Data Sheet Rev. 2.00 / March 2014 ZSSC3036 Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner Mobile Sensing ICs Smart and Mobile ZSSC3036 Low-Power 16-Bit Sensor Signal Conditioner IC Brief Description Benefits Integrated 18-bit calibration math DSP The ZSSC3036 is a sensor signal conditioner (SSC) Fully corrected signal at digital output integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input Layout customized for die-die bonding with signal. Designed for high-resolution altimeter module sensor for high-density chip-on-board assembly applications, the ZSSC3036 can perform offset, Single-pass calibration minimizes calibration st nd span, and 1 and 2 order temperature compen- costs sation of the measured signal. Developed for correc- No external trimming, filter, or buffering com- tion of resistive bridge sensors, it can also provide a ponents required corrected temperature output measured with an Highly integrated CMOS design internal sensor. Excellent for low-voltage and low-power battery The measured and corrected bridge values are applications provided at the digital output pins, which can be 2 Optimized for operation in calibrated resistive configured as I C* ( 3.4MHz) or SPI ( 20MHz). sensor modules Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) run- Physical Characteristics ning a correction algorithm. Calibration coefficients Supply voltage range: 1.8 to 3.6V are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Pro- Current consumption: 1mA (operating mode) gramming the ZSSC3036 is simple via the serial Sleep State current: 50nA (typical) interface. The IC-internal charge pump provides the Temperature resolution: <0.003K/LSB MTP programming voltage. The interface is used for Operation temperatures: 40C to +85C the PC-controlled calibration procedure, which pro- 40C to +110C grams the set of calibration coefficients in memory. Small die size: 1.5mm The ZSSC3036 provides accelerated signal process- Delivery options: die for wafer bonding ing in order to support high-speed control, safety, and real-time sensing applications. It complements 2 ZMDIs additional ZSSC30x6 products. * I C is a trademark of NXP. ** FSO = Full Scale Output. Features ZSSC3036 Application Example Flexible, programmable analog front-end design up to 16-bit scalable, charge-balancing two- segment analog-to-digital converter (ADC) Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor) Internal auto-compensated temperature sensor Digital compensation of individual sensor offset st nd 1 and 2 order digital compensation of sensor st nd gain as well as of 1 and 2 order temperature gain and offset drift Fast sensing: 16-bit conditioned sensor signal -1 measurement rate at more than 200s Typical sensor elements can achieve accuracy of less than 0.10% FSO** -40 to 110C For more information, contact ZMDI via mobile.sensing zmdi.com. 2014 Zentrum Mikroelektronik Dresden AG Rev. 2.00 March 13, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.