X-On Electronics has gained recognition as a prominent supplier of IRG6B330UDPBF IGBT Transistors across the USA, India, Europe, Australia, and various other global locations. IRG6B330UDPBF IGBT Transistors are a product manufactured by Infineon. We provide cost-effective solutions for IGBT Transistors, ensuring timely deliveries around the world.

IRG6B330UDPBF Infineon

IRG6B330UDPBF electronic component of Infineon
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Part No.IRG6B330UDPBF
Manufacturer: Infineon
Category: IGBT Transistors
Description: International Rectifier IGBT Transistors
Datasheet: IRG6B330UDPBF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
20: USD 2.0312 ea
Line Total: USD 40.62 
Availability - 40
Ship by Tue. 03 Dec to Mon. 09 Dec
MOQ: 20  Multiples: 1
Pack Size: 1
Availability Price Quantity
3007
Ship by Tue. 03 Dec to Mon. 09 Dec
MOQ : 141
Multiples : 1
141 : USD 3.4775
500 : USD 3.3313
1000 : USD 3.1525

40
Ship by Tue. 03 Dec to Mon. 09 Dec
MOQ : 20
Multiples : 1
20 : USD 2.0312

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Maximum Gate Emitter Voltage
Continuous Collector Current at 25 C
Gate-Emitter Leakage Current
Package / Case
Packaging
Technology
Mounting Style
Technology
Pd - Power Dissipation
Minimum Operating Temperature
Maximum Operating Temperature
Continuous Collector Current Ic Max
Brand
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
Taric
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the IRG6B330UDPBF from our IGBT Transistors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IRG6B330UDPBF and other electronic components in the IGBT Transistors category and beyond.

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IRG6B330UDPbF Key Parameters Features V min 330 V Advanced Trench IGBT Technology CE Optimized for Sustain and Energy Recovery V typ. I = 70A 1.69 V CE(ON) C Circuits in PDP Applications I max T = 25C 250 A RP C TM Low V and Energy per Pulse (E ) CE(on) PULSE T max 150 C J for Improved Panel Efficiency High Repetitive Peak Current Capability C Lead Free Package E C G G E TO-220AB n-channel GC E Gate Collector Emitter Description This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced TM trench IGBT technology to achieve low V and low E rating per silicon area which improve panel CE(on) PULSE efficiency. Additional features are 150C operating junction temperature and high repetitive peak current capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP applications. Absolute Maximum Ratings Parameter Max. Units V Gate-to-Emitter Voltage 30 V GE I T = 25C Continuous Collector Current, V 15V 70 A C C GE I T = 100C Continuous Collector, V 15V 40 C C GE I T = 25C Repetitive Peak Current 250 RP C P T = 25C Power Dissipation 160 W D C P T = 100C Power Dissipation 63 D C Linear Derating Factor 1.3 W/C T Operating Junction and -40 to + 150 C J T Storage Temperature Range STG Soldering Temperature for 10 seconds 300 10lb in (1.1N m) Mounting Torque, 6-32 or M3 Screw N Thermal Resistance Parameter Typ. Max. Units R (IGBT) Thermal Resistance Junction-to-Case-(each IGBT) 0.80 JC R (Diode) Thermal Resistance Junction-to-Case-(each Diode) 1.6 2.4 JC R Case-to-Sink (flat, greased surface) 0.24 C/W CS R Junction-to-Ambient (typical socket mount) 40 JA Weight 6.0 (0.21)g (oz) www.irf.com 1 4/20/10 Electrical Characteristics T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions V = 0V, I = 1 mA BV Collector-to-Emitter Breakdown Voltage 330 V CES GE CE Reference to 25C, I = 1mA V /T Breakdown Voltage Temp. Coefficient 0.34 V/C CES J CE V = 15V, I = 25A 1.18 1.48 GE CE V = 15V, I = 40A 1.36 1.68 GE CE V V = 15V, I = 70A CE(on) Static Collector-to-Emitter Voltage 1.69 2.09 V GE CE V = 15V, I = 120A 2.26 2.76 GE CE V = 15V, I = 70A, T = 150C 1.93 GE CE J V V = V , I = 500A Gate Threshold Voltage 2.6 5.0 V CE GE CE GE(th) V /T Gate Threshold Voltage Coefficient -11 mV/C GE(th) J I V = 330V, V = 0V Collector-to-Emitter Leakage Current 2.0 25 A CE GE CES V = 330V, V = 0V, T = 100C 5.0 CE GE J V = 330V, V = 0V, T = 150C 100 CE GE J V = 30V I Gate-to-Emitter Forward Leakage 100 nA GES GE V = -30V Gate-to-Emitter Reverse Leakage -100 GE V = 25V, I = 25A g Forward Transconductance 50 S fe CE CE V = 200V, I = 25A, V = 15V Q Total Gate Charge 85 nC g CE C GE Q Gate-to-Collector Charge 31 gc t Turn-On delay time 47 I = 25A, V = 196V d(on) C CC t Rise time 37 ns R = 10, L=200H, L = 200nH r G S t Turn-Off delay time 176 T = 25C d(off) J t Fall time 99 f t Turn-On delay time 45 I = 25A, V = 196V d(on) C CC t Rise time 38 ns R = 10, L=200H, L = 200nH r G S t Turn-Off delay time 228 T = 150C d(off) J t Fall time 183 f t Shoot Through Blocking Time 100 ns V = 240V, V = 15V, R = 5.1 st CC GE G L = 220nH, C= 0.40F, V = 15V GE 834 , E Energy per Pulse J V = 240V, R = 5.1 T = 25C PULSE CC G J L = 220nH, C= 0.40F, V = 15V GE 985 V = 240V, R = 5.1, T = 100C CC G J V = 0V C Input Capacitance 2297 GE iss C V = 30V Output Capacitance 141 pF CE oss C = 1.0MHz, See Fig.13 Reverse Transfer Capacitance 74 rss L Internal Collector Inductance 5.0 Between lead, C nH 6mm (0.25in.) L Internal Emitter Inductance 13 from package E and center of die contact Diode Characteristics T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions I Average Forward Current at F(AV) 8.0 A T =155C C I T = 155C, PW = 6.0ms half sine wave Non Repetitive Peak Surge Current 100 A FSM J I = 8A V Forward Voltage 1.19 1.3 V F F I = 8A, T = 150C 0.94 1.0 F J t I = 1A, di/dt = -50A/s, V =30V Reverse Recovery Time 35 60 ns F R rr T = 25C 43 J T = 125C I = 8A 67 J F Q Reverse Recovery Charge 60 nC T = 25C rr J di/dt = 200A/s T = 125C V = 200V 210 J R I T = 25C rr Peak Recovery Current 2.8 A J 6.3 T = 125C J Pulse width 400s duty cycle 2%. Half sine wave with duty cycle = 0.1, ton=2sec. R is measured at T of approximately 90C. J 2 www.irf.com

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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