Real time clock module 2 Product Number (Please contact us) REAL TIME CLOCK MODULE (I C-Bus) RX-8571SA : X1B000072000100 Low current consumption RX-8571NB : X1B000062000100 RX-8571LC : X1B000052000100 RX - 8571SA/NB /LC Built-in frequency adjusted 32.768kHz crystal unit. 2 Interface Type : I C-Bus Interface (400kHz) Operating voltage range : 1.6V to5.5V Wide voltage for timekeeping : 1.3Vto5.5V Low backup current : 220nA / 3V (Typ.) 32.768 kHz frequency output function : C-MOS output With Control Pin Built-in user RAM :128 bit (8 bit x 16, SRAM) Actual size The various functions include full calendar, alarm, timer,etc. RX-8571SA RX-8571NB RX-8571LC (Long-running timer : 65535 hours) 2 * The I C-Bus is a trademark of NXP Semiconductors Block diagram Overview ( 32.768 kHz ) 32.768 kHz frequency output function FOE pin enable output on/off control. XD XG Output frequency can be selected OSC DIVIDER CLOCK as 32.768 kHz, 1024 Hz, 1 Hz. and CALENDAR FOE FOUT CONTROLLER FOUT Timer Function TIMER REGISTER Timer function can be set up between INTERRUPTS / IRQ 1/4096 second and 65535 hours. CONTROLLER ALARM REGISTER Timing period are 1 h, 1 min, 64 Hz, 4096 Hz. It is recorded automatically to TF-bit at the time of CONTROL event occurs, and possible to output with /IRQ pin REGISTER /BM output. and INTERFACE DAS Alarm function SYSTEM CIRCUIT Alarm function can be set to day of week, SDA CONTROLLER day, hour, or minute. SCL It is recorded automatically to AF-bit at the time of event occurs, and possible to output with /IRQ pin USER RAM 128 bit output. User RAM 128 bit (8 bit x 16, SRAM) Terminal connection /External dimensions (Unit:mm) RX 8571 NB RX 8571LC RX 8571 SA 1. FOE 22. N.C. 1. GND 14. FOUT 1. FOE 12. VDD 2. /BM 21. N.C. 2. N.C. 13. N.C. 3. (GND) 20. N.C. 2. /BM 11. N.C. 4. SDA 19. N.C. 3. DAS 12. N.C. 5. SCL 18. N.C. 3. SDA 10. N.C. 4. SCL 11. N.C. 6. DAS 17. N.C. 5.0 2.4 4.8 4. SCL 9. N.C. 7. GND 16. N.C. 5. SDA 10. / IRQ 8. N.C. 15. N.C. 1.3 0.1 5. DAS 8. /IRQ 6. /BM 9. N.C. 9. FOUT 14. N.C. 7.4 0.2 10. /IRQ 13. 6. GND 7. FOUT 2.8 7. FOE 8. VDD 5.0 0.2 11. VDD 12. SOP - 14 pin VSOJ 12pin SON 22 pin The metal case inside of the molding compound may be exposed on the top or bottom of this product. This purely cosmetic and does not have any effect on quality, reliability or electrical specs. *Stop using the glue Any glue must never use it after soldering LC-package to a circuit board.This product has glass on the back side of a package.When glue invasions between circuit board side and glass side, then glass cracks by thermal expansion of glue.In this case a crystal oscillation stops.Consider glue abolition or glue do not touch to LC-package Specifications (characteristics) Refer to application manual for details. Recommended Operating Conditions Current consumption characteristics Item Symbol Conditions Min. Typ. Max. Unit Item Symbol Conditions Min. Typ. Max. Unit Power voltage VDD - 1.6 3.0 5.5 V LC FOE=/BM=L Clock voltage VCLK - 1.3 3.0 5.5 V - 220 400 type Operating FOUT=OFF TOPR - -40 +25 +85 C temperature /IRQ=OFF nA VDD =3.0V SA/NB - 200 400 Ta= +25 C type Frequency characteristics Current IDD Item Symbol Conditions Rating Unit Consumption FOE=/BM=L Frequency Ta= +25 C 6 FOUT=OFF f / f 10 B: 5 23 tolerance VDD = 3.0 V /IRQ=OFF - - - 550 nA VDD =3.0V Oscillation Ta= +25 C tSTA 1 Max. s Ta= -40 Cto+85 C start up time VDD = 1.6 V Please ask for tighter tolerance.( Equivalent to 1 minute of monthly deviation ) 1.27 3.20.1 10.1 0.2 0.5 6.3Max. 0.5 1.2Max. 3.6 PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM CONFORMING TO INTERNATIONAL STANDARDS At Seiko Epson, all environmental initiatives operate under the Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous ISO 14000 is an international standard for environmental improvements. The environmental management system (EMS) management that was established by the International operates under the ISO 14001 environmental management standard. Standards Organization in 1996 against the background of All of our major manufacturing and non-manufacturing sites, in growing concern regarding global warming, destruction of the ozone layer, and global deforestation. Japan and overseas, completed the acquisition of ISO 14001 certification. WORKING FOR HIGH QUALITY In order provide high quality and reliable products and services than meet customer needs, ISO/TS16949 is the international standard that added the Seiko Epson made early efforts towards obtaining ISO9000 series sector-specific supplemental requirements for automotive certification and has acquired ISO9001 for all business industry based on ISO9001. establishments in Japan and abroad. We have also acquired ISO/TS 16949 certification that is requested strongly by major automotive manufacturers as standard. Explanation of the mark that are using it for the catalog Pb free. Complies with EU RoHS directive. *About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive. (Contains Pb in sealing glass, high melting temperature type solder or other.) Designed for automotive applications such as Car Multimedia, Body Electronics, Remote Keyless Entry etc. Designed for automotive applications related to driving safety (Engine Control Unit, Air Bag, ESC etc ). Notice This material is subject to change without notice. Any part of this material may not be reproduced or duplicated in any form or any means without the written permission of Seiko Epson. The information about applied data, circuitry, software, usage, etc. written in this material is intended for reference only. Seiko Epson does not assume any liability for the occurrence of customer damage or infringing on any patent or copyright of a third party. 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