HMPP-3862-BLK Broadcom

HMPP-386x Series MiniPak Surface Mount RF PIN Diodes Data Sheet Description/Applications Features These ultra-miniature products represent the blending of Surface mount MiniPak package Avago Technologies proven semiconductor and the latest Better thermal conductivity for higher power dissipa- in leadless packaging technology. tion The HMPP-386x series of general purpose PIN diodes are Single and dual versions designed for two classes of applications. The rfi st is attenu - Matched diodes for consistent performance ators where current consumption is the most important design consideration. The second application for this Low capacitance at zero volts series of diodes is in switches where low capacitance with Low resistance no reverse bias is the driving issue for the designer. Low FIT (Failure in Time) rate* The low dielectric relaxation frequency of the HMPP-386x Six-sigma quality level insures that low capacitance can be reached at zero volts * For more information, see the Surface Mount Schottky Reliability reverse bias at frequencies above 1 GHz, making this PIN Data Sheet. diode ideal for hand held applications. Low junction capacitance of the PIN diode chip, combined Pin Connections and Package Marking with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes. 3 4 Note that Avagos manufacturing techniques assure that AA dice packaged in pairs are taken from adjacent sites on 2 1 the wafer, assuring the highest degree of match. Minipak 1412 is a ceramic based package, while Minipak QFN is a leadframe based package. Productcode Datecode Notes: Package Lead Code Identification (Top View) 1. Package marking provides orientation and identification. 2. See Electrical Specifications for appropriate package marking. Single Anti-parallel Parallel 3 4 3 4 3 4 2 1 2 1 2 1 0 2 5 (Minipak 1412) (Minipak 1412) (Minipak 1412) 1 HMPP-386x Series Absolute Maximum Ratings , T = 5C C Notes: MiniPak 141 / 1. Operation in excess of any one of these conditions may result in permanent dam- Symbol Parameter Units MiniPak QFN age to the device. 2. T = +25C, where T is defined to be the I Forward Current (1 s pulse) Amp 1 C C f temperature at the package pins where contact is made to the circuit board. P Peak Inverse Voltage V 100 IV ESD WARNING: T Junction Temperature C 150 j Handling Precautions Should Be Taken T Storage Temperature C -65 to +150 stg To Avoid Static Discharge. 2 Thermal Resistance C/W 150 jc MiniPak141 Electrical Specifications, T = +5C, each diode C Part Number Package Minimum Breakdown Typical Series HMPP- Marking Code Lead Code Configuration Voltage (V) Resistance () 3860 H 0 Single 50 3.0/1.5* 3862 F 2 Anti-parallel 3865 E 5 Parallel Test Conditions V = V I = 10 mA R BR F Measure f = 100 MHz I 10 A *I = 100 mA R F MiniPak141 Typical Parameters, T = + 5C C Part Number Total Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance HMPP- R () (ns) T (ns) C (pF) T rr T 3860 22 500 80 0.20 3862 3865 Test Conditions I = 1 mA I = 50 mA V = 10 V V = 50V F F R R f = 100 MHz T = 250 mA I = 20 mA f = 1 MHz R F 90% Recovery