82563EB/82564EB Gigabit Platform LAN Connect Networking Silicon Datasheet Product Features IEEE 802.3ab compliant Allows PHY placement proximity to I/O back panel. Robust operation over the installed base of Category-5 (Cat-5) twisted pair cabling 7 LED outputs per port (4 configurable plus 3 dedicated) PICMG 3.1 compliant Link and Activity indications (10, 100, Robust operation in backplane over 1000 Mb/s) on each port Ethernet applications. Clock supplied to the 631xESB/632xESB Support for cable line lengths greater than 100 m (spec) 123 m physical Cost optimized design Robust end to end connections over Full chip power down various cable lengths Support for lowest power state Full duplex at 10, 100, or 1000 Mb/s and half 100 pin TQFP Package duplex at 10 or 100 Mb/s. Smaller footprint and lower power IEEE 802.3ab Auto-negotiation with Next dissipation compared to multi-chip MAC Page support and PHY solutions Automatic link configuration including Operating temperature: 0C to 60 C speed, duplex, and flow control (maximum) heat sink or forced airflow not 10/100 downshift required Automatic link speed adjustment with Simple thermal design poor quality cable Power Consumption: < 1.0 Watts per port Automatic MDI crossover (silicon power) Helps to correct for infrastructure issues Minimize impact of incorporating dual Gigabit instead of Fast Ethernet Advanced Cable Diagnostics a Leaded and lead-free 100-pin TQFL with an Improved end-user troubleshooting Exposed-Pad*. Devices that are lead-free are Kumeran interface marked with a circled e3 and have a Low pin count, high speed interface to the product code: HYXXXXX Intel 631xESB/632xESB I/O Controller Hub a.This device is lead-free. That is, lead has not been intentionally added, but lead may still exist as an impurity at <1000 ppm. The Material Declaration Data Sheet, which includes lead impurity levels and the concentration of other Restriction on Hazard- ous Substances (RoHS) -banned materials, is available at: ftp://download.intel.com/design/packtech/material content IC Pack In addition, this device has been tested and conforms to the same parametric specifications as previous versions of the device. For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales representative. 316534-004 Revision 2.982563EB/82564EB Gigabit Platform LAN Connect Networking Silicon Revision History Date Revision Comments Nov 2007 2.9 Updated Tables 19, 20, 23, and 24. Updated Figures 5 and 6. Oct 2007 2.8 Updated Table 16 Recommended Operating Conditions. April 2007 2.7 Updated Section 4.2, Table 16 Core Digital Voltage Range. Feb 2007 2.6 Updated Table 6. May 2006 2.5 Initial public release. April 2006 2.1 Removed Preliminary from section 4.9 Power Consumption. Updated 1.9V external power supply parameters in Tables 16 and 19. Nov 2005 2.0 Initial release (Intel Confidential). Aug 2005 1.75 Added lead-free information. Added measured power consumption values. Updated crystal specifications (drive level now 750 W). Changed 1.8V power rail references to 1.9V. Dec 2004 1.0 Major revisions in all sections. Sep 2004 0.70 Added power sequencing. Jul 2004 0.51 Changed pin 51 (page13) from AVDD (1.8V) to AVDDR (3.3V). May 2004 0.5 Initial release (Intel Secret). Legal Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions markedreserve orundefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The 82563EB/82564EB Gigabit Platform LAN Connects discussed in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708- 296-9333. Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright Intel Corporation, 2007 ii