Real time clock module 2 Product Number REAL TIME CLOCK MODULE (I C-Bus) RX-8571SA : X1B000072000100 Low current consumption RX-8571LC : X1B000052000100 RX-8571SA / LC Built-in frequency adjusted 32.768 kHz crystal unit. 2 Interface Type : I C-Bus Interface (400 kHz) Operating voltage range : 1.6 V to 5.5 V Wide voltage for timekeeping : 1.3 V to 5.5 V Low backup current : 220 nA / 3 V (Typ.) 32.768 kHz frequency output function : C-MOS output With Control Pin Built-in user RAM :128 bit (8 bit x 16, SRAM) The various functions include full calendar, alarm, timer,etc. (Long-running timer : 65535 hours) 2 * The I C-Bus is a trademark of NXP Semiconductors Block diagram Overview ( 32.768 kHz ) 32.768 kHz frequency output function FOE pin enable output on/off control. XD XG Output frequency can be selected OSC DIVIDER CLOCK as 32.768 kHz, 1024 Hz, 1 Hz. and CALENDAR FOE FOUT CONTROLLER FOUT Timer Function TIMER REGISTER Timer function can be set up between INTERRUPTS / IRQ 1/4096 second and 65535 hours. CONTROLLER ALARM REGISTER Timing period are 1 h, 1 min, 64 Hz, 4096 Hz. It is recorded automatically to TF-bit at the time of CONTROL event occurs, and possible to output with /IRQ pin REGISTER /BM output. and DAS INTERFACE Alarm function SYSTEM CIRCUIT Alarm function can be set to day of week, SDA CONTROLLER day, hour, or minute. SCL It is recorded automatically to AF-bit at the time of event occurs, and possible to output with /IRQ pin USER RAM 128 bit output. User RAM 128 bit (8 bit x 16, SRAM) Terminal connection / External dimensions (Unit:mm) RX 8571 SA RX 8571 LC 1. GND 14. FOUT 1. FOE 12. VDD 2. N.C. 13. N.C. 2. /BM 11. N.C. 3. DAS 12. N.C. 3. SDA 10. N.C. 4. SCL 11. N.C. 5.0 2.4 4. SCL 9. N.C. 5. SDA 10. / IRQ 5. DAS 8. /IRQ 6. /BM 9. N.C. 7.4 7. FOE 8. VDD 6. GND 7. FOUT 2.8 SOP - 14 pin VSOJ 12pin The metal case inside of the molding compound may be exposed on the top or bottom of this product. This purely cosmetic and does not have any effect on quality, reliability or electrical specs. *Stop using the glue Any glue must never use it after soldering LC-package to a circuit board.This product has glass on the back side of a package.When glue invasions between circuit board side and glass side, then glass cracks by thermal expansion of glue.In this case a crystal oscillation stops.Consider glue abolition or glue do not touch to LC-package Specifications (characteristics) Refer to application manual for details. Current consumption characteristics Recommended Operating Conditions Item Symbol Conditions Min. Typ. Max. Unit Item Symbol Conditions Min. Typ. Max. Unit Power voltage VDD - 1.6 3.0 5.5 V FOE=/BM=L LC Clock voltage VCLK - 1.3 3.0 5.5 V - 220 400 type FOUT= OFF Operating TOPR - -40 +25 +85 C temperature /IRQ = OFF nA VDD =3.0V SA - 200 400 Ta= +25 C Frequency characteristics type Current IDD Item Symbol Conditions Rating Unit Consumption FOE=/BM=L Frequency Ta = +25 C 6 FOUT= OFF f / f 10 B: 5 23 tolerance VDD = 3.0 V /IRQ = OFF - - - 550 nA VDD =3.0V Oscillation Ta = +25 C tSTA 1 Max. s Ta= -40 C to +85 C start up time VDD = 1.6 V Please ask for tighter tolerance. ( Equivalent to 1 minute of monthly deviation ) 1.27 3.2 10.1 0.5 1.2 3.6 PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM CONFORMING TO INTERNATIONAL STANDARDS At Seiko Epson, all environmental initiatives operate under the Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous ISO 14000 is an international standard for environmental improvements. The environmental management system (EMS) management that was established by the International operates under the ISO 14001 environmental management standard. Standards Organization in 1996 against the background of All of our major manufacturing and non-manufacturing sites, in growing concern regarding global warming, destruction of the ozone layer, and global deforestation. Japan and overseas, completed the acquisition of ISO 14001 certification. WORKING FOR HIGH QUALITY In order provide high quality and reliable products and services IATF 16949 is the international standard that added the than meet customer needs, Seiko Epson made early efforts towards sector-specific supplemental requirements for automotive obtaining ISO9000 series certification and has acquired ISO9001 for industry based on ISO9001. all business establishments in Japan and abroad. We have also acquired IATF 16949 certification that is requested strongly by major automotive manufacturers as standard. Explanation of the mark that are using it for the catalog Pb free. Complies with EU RoHS directive. *About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive. (Contains Pb in sealing glass, high melting temperature type solder or other.) Designed for automotive applications such as Car Multimedia, Body Electronics, Remote Keyless Entry etc. Designed for automotive applications related to driving safety (Engine Control Unit, Air Bag, ESC etc ). NOTICEPLEASE READ CAREFULLY BELOW BEFORE THE USE OF THIS DOCUMENT Seiko Epson Corporation 2020 1. The content of this document is subject to change without notice. Before purchasing or using Epson products, please contact with sales representative of Seiko Epson Corporation (Epson) for the latest information and be always sure to check the latest information published on Epsons official web sites and resources. 2. 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