5962-8872501LA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A 89-10-16 M. A. Frye Add vendor CAGE number 75569 to the drawing. Add vendor CAGE number 6Y440 to device types 03LX, 03XX, 04LX, and 04XX. Removed Vendor CAGE number OBK02 from drawing as approved source of supply. Editorial changes throughout. B Drawing updated to reflect current requirements. Editorial changes 00-10-23 Raymond Monnin throughout. - gap C Boilerplate update and part of five year review. tcr 07-02-23 Joseph Rodenbeck THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Jamison DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Charles Reusing 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88725 01 L X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 5C2561 256K x 1 CMOS SRAM 35 ns 02 5C2561 256K x 1 CMOS SRAM 45 ns 03 5C2561 256K x 1 CMOS SRAM 55 ns 04 5C2561 256K x 1 CMOS SRAM 70 ns 05 5C2561 256K x 1 CMOS SRAM 25 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line package X CQCC3-N28 28 Rectangular leadless chip carrier Y CDFP4-F28 28 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Voltage on any input relative to V ............................................... -0.5 V dc to +7.0 V dc SS Voltage applied to Q ...................................................................... -0.5 V dc to +6.0 V dc Storage temperature range ........................................................... -65C to +150C Maximum power dissipation (P ) ................................................... 1.0 W D Lead temperature (soldering, 10 seconds) .................................... +260C Thermal resistance, junction-to-case ( ) .................................... See MIL-STD-1835 JC Junction temperature (T ) .............................................................. +150C 1/ J 1.4 Recommended operating conditions. Supply voltage range (V ) ........................................................... 4.5 V dc to 5.5 V dc CC Supply voltage (V ...................................................................... 0 V SS) Input high voltage range (V ) ........................................................ +2.2 V dc to +6.0 V dc IH Input low voltage range (V ) ......................................................... -0.5 V dc to +0.8 V dc 2/ IL Case operating temperature range (T ) ....................................... -55C to +125C C 1/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ V minimum = -3.0 V dc for pulse width less than 20 ns. IL SIZE STANDARD 5962-88725 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 C 2 DSCC FORM 2234 APR 97