X-On Electronics has gained recognition as a prominent supplier of LDES250UF6S Board Mount Pressure Sensors across the USA, India, Europe, Australia, and various other global locations. LDES250UF6S Board Mount Pressure Sensors are a product manufactured by First Sensor. We provide cost-effective solutions for Board Mount Pressure Sensors, ensuring timely deliveries around the world.

LDES250UF6S First Sensor

LDES250UF6S electronic component of First Sensor
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See Product Specifications
Part No.LDES250UF6S
Manufacturer: First Sensor
Category: Board Mount Pressure Sensors
Description: Board Mount Pressure Sensors Digital Sensor
Datasheet: LDES250UF6S Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 65.087 ea
Line Total: USD 65.09 
Availability - 58
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
58
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 65.087
10 : USD 65.076
25 : USD 50.534
50 : USD 47.905
84 : USD 40.711

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Operating Pressure
Pressure Type
Accuracy
Output Type
Mounting Style
Operating Supply Voltage
Port Type
Package / Case
Output Voltage
Packaging
Series
Brand
Interface Type
Port Size
Maximum Operating Temperature
Minimum Operating Temperature
Operating Supply Current
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We are delighted to provide the LDES250UF6S from our Board Mount Pressure Sensors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LDES250UF6S and other electronic components in the Board Mount Pressure Sensors category and beyond.

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LDE series digital low dierff ential pressure sensors The LDE dieff rential low pressure sensors are based on thermal flow measurement of gas through a micro-flow channel integrated within the sensor chip. The innovative LDE technology features superior sensitivity especially for ultra low pressures. The extremely low gas flow through the sensor ensures high immunity to dust contamination, humidity and long tubing compared to other flow-based pressure sensors. Features Certificates Applications Ultra-low pressure ranges from 25 to 500 Pa Quality Management System according to Medical (0.1 to 2 inH O) EN ISO 13485 and EN ISO 9001 Ventilators 2 Pressure sensor based on thermal micro- RoHS and REACH compliant Spirometers flow measurement CPAP High flow impedance Sleep diagnostic equipment very low flow-through leakage Nebulizers high immunity to dust and humidity Media compatibility Oxygen conservers/concentrators no loss in sensitivity using long tubing Insulff ators/endoscopy Calibrated and temperature compensated Air and other non-corrosive gases Unique offset autozeroing feature ensuring Industrial superb long-term stability HVAC Osff et accuracy better than 0.2% FS VAV Total accuracy better than 0.5% FS typical Filter monitoring On-chip temperature sensor Burner control Analog output and digital SPI interface Fuel cells No position sensitivity Gas leak detection Gas metering Fume hood Instrumentation Security systems E / 11815 / G Subject to change without notice www.first-sensor.com contact first-sensor.com Page 1/13LDE series digital low dierff ential pressure sensors Maximum ratings Parameter Min. Max. Unit Supply voltage V LDE...3... 2.70 3.60 S V DC LDE...6... 4.75 5.25 Output current 1 mA Soldering recommendations (1, 2) Reflow soldering Average preheating temperature gradient 1.5 K/s Time above 217 C 74 s Time above 240 C 30 Peak temperature 245 C Cooling temperature gradient -1.4 K/s Wave soldering, pot temperature 260 C Hand soldering, tip temperature 370 Temperature ranges Compensated 0 +70 Operating -20 +80 C Storage -40 +80 Humidity limits (non-condensing) 97 %RH (3) Vibration 20 g (4) Mechanical shock 500 Pressure sensor characteristics (5) (5) Part no. Operating pressure Proof pressure Burst pressure LDES025U... 0...25 Pa / 0...0.25 mbar (0.1 inH2O) LDES050U... 0...50 Pa / 0...0.5 mbar (0.2 inH2O) LDES100U... 0...100 Pa / 0...1 mbar (0.4 inH O) 2 LDES250U... 0...250 Pa / 0...2.5 mbar (1 inH O) 2 LDES500U... 0...500 Pa / 0...5 mbar (2 inH2O) 2 bar 5 bar (30 psi) (75 psi) LDES025B... 0...25 Pa / 0...0.25 mbar (0.1 inH2O) LDES050B... 0...50 Pa / 0...0.5 mbar (0.2 inH O) 2 LDES100B... 0...100 Pa / 0...1 mbar (0.4 inH O) 2 LDES250B... 0...250 Pa / 0...2.5 mbar (1 inH O) 2 LDES500B... 0...500 Pa / 0...5 mbar (2 inH2O) (6) Gas correction factors Gas type Correction factor Dry air 1.0 Oxygen (O2) 1.07 Nitrogen (N2) 0.97 Argon (Ar) 0.98 Carbon dioxide (CO ) 0.56 2 Specification notes (4) 5 shocks, 3 axes, MIL-STD-883E, Method 2002.4. (1) Recommendations only. Actually reflow settings depend on many factors, for (5) The max. common mode pressure is 5 bar. example, number of oven heating and cooling zones, type of solder paste/flux (6) For example with a LDES500... sensor measuring CO gas, at full-scale output 2 used, board and component size, as well as component density. It is the the actual pressure will be: responsibility of the customer to fine tune their processes for optimal results. P = P x gas correction factor = 500 Pa x 0.56 = 280 Pa eff Sensor (2) Handling instruction: Products are packaged in vacuum sealed moisture P = True differential pressure eff barrier bag with a floor life of 168hours (<30C, 60% R.H.). If floor life or P = Differential pressure as indicated by output signal Sensor environmental conditions have been exceeded prior to reflow assembly, baking is recommended. Recommended bake-out procedure is 72 hours 60C. (3) Sweep 20 to 2000 Hz, 8 min, 4 cycles per axis, MIL-STD-883, Method 2007. E / 11815 / G Subject to change without notice www.first-sensor.com contact first-sensor.com Page 2/13

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8542.31.20 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
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