REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 07 through 09. Update boilerplate. Editorial 95-12-07 M. A. Frye changes throughout. B Add device type 10. Editorial changes throughout. 96-08-09 Raymond Monnin C Boilerplate update, part of 5 year review. ksr 06-08-16 Raymond Monnin REV SHEET REV C SHEET 15 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth S. Rice DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87513 01 L A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 4096 x 1 CMOS static RAM 25 ns 02 4096 x 1 CMOS static RAM 35 ns 03 4096 x 1 CMOS static RAM 45 ns 04 1024 x 4 CMOS static RAM 25 ns 05 1024 x 4 CMOS static RAM 35 ns 06 1024 x 4 CMOS static RAM 45 ns 07 1024 x 4 CMOS static RAM 25 ns 08 1024 x 4 CMOS static RAM 35 ns 09 1024 x 4 CMOS static RAM 45 ns 10 1024 x 4 CMOS static RAM 35 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style V GDIP1-T18 or CDIP2-T18 18 dual-in-line X See figure 1 18 flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Voltage on any pin relative to V .......................................-2.0 V dc to +7.0 V dc SS Voltage applied to outputs: devices 01-06, 10 ..............................................................-1.0 V dc to V + 0.5 V dc CC devices 07-09 ....................................................................-0.5 V dc to +7.0 V dc Storage temperature range..................................................-65C to +150C Maximum power dissipation (P ): D devices 01-06 ....................................................................1.0 W devices 07-09 ....................................................................0.605 W device 10 ...........................................................................0.660 W Lead temperature (soldering, 10 seconds) ..........................+260C Thermal resistance, junction-to-case ( ): JC Case V...............................................................................See MIL-STD-1835 Case X...............................................................................15C/W Junction temperature (T ) ....................................................+175C J 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. SIZE STANDARD 5962-87513 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 C 2 DSCC FORM 2234 APR 97