X-On Electronics has gained recognition as a prominent supplier of FS45MR12W1M1B11BOMA1 Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. FS45MR12W1M1B11BOMA1 Discrete Semiconductor Modules are a product manufactured by Infineon. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

FS45MR12W1M1B11BOMA1 Infineon

FS45MR12W1M1B11BOMA1 electronic component of Infineon
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Part No.FS45MR12W1M1B11BOMA1
Manufacturer: Infineon
Category: Discrete Semiconductor Modules
Description: Module; Uds:1.2kV; Id:25A; AG-EASY1BM-2; Ifsm:50A; screw
Datasheet: FS45MR12W1M1B11BOMA1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 149.162 ea
Line Total: USD 149.16 
Availability - 15
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
15
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 1
Multiples : 1
1 : USD 149.162
24 : USD 138.736

   
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Vf - Forward Voltage
Vr - Reverse Voltage
Vgs - Gate-Source Voltage
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We are delighted to provide the FS45MR12W1M1B11BOMA1 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FS45MR12W1M1B11BOMA1 and other electronic components in the Discrete Semiconductor Modules category and beyond.

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FS45MR12W1M1 B11 EasyPACK Modul mit CoolSiC Trench MOSFET und PressFIT / NTC EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC Vorlufige Daten / Preliminary Data V = 1200V DSS I = 25A / I = 50A D nom DRM Potentielle Anwendungen Potential Applications Anwendungen mit hohen Schaltfrequenzen High Frequency Switching application DC/DC Wandler DC/DC converter Motorantriebe Motor drives USV-Systeme UPS systems Elektrische Eigenschaften Electrical Features Niederinduktives Design Low inductive design Niedrige Schaltverluste Low switching losses Mechanische Eigenschaften Mechanical Features Integrierter NTC Temperatur Sensor Integrated NTC temperature sensor PressFIT Verbindungstechnik PressFIT contact technology Robuste Montage durch integrierte Rugged mounting due to integrated mounting Befestigungsklammern clamps Module Label Code Barcode Code 128 Content of the Code Digit Module Serial Number 1 - 5 Module Material Number 6 - 11 Production Order Number 12 - 19 DMX - Code Datecode (Production Year) 20 - 21 Datecode (Production Week) 22 - 23 Datasheet Please read the Important Notice and Warnings at the end of this document V 2.1 www.infineon.com 2020-03-27FS45MR12W1M1 B11 Vorlufige Daten Preliminary Data MOSFET / MOSFET Hchstzulssige Werte / Maximum Rated Values Drain-Source-Spannung T = 25C V 1200 V vj DSS Drain-source voltage Drain-Gleichstrom Tvj = 175C, VGS = 15 V TH = 75C ID nom 25 A DC drain current Gepulster Drainstrom verifiziert durch Design, t p limitiert durch Tvjmax I 50,0 A D pulse Pulsed drain current verified by design, t limited by T p vjmax Gate-Source Spannung VGSS -10 / 20 V Gate-source voltage Charakteristische Werte / Characteristic Values min. typ. max. Einschaltwiderstand ID = 25 A Tvj = 25C 45,0 Drain-source on resistance V = 15 V T = 125C R 59,0 m GS vj DS on Tvj = 150C 66,0 Gate-Schwellenspannung ID = 10,0 mA, V DS = VGS , Tvj = 25C VGS(th) 3,45 4,50 5,55 V Gate threshold voltage (tested after 1ms pulse at V = +20 V) GS Gesamt Gateladung V = -5 V / 15 V, V = 600 V Q 0,062 C GS DS G Total gate charge Interner Gatewiderstand Tvj = 25C RGint 4,0 Internal gate resistor Eingangskapazitt f = 1 MHz, T = 25C vj C 1,84 nF iss Input capacitance VDS = 800 V, VGS = 0 V, VAC = 25 mV Ausgangskapazitt f = 1 MHz, T = 25C vj Coss 0,11 nF Output capacitance V = 800 V, V = 0 V, V = 25 mV DS GS AC Rckwirkungskapazitt f = 1 MHz, T = 25C vj C 0,014 nF rss Reverse transfer capacitance V = 800 V, V = 0 V, V = 25 mV DS GS AC C Speicherenergie T = 25C OSS vj Eoss 44,0 J C stored energy V = 800 V, V = -5 V / 15 V OSS DS GS Drain-Source-Reststrom V = 1200 V, V = -5 V T = 25C I 0,10 120 A DS GS vj DSS Zero gate voltage drain current Gate-Source-Reststrom V = 0 V V = 20 V 400 DS GS IGSS nA Gate-source leakage current Tvj = 25C VGS = -10 V Einschaltverzgerungszeit, induktive Last ID = 25 A, VDS = 600 V Tvj = 25C 8,20 Turn on delay time, inductive load V = -5 V / 15 V T = 125C t 7,40 ns GS vj d on R = 1,00 T = 150C 7,40 Gon vj Anstiegszeit, induktive Last ID = 25 A, VDS = 600 V Tvj = 25C 6,30 Rise time, inductive load V = -5 V / 15 V T = 125C t 6,70 ns GS vj r R = 1,00 T = 150C 6,70 Gon vj Abschaltverzgerungszeit, induktive Last ID = 25 A, VDS = 600 V Tvj = 25C 35,2 Turn off delay time, inductive load V = -5 V / 15 V T = 125C t 38,9 ns GS vj d off R = 1,00 T = 150C 38,9 Goff vj Fallzeit, induktive Last ID = 25 A, VDS = 600 V Tvj = 25C 16,4 Fall time, inductive load V = -5 V / 15 V T = 125C t 16,4 ns GS vj f R = 1,00 T = 150C 16,4 Goff vj Einschaltverlustenergie pro Puls ID = 25 A, VDS = 600 V, L = 30 nH Tvj = 25C 0,30 Turn-on energy loss per pulse di/dt = 5,20 kA/s (T = 150C) T = 125C E 0,37 mJ vj vj on V = -5 V / 15 V, R = 1,00 T = 150C 0,37 GS Gon vj Abschaltverlustenergie pro Puls ID = 25 A, VDS = 600 V, L = 30 nH Tvj = 25C 0,033 Turn-off energy loss per pulse du/dt = 41,6 kV/s (T = 150C) T = 125C E 0,035 mJ vj vj off V = -5 V / 15 V, R = 1,00 T = 150C 0,035 GS Goff vj Kurzschluverhalten VGS = -5 V / 15 V, VDD = 800 V tP 2 s, Tvj = 25C 210 A SC data V = V -L di/dt t 2 s, T = 150C I 205 A DSmax DSS sDS P vj SC R = 10,0 G Wrmewiderstand, Chip bis Khlkrper pro MOSFET / per MOSFET R 1,54 K/W thJH Thermal resistance, junction to heatsink Temperatur im Schaltbetrieb Tvj op -40 150 C Temperature under switching conditions Body Diode / Body diode Hchstzulssige Werte / Maximum Rated Values Body Diode-Gleichstrom T = 175C, V = -5 V T = 75C I 8 A vj GS H SD DC body diode forward current Charakteristische Werte / Characteristic Values min. typ. max. Durchlassspannung I = 25 A, V = -5 V T = 25C 4,60 5,65 SD GS vj Forward voltage I = 25 A, V = -5 V T = 125C V 4,35 V SD GS vj SD ISD = 25 A, VGS = -5 V Tvj = 150C 4,30 Datasheet 2 V 2.1 2020-03-27

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