IDD09E60 Fast Switching Emitter Controlled Diode Product Summary V RRM 600 V I 9 A F V 1.5 V F T 175 C Feature jmax 600V Emitter Controlled technology Fast recovery Soft switching Low reverse recovery charge Low forward voltage 175C operating temperature Easy paralleling Type Package Ordering Code Marking Pin 1 PIN 2,4 PIN 3 - NC C A IDD09E60 PG-TO252-3 D09E60 Maximum Ratings, at T = 25 C, unless otherwise specified j PParameterarameter SymbolSymbol ValueValue UnUnitit Repetitive peak reverse voltage V 600 V Repetitive peak reverse voltage V 600 V RRM R R M Continous forward current I A Continuous forward current F 19.3 T = 25C I A T =25C 19.3 C F C 13 T = 90C C T =90C 13 C Surge non repetitive forward current Surge non repetitive forward current I 40 I 40 A FSMF S M T = 25C, t = 10 ms, sine halfwave C p T =25C, t =10 ms, sine halfwave C p Maximum repetitive forward current I 29.5 A F R M Maximum repetitive forward current I 29.5 FRM T = 25C, t limited by t , D = 0.5 C p j,max T =25C, t limited by T , D=0.5 C p jmax Power dissipation W Power dissipation P 57.7 T = 25C P W C tot t o t 32.7 T = 90C T =25C 57.7 C C Operating junction temperature T - 40+ 17 5 T =90C 32.7 j C Storage temperature T -55...+150 s t g -55...+175 C Operating and storage temperature T , T j stg C Soldering temperature Soldering temperature T 260 C S T 260 S 1.6mm (0.063 in.) from case for 10 s reflow soldering, MSL3 Rev. 2.4 Page 1 20131205IDD09E60 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics - - 2.6 K/W Thermal resistance, junction - case R thJC SMD version, device on PCB: R thJA min. footprint - - 75 2 1) 6 cm cooling area - - 50 Electrical Characteristics, at T = 25 C, unless otherwise specified j Parameter Symbol Values Unit min. typ. max. Static Characteristics Reverse leakage current I A R V =600V, T =25C - - 50 R j V =600V, T =150C - - 750 R j Forward voltage drop V V F I =9A, T =25C - 1.5 2 F j I =9A, T =150C - 1.5 - F j 1 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Rev. 2.4 Page 2 20131205