X-On Electronics has gained recognition as a prominent supplier of DF11MR12W1M1B11BOMA1 discrete semiconductor modules across the USA, India, Europe, Australia, and various other global locations. DF11MR12W1M1B11BOMA1 discrete semiconductor modules are a product manufactured by Infineon. We provide cost-effective solutions for discrete semiconductor modules, ensuring timely deliveries around the world.

DF11MR12W1M1B11BOMA1 Infineon

DF11MR12W1M1B11BOMA1 electronic component of Infineon
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See Product Specifications
Part No.DF11MR12W1M1B11BOMA1
Manufacturer: Infineon
Category:Discrete Semiconductor Modules
Description: Module; diode/transistor; Uds:1.2kV; Id:50A; AG-EASY1BM-2; screw
Datasheet: DF11MR12W1M1B11BOMA1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 149.6775
5 : USD 146.7429
10 : USD 139.8913
25 : USD 139.767
50 : USD 139.767
100 : USD 139.767
250 : USD 133.0149
1000 : USD 133.0024
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1
1 : USD 166.2556
N/A

Obsolete
     
Manufacturer
Product Category
Technology
Polarisation
Mounting
Case
Electrical Mounting
Semiconductor Structure
Topology
Type Of Module
Max Forward Impulse Current
Drain-Source Voltage
Drain Current
On-State Resistance
Gate-Source Voltage
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DF11MR12W1M1 B11 EasyPACK Modul mit CoolSiC Trench MOSFET und PressFIT / NTC EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC Vorlufige Daten / Preliminary Data V = 1200V DSS I = 50A / I = 100A D nom DRM Potentielle Anwendungen Potential Applications Solar Anwendungen Solar applications Elektrische Eigenschaften Electrical Features Hohe Stromdichte High current density Niederinduktives Design Low inductive design Mechanische Eigenschaften Mechanical Features Integrierter NTC Temperatur Sensor Integrated NTC temperature sensor PressFIT Verbindungstechnik PressFIT contact technology Robuste Montage durch integrierte Rugged mounting due to integrated mounting Befestigungsklammern clamps Module Label Code Barcode Code 128 Content of the Code Digit Module Serial Number 1 - 5 Module Material Number 6 - 11 Production Order Number 12 - 19 DMX - Code Datecode (Production Year) 20 - 21 Datecode (Production Week) 22 - 23 Datasheet Please read the Important Notice and Warnings at the end of this document V 2.3 www.infineon.com 2018-12-17DF11MR12W1M1 B11 Vorlufige Daten Preliminary Data MOSFET / MOSFET Hchstzulssige Werte / Maximum Rated Values Drain-Source-Spannung T = 25C V 1200 V vj DSS Drain-source voltage Drain-Gleichstrom Tvj = 175C, VGS = 15 V TH = 30C ID nom 50 A DC drain current Gepulster Drainstrom verifiziert durch Design, t p limitiert durch Tvjmax I 100 A D pulse Pulsed drain current verified by design, t limited by T p vjmax Gate-Source Spannung VGSS -10 / 20 V Gate-source voltage Charakteristische Werte / Characteristic Values min. typ. max. Einschaltwiderstand ID = 50 A Tvj = 25C 22,5 Drain-source on resistance V = 15 V T = 125C R 29,5 m GS vj DS on Tvj = 150C 33,0 Gate-Schwellenspannung ID = 20,0 mA, V DS = VGS , Tvj = 25C VGS(th) 3,45 4,50 5,55 V Gate threshold voltage (tested after 1ms pulse at V = +20 V) GS Gesamt Gateladung V = -5 V / 15 V, V = 800 V Q 0,124 C GS DS G Total gate charge Interner Gatewiderstand Tvj = 25C RGint 2,0 Internal gate resistor Eingangskapazitt f = 1 MHz, T = 25C vj C 3,68 nF iss Input capacitance VDS = 800 V, VGS = 0 V, VAC = 25 mV Ausgangskapazitt f = 1 MHz, T = 25C vj Coss 0,22 nF Output capacitance V = 800 V, V = 0 V, V = 25 mV DS GS AC Rckwirkungskapazitt f = 1 MHz, T = 25C vj C 0,028 nF rss Reverse transfer capacitance V = 800 V, V = 0 V, V = 25 mV DS GS AC C Speicherenergie T = 25C OSS vj Eoss 88,0 J C stored energy V = 800 V, V = -5 V / 15 V OSS DS GS Drain-Source-Reststrom V = 1200 V, V = -5 V T = 25C I 0,20 210 A DS GS vj DSS Zero gate voltage drain current Gate-Source-Reststrom V = 0 V V = 20 V 400 DS GS IGSS nA Gate-source leakage current Tvj = 25C VGS = -10 V Einschaltverzgerungszeit, induktive Last ID = 50 A, VDS = 600 V Tvj = 25C 10,0 Turn on delay time, inductive load V = -5 V / 15 V T = 125C t 10,0 ns GS vj d on R = 1,00 T = 150C 10,0 Gon vj Anstiegszeit, induktive Last ID = 50 A, VDS = 600 V Tvj = 25C 9,60 Rise time, inductive load V = -5 V / 15 V T = 125C t 9,60 ns GS vj r R = 1,00 T = 150C 9,60 Gon vj Abschaltverzgerungszeit, induktive Last ID = 50 A, VDS = 600 V Tvj = 25C 43,5 Turn off delay time, inductive load V = -5 V / 15 V T = 125C t 43,5 ns GS vj d off R = 1,00 T = 150C 43,5 Goff vj Fallzeit, induktive Last ID = 50 A, VDS = 600 V Tvj = 25C 12,0 Fall time, inductive load V = -5 V / 15 V T = 125C t 12,0 ns GS vj f R = 1,00 T = 150C 12,0 Goff vj Einschaltverlustenergie pro Puls ID = 50 A, VDS = 600 V, L = 35 nH Tvj = 25C 0,385 Turn-on energy loss per pulse di/dt = 11,0 kA/s (T = 150C) T = 125C E 0,385 mJ vj vj on V = -5 V / 15 V, R = 1,00 T = 150C 0,385 GS Gon vj Abschaltverlustenergie pro Puls ID = 50 A, VDS = 600 V, L = 35 nH Tvj = 25C 0,10 Turn-off energy loss per pulse du/dt = 55,0 kV/s (T = 150C) T = 125C E 0,10 mJ vj vj off V = -5 V / 15 V, R = 1,00 T = 150C 0,10 GS Goff vj Kurzschluverhalten VGS = -5 V / 15 V, VDD = 800 V tP 2 s, Tvj = 25C 420 A SC data V = V -L di/dt t 2 s, T = 150C I 410 A DSmax DSS sDS P vj SC R = 10,0 G Wrmewiderstand, Chip bis Khlkrper pro MOSFET / per MOSFET R 1,12 K/W thJH Thermal resistance, junction to heatsink Temperatur im Schaltbetrieb Tvj op -40 150 C Temperature under switching conditions Body Diode / Body diode Hchstzulssige Werte / Maximum Rated Values Body Diode-Gleichstrom T = 175C, V = -5 V T = 30C I 16 A vj GS H SD DC body diode forward current Charakteristische Werte / Characteristic Values min. typ. max. Durchlassspannung I = 50 A, V = -5 V T = 25C 4,60 5,65 SD GS vj Forward voltage I = 50 A, V = -5 V T = 125C V 4,35 V SD GS vj SD ISD = 50 A, VGS = -5 V Tvj = 150C 4,30 Datasheet 2 V 2.3 2018-12-17

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SP9
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