X-On Electronics has gained recognition as a prominent supplier of IS61LF51236A-7.5TQLI SRAM across the USA, India, Europe, Australia, and various other global locations. IS61LF51236A-7.5TQLI SRAM are a product manufactured by ISSI. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

IS61LF51236A-7.5TQLI ISSI

IS61LF51236A-7.5TQLI electronic component of ISSI
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Part No.IS61LF51236A-7.5TQLI
Manufacturer: ISSI
Category: SRAM
Description: ISSI SRAM 18Mb 512Kx36 7.5ns Sync SRAM 3.3v
Datasheet: IS61LF51236A-7.5TQLI Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 22.737 ea
Line Total: USD 22.74 
Availability - 25
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
25
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ : 1
Multiples : 1
1 : USD 22.737
10 : USD 21.538
25 : USD 21.307
50 : USD 20.878
72 : USD 18.238
288 : USD 18.238
504 : USD 18.238
2520 : USD 18.238

   
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We are delighted to provide the IS61LF51236A-7.5TQLI from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IS61LF51236A-7.5TQLI and other electronic components in the SRAM category and beyond.

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IS61LF25672A IS61VF25672A IS61LF51236A IS61VF51236A IS61LF102418A IS61VF102418A 256K x 72, 512K x 36, 1024K x 18 18Mb SYNCHRONOUS FLOW-THROUGH JULY 2010 STATIC RAM DESCRIPTION FEATURES The ISSI IS61LF/VF25672A, IS61LF/VF51236A and Internal self-timed write cycle IS61LF/VF102418A are high-speed, low-power synchro- Individual Byte Write Control and Global Write nous static RAMs designed to provide burstable, high- performance memory for communication and networking Clock controlled, registered address, data and applications. The IS61LF/VF25672A is organized as control 262,144 words by 72 bits. The IS61LF/VF51236A is orga- Burst sequence control using MODE input nized as 524,288 words by 36 bits. The IS61LF/VF102418A is organized as 1,048,576 words by 18 bits. Fabricated Three chip enable option for simple depth expan- with ISSI s advanced CMOS technology, the device inte- sion and address pipelining grates a 2-bit burst counter, high-speed SRAM core, and high-drive capability outputs into a single monolithic cir- Common data inputs and data outputs cuit. All synchronous inputs pass through registers con- Auto Power-down during deselect trolled by a positive-edge-triggered single clock input. Single cycle deselect Write cycles are internally self-timed and are initiated by the rising edge of the clock input. Write cycles can be one Snooze MODE for reduced-power standby to four bytes wide as controlled by the write control inputs. JTAG Boundary Scan for PBGA package Separate byte enables allow individual bytes to be written. Byte write operation is performed by using byte write Power Supply enable (BWE) input combined with one or more individual LF: VDD 3.3V + 5%, VDDQ 3.3V/2.5V + 5% byte write signals (BWx). In addition, Global Write (GW) is available for writing all bytes at one time, regardless of the VF: VDD 2.5V + 5%, VDDQ 2.5V + 5% byte write controls. JEDEC 100-Pin TQFP, 119-pin PBGA, 209-Ball Bursts can be initiated with either ADSP (Address Status PBGA and 165-pin PBGA packages. Processor) or ADSC (Address Status Cache Controller) input pins. Subsequent burst addresses can be generated Lead-free available internally and controlled by the ADV (burst address ad- vance) input pin. The mode pin is used to select the burst sequence order, Linear burst is achieved when this pin is tied LOW. Interleave burst is achieved when this pin is tied HIGH or left floating. FAST ACCESS TIME Symbol Parameter -6.5 -7.5 Units tKQ Clock Access Time 6.5 7.5 ns tKC Cycle Time 7.5 8.5 ns Frequency 133 117 MHz Copyright 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized b.) the user assume all such risks and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. 1 Rev. K 07/29/2010IS61LF25672A IS61LF51236A IS61LF102418A IS61VF25672A IS61VF51236A IS61VF102418A BLOCK DIAGRAM MODE A0 Q0 CLK CLK A0 BINARY COUNTER A1 Q1 ADV CE A1 256Kx72 ADSC 512Kx36 CLR ADSP 1024Kx18 MEMORY ARRAY 19/20 17/18 19/20 D Q A ADDRESS REGISTER CE CLK 36,18 36,18 or 72 or 72 GW D Q DQ(a-d) BWE BYTE WRITE BW(a-h) REGISTERS x18: a,b x36: a-d CLK x72: a-h 36,18 CE 2/4/8 or 72 INPUT CE2 D Q REGISTERS DQa - DQd CE2 ENABLE OE REGISTER CLK CE CLK POWER ZZ DOWN OE 2 Integrated Silicon Solution, Inc. Rev. K 07/29/2010

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
Integrated Silicon Solution ()
Integrated Silicon Solution (ISSI)
INTEGRATED SILICON SOLUTIONS INC
ISSI
ISSI(Integrated Silicon Solution)
ISSI, Integrated Silicon Solution Inc
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