X-On Electronics has gained recognition as a prominent supplier of W957D6HBCX7I TR DRAM across the USA, India, Europe, Australia, and various other global locations. W957D6HBCX7I TR DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W957D6HBCX7I TR Winbond

W957D6HBCX7I TR electronic component of Winbond
W957D6HBCX7I TR Winbond
W957D6HBCX7I TR DRAM
W957D6HBCX7I TR  Semiconductors

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Part No. W957D6HBCX7I TR
Manufacturer: Winbond
Category: DRAM
Description: DRAM 128Mb pSRAM x16, ADM, 133MHz, Ind temp T&R
Datasheet: W957D6HBCX7I TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 9.0134
10 : USD 6.5571
25 : USD 6.4387
50 : USD 6.3913
100 : USD 5.6107
250 : USD 5.5878
500 : USD 5.292
1000 : USD 5.1554
5000 : USD 5.0872
N/A

Obsolete
   
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We are delighted to provide the W957D6HBCX7I TR from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W957D6HBCX7I TR and other electronic components in the DRAM category and beyond.

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W957D6HB 128Mb Async./Burst/Sync./A/D MUX TABLE OF CONTENTS 1. GENERAL DESCRIPTION .......................................................................................................... 3 2. FEATURES.................................................................................................................................. 3 3. ORDERING INFORMATION ....................................................................................................... 3 4. PIN CONFIGURATION ................................................................................................................ 4 4.1 Ball Assignment ............................................................................................................................... 4 5. PIN DESCRIPTION ..................................................................................................................... 5 5.1 Signal Description ............................................................................................................................ 5 6. BLOCK DIAGRAM ...................................................................................................................... 6 7. INSTRUCTION SET .................................................................................................................... 7 7.1 Bus Operation .................................................................................................................................. 7 8. FUNCTIONAL DESCRIPTION .................................................................................................... 8 8.1 Power Up Initialization ..................................................................................................................... 8 8.1.1 Power-Up Initialization Timing ................................................................................................................... 8 8.2 Bus Operating Modes ...................................................................................................................... 8 8.2.1 Asynchronous Modes ................................................................................................................................ 8 8.2.1.1 READ Operation (ADV LOW) ......................................................................................................................... 9 8.2.1.2 WRITE Operation (ADV LOW) ....................................................................................................................... 9 8.2.2 Burst Mode Operation .............................................................................................................................. 10 8.2.2.1 Burst Mode READ (4-word burst) ................................................................................................................... 10 8.2.2.2 Burst Mode WRITE (4-word burst) ................................................................................................................. 11 8.2.2.3 Refresh Collision During Variable-Latency READ Operation ......................................................................... 12 8.2.3 Mixed-Mode Operation ............................................................................................................................ 13 8.2.4 WAIT Operation ....................................................................................................................................... 13 8.2.4.1 Wired-OR WAIT Configuration ....................................................................................................................... 13 8.2.5 LB / UB Operation ................................................................................................................................. 14 8.3 Low Power Operation .................................................................................................................... 14 8.3.1 Standby Mode Operation ......................................................................................................................... 14 8.3.2 Temperature Compensated Refresh ....................................................................................................... 14 8.3.3 Partial-Array Refresh ............................................................................................................................... 14 8.3.4 Deep Power-Down Operation .................................................................................................................. 14 8.4 Registers ....................................................................................................................................... 15 8.4.1 Access Using CRE .................................................................................................................................. 15 8.4.1.1 Configuration Register WRITE Asynchronous Mode Followed by READ Operation ...................................... 15 8.4.1.2 Configuration Register WRITE Synchronous Mode Followed by READ Operation ........................................ 16 8.4.1.3 Configuration Register READ Asynchronous Mode Followed by READ ARRAY Operation ........................... 17 8.4.1.4 Configuration Register READ Synchronous Mode Followed by READ ARRAY Operation ............................ 18 8.4.2 Software Access ...................................................................................................................................... 19 8.4.2.1 Load Configuration Register ........................................................................................................................... 19 8.4.2.2 Read Configuration Register .......................................................................................................................... 20 8.4.3 Bus Configuration Register ...................................................................................................................... 20 8.4.3.1 Bus Configuration Register Definition ............................................................................................................ 21 8.4.3.2 Burst Length (BCR 2:0 ) Default = Continuous Burst ..................................................................................... 22 8.4.3.3 Burst Wrap (BCR 3 ) Default = No Wrap ........................................................................................................ 22 8.4.3.4 Sequence and Burst Length ........................................................................................................................... 23 8.4.3.5 Drive Strength (BCR 5:4 ) Default = Outputs Use Half-Drive Strength ........................................................... 24 8.4.3.6 Table of Drive Strength ................................................................................................................................... 24 8.4.3.7 WAIT Configuration. (BCR 8 ) ........................................................................................................................ 24 8.4.3.8 WAIT Polarity (BCR 10 ) ................................................................................................................................. 24 8.4.3.9 WAIT Configuration During Burst Operation ................................................................................................... 25 8.4.3.10 Latency Counter (BCR 13:11 ) Default = Three Clock Latency .................................................................... 25 8.4.3.11 Initial Access Latency (BCR 14 ) Default = Variable ..................................................................................... 25 8.4.3.12 Allowed Latency Counter Settings in Variable Latency Mode ....................................................................... 25 Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 1 - W957D6HB 8.4.3.13 Latency Counter (Variable Initial Latency, No Refresh Collision) .................................................................. 26 8.4.3.14 Allowed Latency Counter Settings in Fixed Latency Mode ........................................................................... 26 8.4.3.15 Latency Counter (Fixed Latency) ................................................................................................................. 27 8.4.3.16 Operating Mode (BCR 15 ) ........................................................................................................................... 27 8.4.4 Refresh Configuration Register ............................................................................................................... 28 8.4.4.1 Refresh Configuration Register Mapping ....................................................................................................... 28 8.4.4.2 Partial Array Refresh (RCR 2:0 ) Default = Full Array Refresh ....................................................................... 28 8.4.4.3 Address Patterns for PAR (RCR 4 = 1)......................................................................................................... 29 8.4.4.4 Deep Power-Down (RCR 4 ) Default = DPD Disabled ................................................................................... 29 8.4.5 Device Identification Register .................................................................................................................. 29 8.4.5.1 Device Identification Register Mapping .......................................................................................................... 29 9. ELECTRICAL CHARACTERISTIC ........................................................................................... 30 9.1 Absolute Maximum DC, AC Ratings .............................................................................................. 30 9.2 Electrical Characteristics and Operating Conditions ....................................................................... 30 9.3 Deep Power-Down Specifications .................................................................................................. 31 9.4 Partial Array Self Refresh Standby Current .................................................................................... 31 9.5 Capacitance ................................................................................................................................... 31 9.6 AC Input-Output Reference Wave form .......................................................................................... 31 9.7 AC Output Load Circuit .................................................................................................................. 31 10. TIMING REQUIRMENTS ......................................................................................................... 32 10.1 Read, Write Timing Requirements ............................................................................................... 32 10.1.1 Asynchronous READ Cycle Timing Requirements ............................................................................... 32 10.1.2 Burst READ Cycle Timing Requirements .............................................................................................. 33 10.1.3 Asynchronous WRITE Cycle Timing Requirements .............................................................................. 34 10.1.4 Burst WRITE Cycle Timing Requirements ............................................................................................ 35 10.2 TIMING DIAGRAMS .................................................................................................................... 36 10.2.1 Initialization Period ................................................................................................................................. 36 10.2.2 DPD Entry and Exit Timing Parameters ................................................................................................ 36 10.2.3 Initialization and DPD Timing Parameters ............................................................................................. 36 10.2.4 Asynchronous READ ............................................................................................................................. 37 10.2.5 Single Access Burst READ Operation - Variable Latency..................................................................... 38 10.2.6 Four Word Burst READ Operation-Variable Latency ............................................................................ 39 10.2.7 Single-Access Burst READ Operation-Fixed Latency ........................................................................... 40 10.2.8 Four Word Burst READ Operation-Fixed Latency ................................................................................. 41 10.2.9 Burst READ Terminate at End-of-Row (Wrap Off) ................................................................................ 42 10.2.10 Burst READ Row Boundary Crossing ................................................................................................. 43 10.2.11 Asynchronous WRITE ......................................................................................................................... 44 10.2.12 Burst WRITE Operation Variable Latency Mode .............................................................................. 45 10.2.13 Burst WRITE Operation-Fixed Latency Mode ..................................................................................... 46 10.2.14 Burst WRITE Terminate at End of Row (Wrap Off) ............................................................................. 47 10.2.15 Burst WRITE Row Boundary Crossing ................................................................................................ 48 10.2.17 Asynchronous WRITE Followed by Burst READ ................................................................................ 50 10.2.18 Burst READ Followed by Asynchronous WRITE ................................................................................ 51 10.2.19 Asynchronous WRITE Followed by Asynchronous READ .................................................................. 52 11. PACKAGE DESCRIPTION ..................................................................................................... 53 11.1 Package Dimension ..................................................................................................................... 53 12. REVISION HISTORY ............................................................................................................... 54 Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 2 -

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8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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