DZTA42Q-13 Diodes Incorporated

DZTA42Q 300V NPN HIGH VOLTAGE TRANSISTOR IN SOT223 Mechanical Data Description Case: SOT223 This Bipolar Junction Transistor (BJT) is designed to meet the Case Material: Molded Plastic. Green Molding Compound. UL stringent requirements of Automotive Applications. Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin. Solderable per MIL-STD-202, Features Method 208 BV > 300V Weight: 0.112 grams (Approximate) CEO I = 500mA High Collector Current C 2W Power Dissipation Applications Low Saturation Voltage V < 500mV 20mA CE(SAT) Switch-Mode Power Supplies (SMPS) Complementary PNP Type: DZTA92 Video Output Stages Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Motor Driver Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) SOT223 C B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 5) Part Number Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DZTA42Q-13 Automotive K3M 13 12 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See DZTA42Q Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 300 V CBO Collector-Emitter Voltage V 300 V CEO Emitter-Base Voltage V 6 V EBO Collector Current I 500 mA C Base Current I 100 mA B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 2 Power Dissipation W P D (Note 7) 1 (Note 6) 62 Thermal Resistance, Junction to Ambient C/W R JA (Note 7) 125 Thermal Resistance, Junction to Leads (Note 8) R 19.4 C/W JL Operating and Storage Temperature Range T T -65 to +150 C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the collector lead on 50mm x 50mm 1oz copper that is on a single-sided 1.6mm FR-4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as note (6), except mounted on minimum recommended pad (MRP) layout. 8. Thermal resistance from junction to solder-point (at the end of the collector lead). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 DZTA42Q April 2018 Diodes Incorporated www.diodes.com Datasheet Number: DS38748 Rev. 2 - 2