REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Redrawn with changes made under NOR No. 5962-R116-92 Revision 94 01 04 M. A. Frye B and NOR No. 5962-R004-93 Revision C. Added vendor CAGE numbers 65896 and OK6N4 to the drawing as sources of supply. Added device types 10UX, 10YX, 11UX, 11YX, and 12UX, 12YX. Removed vendor CAGE number OBYV4 from drawing as approved source of supply. Removed vendor CAGE number 61772 as approved source of supply for devices 01ZX, 02ZX, 03ZX, 05XX, 05YX, 05ZX, 05UX, 06ZX, 07XX, 07YX, 07ZX, 07UX, 08XX, 08YX, 08ZX, 08UX, 09XX, 09YX, 09ZX, and 09UX. Added vendor CAGE 61772 as a source of supply for devices 01MX, 01NX, 02MX, 02NX, 03MX, 03NX, 04NX, 04MX, 06MX, and 06NX. Remove vendor CAGE 34649 as a source of supply for devices 02XX, 02YX, 04XX, and 04YX. Editorial changes throughout. E Drawing updated to reflect current requirements. Editorial changes 00 10 12 Raymond Monnin throughout. - gap F Added device to cover 12 ns access time. Updated boilerplate, 02 08 16 Raymond Monnin editorial changes throughout. ksr G Boilerplate update and part of five year review. tcr 07 11 01 Robert M. Heber THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV G G G SHEET 15 16 17 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PREPARED BY PMIC N/A Kenneth Rice DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY Ray Monnin 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88552 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 32K x 8 low power CMOS SRAM 100 ns 02, 07 70 ns 03, 08 55 ns 04, 09 45 ns 05 35 ns 06 25 ns 10 20 ns 11 17 ns 12 15 ns 13 12 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y CQCC1-N32 32 Rectangular leadless chip carrier Z CDFP3-F28 28 Flat pack U CDIP3-T28 or GDIP4-T28 28 Dual-in-line T CDFP4-T28 28 Flat pack M CQCC3-N28 28 Rectangular leadless chip carrier N GDFP2-F28 28 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (V )................................................................... -0.5 V dc to +7.0 V dc 2/ CC Input voltage range............................................................................... -0.5 V dc to +6.0 V dc Storage temperature range................................................................... -65C to +150C Thermal resistance, junction-to-case ( )............................................ See MIL-STD-1835 JC Junction temperature (T)..................................................................... +150C 3/ J Power dissipation (P).......................................................................... 1.0 W D Junction temperature (soldering, 10 seconds)...................................... +260C 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ All voltages referenced to V . CC 3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. SIZE STANDARD 5962-88552 MICROCIRCUIT DRAWING A DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 G 2 DSCC FORM 2234 APR 97