X-On Electronics has gained recognition as a prominent supplier of GB100XCP12-227 IGBT Modules across the USA, India, Europe, Australia, and various other global locations. GB100XCP12-227 IGBT Modules are a product manufactured by GeneSiC Semiconductor. We provide cost-effective solutions for IGBT Modules, ensuring timely deliveries around the world.

GB100XCP12-227 GeneSiC Semiconductor

GB100XCP12-227 electronic component of GeneSiC Semiconductor
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Part No.GB100XCP12-227
Manufacturer: GeneSiC Semiconductor
Category: IGBT Modules
Description: IGBT Module PT Single 1200 V 100 A Chassis Mount SOT-227
Datasheet: GB100XCP12-227 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 290.706
10 : USD 276.6777
25 : USD 267.3216
N/A

Obsolete
0
MOQ : 150
Multiples : 150
150 : USD 209.5644
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Gate-Emitter Leakage Current
Maximum Operating Temperature
Minimum Operating Temperature
Packaging
Package / Case
Series
Brand
Mounting Style
Maximum Gate Emitter Voltage
Factory Pack Quantity :
Technology
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
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We are delighted to provide the GB100XCP12-227 from our IGBT Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GB100XCP12-227 and other electronic components in the IGBT Modules category and beyond.

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GB100XCP12-227 IGBT/SiC Diode Co-pack V = 1200 V CES I = 100 A CM V = 1.9 V CE(SAT) Features Package Optimal Punch Through (OPT) technology RoHS Compliant 2 SiC freewheeling diode Positive temperature coefficient for easy paralleling Extremely fast switching speeds 3 2 Temperature independent switching behavior of SiC rectifier Best RBSOA/SCSOA capability in the industry 3 High junction temperature 1 1 Industry standard packaging 3 SOT 227 Advantages Applications Industry s highest switching speeds Solar Inverters High temperature operation Aerospace Actuators Improved circuit efficiency Server Power Supplies Low switching losses Resonant Inverters > 100 kHz Inductive Heating Electronic Welders Maximum Ratings at T = 175 C, unless otherwise specified j Parameter Symbol Conditions Values Unit IGBT Collector-Emitter Voltage V 1200 V CES DC-Collector Current I T 130 C 100 A C C Limited by T Peak Collector Current I vjmax 200 A CM Gate Emitter Peak Voltage V 20 V GES V = 900 V, V 1200 V CC CEM IGBT Short Circuit SOA t 10 s psc V 15 V, Tv 125 C GE j Operating Temperature T -40 to +175 C vj Storage Temperature T -40 to +175 C stg I < 1 mA, 50/60 Hz, t = 1 s Isolation Voltage V 3000 V ISOL SOL Free-wheeling Silicon Carbide diode T 130 C DC-Forward Current I C 100 A F T = 25 C, t = 10 s C Non Repetitive Peak Forward Current I tbd A FM P t = 10 ms, half sine, T = 25 C C Surge Non Repetitive Forward Current I tbd A F,SM P Thermal Characteristics Thermal resistance, junction - case R IGBT 0.08 C/W thJC Thermal resistance, junction - case R SiC Diode 0.53 C/W thJC Values Mechanical Properties min. typ. max. Mounting Torque M 1.5 Nm d Terminal Connection Torque 1.3 1.5 Nm Weight 29 g Case Color Black Dimensions 38 x 25.4 x 12 mm Feb 2012 GB100XCP12-227 Electrical Characteristics at T = 175 C, unless otherwise specified j Values Parameter Symbol Conditions Unit min. typ. max. IGBT V = V , I = 4 mA, T = 25 C Gate Threshold Voltage V GE CE C j 5 6.2 7 V GE(th) V = 0 V, V = V , T = 25 C 0.10 1 mA I GE CE CES j CES,25 Collector-Emitter Leakage Current I V = 0 V, V = V , T = 175 C 3.15 mA CES,175 GE CE CES j Gate-Leakage Current I V = 0 V, V = 20 V, T = 175 C -400 400 nA GES CE GE j Collector-Emitter Threshold Voltage V T = 25C 1.1 V CE(TO) j R V = 15 V, T = 25 C 7.9 m CE,25 GE j Collector-Emitter Slope Resistance V = 15 V, T = 175 C R GE j 11.4 m CE,175 I = 100 A, V = 15 V, C GE Collector-Emitter Saturation Voltage V 1.9 (2.2) V CE(SAT) T = 25 C (175 C) j Input Capacitance C 8.55 nF ies V = 0 V, V = 25 V, GE CE Output Capacitance C 1.39 nF oes f = 1 MHz, T = 150 C j Reverse Transfer Capacitance C 0.25 nF res Internal Gate Resistance R 2 Gint V = 750 V, I = 100 A, CC C Gate Charge Q 900 (900) nC G V = -8..15 V, T = 25 C (125 C) GE j T = 25 C (175 C) Module Lead Resistance R c tbd m mod T =175 C, R =56, V =1200 V, j g CC Reverse Bias Safe Operating Area RBSOA 150 A V =15 V GE Short Circuit Current I T = 175 C, R = 56, V = 900 V, 470 A sc j g CC V = 15 V Short Circuit Duration t GE 10 s sc Rise Time t 254 ns r Fall Time t 153 ns f V = 800 V, I = 100 A, CC C Turn On Delay Time t 244 ns d(on) R = R = 10 , gon goff V = 15 V, V = -8 V, Turn Off Delay Time t GE(on) GE(off) 488 ns d(off) L = 0.8 H, T= 25 C S j Turn-On Energy Loss Per Pulse E 14.2 mJ on Turn-Off Energy Loss Per Pulse E 15.7 mJ off Rise Time t 211 ns r Fall Time t 172 ns f V = 800 V, I = 100 A, CC C Turn On Delay Time t R = R = 10 , 240 ns d(on) gon goff = 15 V, V = -8 V, Turn Off Delay Time t VGE(on) GE(off) 636 ns d(off) L = 0.8 H, T= 175 C S j Turn-On Energy Loss Per Pulse E 11.1 mJ on Turn-Off Energy Loss Per Pulse E 21.8 mJ off Free-wheeling Silicon Carbide Diode I = 100 A, V = 0 V, F GE Forward Voltage V 2.08 (3.5) V F T = 25 C (175 C ) j Threshold Voltage at Diode V T = 25 C 0.8 V D(TO) j Peak Reverse Recovery Current I 10 A rrm I = 100 A, V = 0 V, V = 800 V, F GE R -dI /dt = 625 A/s, T = 175 C Reverse Recovery Time t F j 100 ns rr Rise Time t 148 ns r V = 800 V, I = 100 A, CC C Fall Time t 336 ns f R = R = 10 , gon goff Turn-On Energy Loss Per Pulse E = 15 V, V = -8 V, 218 J on VGE(on) GE(off) L = 0.8 H, T= 25 C S j Turn-Off Energy Loss Per Pulse E 113 J off Reverse Recovery Charge Q 730 nC rr Rise Time t 178 ns r V = 800 V, I = 100 A, CC C Fall Time t 268 ns f R = R = 10 , gon goff Turn-On Energy Loss Per Pulse E 23 J on = 15 V, V = -8 V, VGE(on) GE(off) Turn-Off Energy Loss Per Pulse E 334 J off L = 0.8 H, T= 175 C S j Reverse Recovery Charge Q 480 nC rr Feb 2012

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8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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