Register Information (MA 5:0 = 17 ) ................................................................................................................ 36 H 7.3.25 MR24 Register Information (MA 5:0 = 18 ) ................................................................................................................ 36 H 7.3.26 MR25 Register Information (MA 5:0 = 19 ) ................................................................................................................ 37 H 7.3.27 MR26~29 (Reserved) (MA 5:0 = 1A -1D ) ................................................................................................................ 37 H H Publication Release Date: Sep. 18, 2019 Revision: A01-003 - 1 - W66BL6NB / W66CL2NQ 7.3.28 MR30 Register Information (MA 5:0 = 1E ) ............................................................................................................... 37 H 7.3.29 MR31 (Reserved) (MA 5:0 = 1F ) .............................................................................................................................. 37 H 7.3.30 MR32 Register Information (MA 5:0 = 20 ) ................................................................................................................ 37 H 7.3.31 MR33~38 (Reserved) (MA 5:0 = 21 -26 ) ................................................................................................................. 37 H H 7.3.32 MR39 Register Information (MA 5:0 = 27 ) ................................................................................................................ 38 H 7.3.33 MR40 Register Information (MA 5:0 = 28 ) ................................................................................................................ 38 H 7.4 Command Definitions and Timing Diagrams ................................................................................................................ 39 7.4.1 Activate Command ...................................................................................................................................................... 39 7.4.1.1 8-Bank Device Operation .................................................................................................................................. 39 7.4.2 Core Timing ................................................................................................................................................................. 40 7.4.3 Read and Write Access Operations ............................................................................................................................. 41 7.4.4 Read Preamble and Postamble ................................................................................................................................... 41 7.4.5 Burst Read Operation .................................................................................................................................................. 42 7.4.6 Read Timing ................................................................................................................................................................ 46 7.4.7 tLZ(DQS), tLZ(DQ), tHZ(DQS), tHZ(DQ) Calculation ................................................................................................... 46 7.4.7.1 tLZ(DQS) and tHZ(DQS) Calculation for ATE (Automatic Test Equipment) ....................................................... 47 7.4.7.2 tLZ(DQ) and tHZ(DQ) Calculation for ATE (Automatic Test Equipment) ............................................................ 49 7.4.7.3 tRPRE Calculation for ATE (Automatic Test Equipment) ................................................................................... 51 7.4.7.4 tRPST Calculation for ATE (Automatic Test Equipment) ................................................................................... 52 7.4.8 tDQSCK Timing Table ................................................................................................................................................. 53 7.4.8.1 CK to DQS Rank to Rank variation ................................................................................................................... 53 7.4.9 Write Preamble and Postamble ................................................................................................................................... 54 7.4.10 Burst Write Operation .................................................................................................................................................. 55 7.4.11 Write Timing ................................................................................................................................................................ 58 7.4.11.1 tWPRE Calculation for ATE (Automatic Test Equipment) .................................................................................. 59 7.4.11.2 tWPST Calculation for ATE (Automatic Test Equipment) .................................................................................. 60 7.4.12 Read and Write Latencies ........................................................................................................................................... 61 7.4.13 Write and Masked Write operation DQS controls (WDQS Control) .............................................................................. 61 7.4.13.1 WDQS Control Mode 1 - Read Based Control ................................................................................................... 62 7.4.13.2 WDQS Control Mode 2 - WDQS on/off ............................................................................................................ 62 7.4.14 Postamble and Preamble merging behavior ................................................................................................................ 67 7.4.14.1 Read to Read Operation ................................................................................................................................... 67 7.4.14.2 Write to Write Operation.................................................................................................................................... 80 7.4.15 Masked Write Operation .............................................................................................................................................. 90 7.4.15.1 Masked Write Timing constraints for BL16 ........................................................................................................ 92 7.4.16 LPDDR4 Data Mask (DM) and Data Bus Inversion (DBIdc) Function ........................................................................... 94 7.4.17 Precharge Operation ................................................................................................................................................... 97 7.4.17.1 Burst Read Operation Followed by a Precharge ............................................................................................... 98 7.4.17.2 Burst Write Operation Followed by a Precharge ................................................................................................ 99 7.4.17.3 Auto-Precharge Operation ................................................................................................................................ 99 7.4.17.4 Burst Read with Auto-Precharge ..................................................................................................................... 100 7.4.17.5 Burst Write with Auto-Precharge ..................................................................................................................... 101 7.4.18 Auto-Precharge Operation ......................................................................................................................................... 102 7.4.18.1 Delay time from Write to Read with Auto-Precharge ....................................................................................... 103 7.4.19 Refresh command ..................................................................................................................................................... 107 7.4.19.1 Burst Read operation followed by Per Bank Refresh ....................................................................................... 113 7.4.20 Refresh Requirement ................................................................................................................................................ 114 7.4.21 Self Refresh Operation .............................................................................................................................................. 115 7.4.21.1 Self Refresh Entry and Exit ............................................................................................................................. 115 7.4.21.2 Power Down Entry and Exit during Self Refresh ............................................................................................. 116 7.4.21.3 Command input Timing after Power Down Exit ............................................................................................... 117 7.4.21.4 AC Timing Table ............................................................................................................................................. 118 7.4.22 MRR, MRW, MPC Command during tXSR, tRFC ...................................................................................................... 119 7.4.23 MODE REGISTER READ (MRR) .............................................................................................................................. 120 7.4.23.1 MRR after Read and Write command ............................................................................................................. 122 7.4.23.2 MRR after Power-Down Exit ........................................................................................................................... 124 Publication Release Date: Sep. 18, 2019 Revision: A01-003 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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