LUx HSMP-386x Surface Mount PIN Diodes Data Sheet Description/Applications Features The HSMP-386x series of general purpose PIN diodes are Unique Configurations in Surface Mount Packages designed for two classes of applications. The first is attenu - Add Flexibility ators where current consumption is the most important Save Board Space design consideration. The second application for this Reduce Cost series of diodes is in switches where low capacitance is the Switching driving issue for the designer. Low Distortion Switching Low Capacitance The HSMP-386x series Total Capacitance (C ) and Total T Resistance (R ) are typical specifications. For applications Attenuating T that require guaranteed performance, the general purpose Low Current Attenuating for Less Power HSMP-383x series is recommended. Consumption Matched Diodes for Consistent Performance A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier Better Thermal Conductivity for Higher Power lifetime. Dissipation 1 Low Failure in Time (FIT) Rate Pin Connections and Package Marking, SOT-363 Lead-free Note: 1 6 1. For more information see the Surface Mount PIN Reliability Data Sheet. 2 5 3 4 Notes: 1. Package marking provides orientation, identification, and date code. 2. See Electrical Specifications for appropriate package marking.Package Lead Code Identification, Package Lead Code Identification, Package Lead Code Identification, SOT-23, SOT-143 SOT-323 SOT-363 (Top View) (Top View) (Top View) SERIES SERIES SINGLE SINGLE UNCONNECTED TRIO 65 4 0 2 C B 12 3 COMMON COMMON COMMON COMMON L ANODE CATHODE ANODE CATHODE 3 E 4 F RING QUAD 3 4 1 2 D See separate data sheet HSMP-386D 1 Absolute Maximum Ratings T = +25C C ESD WARNING: Symbol Parameter Unit SOT-23 SOT-323 Handling Precautions Should Be Taken To Avoid I Forward Current (1 s Pulse) Amp 1 1 f Static Discharge. P Peak Inverse Voltage V 50 50 IV T Junction Temperature C 150 150 j T Storage Temperature C -65 to 150 -65 to 150 stg 2 q Thermal Resistance C/W 500 150 jc Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. T = +25C, where T is defined to be the temperature at the package pins where contact is made to C C the circuit board. Electrical Specifications T = 25C, each diode C PIN General Purpose Diodes, Typical Specifications T = 25C A Package Minimum Typical Typical Part Number Marking Lead Breakdown Series Resistance Total Capacitance HSMP- Code Code Configuration Voltage V (V) R () C (pF) BR S T 3860 L0 0 Single 50 3.0/1.5* 0.20 3862 L2 2 Series 3863 L3 3 Common Anode 3864 L4 4 Common Cathode 386B L0 B Single 386C L2 C Series 386E L3 E Common Anode 386F L4 F Common Cathode 386L LL L Unconnected Trio Test Conditions V = V I = 10 mA V = 50 V R BR F R Measure f = 100 MHz f = 1 MHz I 10 A I = 100 mA* R F 2