X-On Electronics has gained recognition as a prominent supplier of 5962-8969001LA SRAM across the USA, India, Europe, Australia, and various other global locations. 5962-8969001LA SRAM are a product manufactured by E2v. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

5962-8969001LA E2v

5962-8969001LA electronic component of E2v
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See Product Specifications
Part No.5962-8969001LA
Manufacturer: E2v
Category: SRAM
Description: SRAM Chip Async Single 5V 16K-bit 2K x 8 25ns 24-Pin CDIP
Datasheet: 5962-8969001LA Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 349.4758 ea
Line Total: USD 349.48

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 17 Jul to Tue. 23 Jul
MOQ : 1
Multiples : 1
1 : USD 349.4758
10 : USD 227.2725
50 : USD 190.4185
100 : USD 176.1306
250 : USD 160.1282
500 : USD 149.9102
1000 : USD 143.7967
2500 : USD 138.1508
5000 : USD 135.5011
10000 : USD 130.4787

0
Ship by Wed. 17 Jul to Tue. 23 Jul
MOQ : 1
Multiples : 1
1 : USD 354.3903
10 : USD 230.4686

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Access Time
Maximum Clock Frequency
Mounting Style
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Address Bus
Operating Temp Range
Package Type
Pin Count
Density
Number Of Words
Word Size
Sync/Async
Operating Temperature Classification
Number Of Ports
Architecture
Rad Hardened
Operating Supply Voltage Typ
Operating Supply Voltage Min
Operating Supply Voltage Max
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We are delighted to provide the 5962-8969001LA from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 5962-8969001LA and other electronic components in the SRAM category and beyond.

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REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED 06-10-26 Raymond Monnin A Boilerplate update, part of 5 year review. ksr THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Kenneth S. Rice DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89690 01 J A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Acess time 01 1/ 2K X 8 CMOS SRAM 25 ns 02 1/ 2K X 8 CMOS SRAM 20 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line package K GDFP2-F24 or CDFP3-F24 24 flat package L GDIP3-T24 or CDIP4-T24 24 dual-in-line package X CQCC1-N32 32 rectangular chip carrier package Y See Figure 1 24 rectangular chip carrier package Z CQCC3-N28 28 rectangular chip carrier package 3 CQCC1-N28 28 rectangular chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 2/ Supply voltage range (V ) ------------------------------------ -0.5 V dc to 7 V dc CC Input voltage range 2/ ------------------------------------------ 0.5 V to V +0.5 V CC Output voltage range in high impedance state ---------- -0.5 V dc to 7 V dc Output current----------------------------------------------------- 20 mA Storage temperature range------------------------------------ -65 C to +150C Power dissipation, (P ) ---------------------------------------- 864 mW D Lead temperature (soldering, 10 seconds) ---------------- +275C Junction temperature (T ) ------------------------------------- +175 C J Thermal resistance, junction-to-case ( ):. JC Cases J, K, L, X, Z, and 3------------------------------ See MIL-STD-1835 Case Y------------------------------------------------------ 20C/W 1.4 Recommended operating conditions. Supply voltage range (V ) ------------------------------------ 4.5 V dc minimum to 5.5 V dc maximum CC High level Input voltage range (V ) ------------------------- 2.2 V dc minimum to V + 0.5 V dc maximum IH CC Low level Input voltage range (V ) 3/ ---------------------- -0.5 V dc minimum to 0.8 V dc maximum IL Case operating temperature range (T)-------------------- -55C to +125C C 1/ Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ All voltages are with respect to GND. 3/ V (minimum) of -3 V dc for short pulse durations of 20 ns or less. Prolonged operation at V levels below -1 V dc will IL IL result in excessive currents that may damage the device. SIZE STANDARD 5962-89690 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 A 2 DSCC FORM 2234 APR 97

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
E2v Aerospace & Defense
e2v Technologies

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