5962-8854504LA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R216-92. 92-06-22 Michael A. Frye B Updated drawing to current requirements. Editorial changes 01-04-04 Raymond Monnin throughout. - gap Added Memory in the SMD title block. Also, boilerplate update and C 07-02-28 Robert M. Heber part of five year review. tcr THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth S. Rice DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88545 01 L A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 5C256L4 64K X 4 low power CMOS SRAM 35 ns 02 5C256L4 64K X 4 low power CMOS SRAM 45 ns 03 5C256L4 64K X 4 low power CMOS SRAM 55 ns 04 5C256L4 64K X 4 low power CMOS SRAM 70 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line X CQCC3-N28 28 Rectangular leadless chip carrier Y CDFP4-F28 28 Flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Voltage on any input relative to V ................................................................................ -0.5 V dc to +7.0 V dc SS Voltage applied to outputs .............................................................................................. -0.5 V dc to +6.0 V dc Storage temperature range ............................................................................................ -65C to +150C Maximum power dissipation (P ) ................................................................................... 1.0 W D Lead temperature (soldering, 10 seconds) ..................................................................... +260C ) ..................................................................... See MIL-STD-1835 Thermal resistance, junction-to-case ( JC Junction temperature (T ) .............................................................................................. +150C 1/ J 1.4 Recommended operating conditions. Supply voltage (V ) ...................................................................................................... 4.5 V dc to 5.5 V dc CC Supply voltage (V ) ...................................................................................................... 0 V dc SS Input high voltage (V ) .................................................................................................. 2.2 V dc to V +0.5 V dc IH CC Input low voltage (V ) .................................................................................................... -0.5 V dc to +0.8 V dc 2/ IL Case operating temperature range (T ) ......................................................................... -55C to +125C C 1/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ V minimum = -3.0 V dc for pulse width less than 20 ns. IL SIZE STANDARD 5962-88545 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 C 2 DSCC FORM 2234 APR 97